MAINTENANCE MANUAL GE TRUNKING CARD 1e 19D903536P1

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1 A MAINTENANCE MANUAL GE TRUNKING CARD 1e 19D903536P1 TABLE OF CONTENTS Page SPECIFICATIONS INTRODUCTION CONNECTOR CHART MEMORY MAP CIRCUIT ANALYSIS BLOCK DIAGRAM DS2250 MICROPROCESSOR DUAL PORT RAM ON BOARD RAM U12 AND U OSCILLATOR RESET LOAD/RUN RS-232 INTERFACE BIT I/O LED INDICATORS TROUBLESHOOTING PROGRAMMING INSTRUCTIONS LOADING 344A4414G1 SOFTWARE INTO THE GETC 1e MODULE REQUIRED ITEMS PREPARATION LOADING PROCEDURE ERRORS SERIAL NUMBERING PARTS LIST IC DATA HARNESS ASSEMBLY DIAGRAM INSTALLATION INSTRUCTIONS OUTLINE DIAGRAMS: HARNESS GETC 1e SCHEMATIC DIAGRAM Printed in U.S.A.

2 SPECIFICATIONS MEMORY MAP Current Drain Supply Voltage Memory Provided (bytes) 80 to 120 ma. 4.75VDC to 5.25VDC 64K on board, not backed up. 128K in the DS2250 s, battery backed up. 8K Dual Port RS-232 Serial Ports 2 I/O 2 bits input - Diode protected, weakly pulled up inverted before processor 2 bits output - Transistor buffered, weakly pulled up open collector. Oscillator frequency Indicators Dimensions MHz One RED LED controlled by each DS in. x 7.75in. (board) INTRODUCTION The GETC 1e (expansion) module (19D903536P1) provides additional processing power memory for the General Eectric Trunking Card (GETC) which will allow software growth, exped features for the Enhanced Digital Access Communication System (EDACS ). The 1e module is supplied stard with EDACS station GETC s, Downlink GETC s, CNI GETC s, SCAT GETC s, EDACS Site Controller GETC s, Simulcast Control GETC s, EDACS Satellite Receiver GETC s beginning in January The 1e module is not required, but is compatible with all previous hardware software releases. The 1e module uses mostly surface mount components mounts on spacers above the GETC. Electrical connections to the GETC are made by removing U3 from the GETC plugging the 1e modules 28 pin ribbon cable connector P1 into the GETC s socket XU3. A small shield above the 1e module protects it from damage when sliding the GETC drawer in out. Connector P1 J1 J2 J3 J4 J5 CONNECTOR CHART Description 1e module interface to the GETC address/data bus power Allow serial interface to U2 at TTL levels RS-232 serial interface to U1 RS-232 serial interface to U2 I/O on U1 I/O on U2 CIRCUIT ANALYSIS BLOCK DIAGRAM The 1e module consists of two almost independent microprocessor (µp) sections (See Figure 2). The heart of each section is a DS2250 microprocessor, U1 or U2. In addition to its internal memory, each µp has a 32K byte external RAM, U12 or U13. Each section also contains a 4K byte dual port RAM (DPR), U3 or U4, which provides the interface to the GETC. A single oscillator, U14 provides clock for both processors. Each processor has a serial port which is converted to RS-232 by U8. Indicator LED s D1 D2 are activated by one-shots in U9 as long as they are triggered by the associated processor. A single input bit a single output bit are available on each processor for I/O. The module has a single RESET button which resets both processors. LOAD/RUN circuits on each processor set operating mode. Port 1 INT0 of both processors are tied together to provide a high speed parallel communication link between the two processors. Figure 1 - Memory Map For Each DS2250 DS2250 MICROPROCESSOR The microprocessor is a Dallas Semiconductor proprietary derivative of the Intel This special version processor has internal circuitry for a bootstrap loader, terminal interface internal control of 64K bytes of battery backed up RAM. The RAM can be partitioned into separate code data spaces, with the code space write protected after code is loaded. An internal bit ECE2 under program control alters the memory map allowing access to all available memory. DUAL PORT RAM U3 U4 provide the interface to the GETC 8032 processor. The GETC sees U3 U4 as a single 8K byte memory block, addressed from 0 to 1FFFH. U1 sees U3 on its opposite port as a 4K byte RAM addressed from 0 to 0FFFH likewise, U2 sees U4 as a 4K byte RAM addressed from 0 to 0FFFH. Thus each 1e processor shares 4K bytes of memory space with the GETC processor, allowing efficient exchange of data. U11-D U10-D drive the output enable (read) input from the GETC. U10-A, B, C U11-A B drive DPR chip enables from the GETC. Copyright January 1993, Ericsson GE Mobile Communications Inc. 1

3 ON BOARD RAM U12 AND U13 When ECE2 is 0, each processor accesses a 32K RAM at address 8000H to 0FFFFH. These RAM s are on the 1e module board, not on the DS2250, thus they are not backed up by the DS2250 battery. This memory space is used as temporary scratch pad by the processors. U10-E U10-F drive the RAM CE (chip enable) pin from bit 15 of the address bus. A low enables the RAM. OSCILLATOR U14 is an unbuffered CMOS inverter (HCU04). Here, U14-A functions as a linear gain stage with crystal Y1 in its feedback, forming an oscillator at MHz. U14-B buffers the clock drives both processors. RESET Switch S1 resets the 1e module S4 on the GETC resets the GETC. Software will usually start properly with only a GETC reset, however resetting both will work. Depressing switch S1 grounds R21 R22 the positive side of C21. This turns on PNP transistors Q4 Q7 which pulls the RESET input of each processor high, holding them in the RESET condition. When S1 is released, the voltage at C21+ ( Q4 Q7 bases) slowly rises as C21 charges through R8 R15. Eventually this voltage rises high enough so Q4 Q7 turn off the processor RESET inputs fall low are held low by R7 R14. R8 R15 hold Q4 Q7 off. LOAD/RUN CIRCUIT In normal RUN mode, the processors RESET input is held low PSEN is an output which controls external memory. The DS2250 is put into LOAD mode by holding the RESET pin high the PSEN pin low. Switch S2 controls RUN/LOAD for processor U1. When S2 is down (toward S1) (shorting pins 2 3) U1 is in LOAD mode. VCC (5V) is applied to R10 R12. This turns on Q8 which turns on Q7 through R9 thus pulling U1 s RESET high. VCC on R12 turns on Q6 which holds PSEN low. When S2 is up (shorting pins 1 2) the processor is in RUN mode. VCC is not applied to R10 R12. Q8 is held off by R11 Q7 is held off by R8 so RESET is pulled low by R7. Q6 is held off by R13 so PSEN is not held low may become an output of U1. Switch S3 controls RUN/LOAD for processor U2. When S3 is down (shorting pins 2 3) U2 is in LOAD mode. VCC (5V) is applied to R17 R19. This turns on Q5 which turns on Q4 through R16 thus pulling U2 s RESET high. VCC on R19 turns on Q3 which holds PSEN low. When S3 is up (shorting pins 1 2) the processor is in RUN mode. VCC is not applied to R17 R19. Q5 is held off by R18 Q4 is held off by R15 so RESET is pulled low by R14. Q3 is held off by R20 so PSEN is not held low may become an output of U2. RS-232 INTERFACE The RS-232 interfaces are used to program the DS2250 modules to interface to other serial devices (future applications). An Intel Hex format file from a PC can be loaded into memory via the serial ports. Complete instructions will accompany software loaded in the field. U8 is a dual TTL to RS-232 duplex serial interface. Capacitors C1, C2, C3, C4 are used by U8 to convert 5V to RS-232 levels. Section 1 converts U1 s serial port to RS-232 section 2 converts U2 s serial port to RS-232. Serial output for U1 is J2-1 input is J2-2. Serial output for U2 is J3-1 input is J3-2. J1 is inserted in the RXD line of U2 to allow interfacing to U2 s serial port at TTL levels. BIT I/O One output bit from U1 is available. It is buffered by Q9 drives out on J4-2. Weak pullup R30 holds J4-2 high when Q9 is turned off by U1. One input bit to U1 is available. It is buffered by U15-A protected from static overdrive by D3 R27. Weak pullup R35 holds the input high when not in use. One output bit from U2 is available. It is buffered by Q10 drives out on J5-2. Weak pullup R32 holds J5-2 high when Q9 is turned off by U1. One input bit to U2 is available. It is buffered by U15-B protected from static overdrive by D4 R31. Weak pullup R36 holds the input high when not in use. Figure 2 - GETC 1e Block Diagram 2

4 LED INDICATORS LED D1 is controlled by processor U1. The processor must apply pulses to retriggerable one-shot U9-A, pin 4, about every half second or faster to keep the light on. It is used as a visual indication that the software is running. The pulse on U9-4 retriggers the output on U9-6 keeping Q1 on LED D1 on. If the pulses don t appear in time, the one-shot times out U9-6 falls low turning off Q1 D1. R1 C17 determine the drop out time. LED D2 is controlled by processor U2. The processor must apply pulses to retriggerable one-shot U9-B, pin 12, about every half second or faster to keep the light on. It is used as a visual indication that the software is running. The pulse on U9-12 retriggers the output on U9-10 keeping Q2 on LED D2 on. If the pulses don t appear in time, the one-shot times out U9-10 falls low turning off Q2 D2. R4 C18 determine the drop out time. PROGRAMMING INSTRUCTIONS LOADING 344A4414G1 SOFTWARE INTO THE GETC 1e MODULE REQUIRED ITEMS IBM compatible PC, monitor keyboard with at least 640K memory, Hard disk (recommended but not required) serial port (COM1) TQ-3360 programming cable DB-25 male to DB-9 female adapter or cable (needed if PC COM1 connector is DB-9 male instead of DB- 25 male) Software Distribution diskette 344A4414G1 LOADING PROCEDURE 1. Connect loader cable TQ-3360 from COM1 on the PC to J104 at rear of GETC. A DB-25 male to DB-9 female adapter or cable may be required. 2. Move S2 S3 on the 1e module toward the front. If either switch is already positioned to the front, move it to the rear then back to the front. 3. Execute program LOAD1E follow its instructions. You will be kept informed of execution steps. After the top processor is loaded, move the programming cable to J103, then hit a key to load the bottom processor. 4. When both processors are loaded correctly, the screen will say "FINISHED - SWITCH S2 AND S3 TO THE REAR". Do so D1 D2 should come on to indicate code is executing. Unplug the programming cable. "Illegal serial number" - Serial number is either invalid, was never programmed, or has been erased. *******END OF PROGRAMMING SPEC******* SERIAL NUMBERING Each DS-2250 contains a unique serial number. To avoid loading software to the wrong DS-2250, the loader program, 1eload.exe, uses these serial numbers to check cabling during programming. GETC code will check DS serial numbers will not operate if serial numbers are in the wrong location or if the two serial numbers do not compare correctly. Do not swap DS-2250 stiks in a 1e module or take one DS-2250 from a 1e put it in another 1e. It is permissible to swap DS-2250 s as pairs if the top bottom positions are maintained. TROUBLESHOOTING PREPARATION ERRORS Very little troubleshooting is possible in the field. Problems may be traced to the 1e module by substituting another 1e module. If it is not known that the substitute module has correct software, either load correct software into it or take the DS2250 modules out of the suspect 1e put them into the new 1e. If DS2250 modules are substituted, be sure to put U1 from the old 1e into XU1 of the new 1e likewise for U2. The two processors will generally contain different software. If problems can be traced to the 1e module, here are some things to look for. Visually check for damaged parts, unsoldered pins or parts, broken cable or pins (P1), or unseated DS2250 modules. Look for trash in the SIMM sockets. A magnifying glass or low power microscope is helpful. Make sure S2 S3 are positioned toward the rear of the GETC in the RUN condition. Make sure the jumper is on J1-1 to 2. Check for 5V 0.25V at C5+. With a high speed, high impedance scope, check for oscillations at U14-4. A somewhat flattened sine wave of about 4V amplitude at Mhz will be seen. Before loading can begin, the files listed below must exist on the PC used as the loader. Create a new directory, for instance, "LOAD1e" with the comm "MKDIR LOAD1E". Then change into that directory copy the following files from the distribution diskette. load1e.exe 1etop.hex 1ebot.hex 1ecrc.hex Always change to this directory before loading software to 1e modules. The executable file "load1e.exe" loads the file "1etop.hex" into the top processor on the 1e module. This processor is physically in the rear as viewed from the front of the GETC it accesses the top half of GETC RAM memory space (1000-1FFF). It is loaded through J2 J104. Then "load1e.exe" loads file "1ebot.hex" into the bottom processor on the 1e module. This processor is physically in the front, accesses the bottom half of GETC memory (0-FFF) is serially loaded through J3 J103. The loader uses file "1ecrc.hex" to check that the file was loaded correctly. This procedure assumes loading will occur after the ie module is mounted in a GETC installed in an EDACS station. Errors usually mean communications have been lost between the PC the 1e module. If errors occur, check cables, plugs, move S2 S3 to the rear then back toward the front. Error 1 Did not receive signon banner from DS Error 2 Did not receive CR-LF from DS Error 3 Did not receive prompt from DS Error 4 Did not receive CRC value from DS Error 5 Did not receive serial number from DS "Cannot open COM1" - COM1 on the PC is non-existent or in use by other software or hardware. A PC re-configuration is required. "Cannot open filename " - Be sure file exists in the appropriate directory. "BAD CRC" - A CRC error means that after loading, memory contents are incorrect or the wrong 1ecrc.hex file was used. If 1ecrc.hex is the same version shipped with the software, a 1e module hardware problem is indicated. "Wrong serial number-check cables" - If cabling is correct, DS-2250 stiks may have been swapped. The four byte serial number is printed to the screen to help in restoring DS-2250 s to their proper locations. The four byte serial numbers must be the same for both DS-2250 s except that the least significant byte must be an odd number for the top DS-2250 exactly one less for the bottom DS

5 PARTS LIST GETC 1e MODULE 19D903536P1 (344A3912G1, Rev. 0) Issue 1 SYMBOL PART NUMBER DESCRIPTION CAPACITORS C1 19A705205P21 Tantalum: 22 µf ±20%, 20 VDCW. C5 C 619A702052P14 Ceramic:.01 µf ±10%, 50 VDCW. C24 C17 19A705205P19 Tantalum: 2.2 µf ±20%, 10 VDCW. C18 C19 19A702061P35 Ceramic: 30 pf ±5%, 50VDCW. C20 C21 19A705205P2 Tantalum: 1 µf ±20%, 16 VDCW. DIODES D1 HP HSMS-T400 LED D2 D3 19A700053P2 Silicon: 2Diode, Fast Recovery, 250 ma, 70 PIV. D4 J Pin; Molex J5 J Pin; Molex J9 JACKS PLUGS P1 19B802001P1 Header, 14X2; Samtec Special SEP /01 TRANSISTORS Q1 19A700076P2 Transistor; NPN, 3904 Q3, Q5 Q6, Q8 Q10 Q4 19A700059P2 Transistor; PNP, 3906 Q7 SYMBOL PART NUMBER DESCRIPTION RESISTORS R1 19B800607P473 Metal Film: 47k ohms ±5%, 1/8 w. R2 19B800607P103 Metal Film: 10k ohms ±5, 1/8 w. R3 19B800607P102 Metal Film: 270 ohms ±5%, 1/8 w. R4 19B800607P473 Metal Film: 47k ohms ±5%, 1/8 w. R5 19B800607P103 Metal Film: 10k ohms ±5%, 1/8 w. R6 19B800607P271 Metal Film: 270 ohms ±5%, 1/8 w. R7 19B800607P102 Metal Film: 1k ohms ±5%, 1/8 w. R8 19B800607P103 Metal Film: 10k ohms ±5%, 1/8 w. R13 R14 19B800607P102 Metal Film: 1k ohms ±5%, 1/8 w. R15 19B800607P103 Metal Film: 10k ohms ±5%, 1/8 w. R22 R23 19B800607P105 Metal Film: 1M ohm ±5%, 1/8 w. R24 19B800607P102 Metal Film: 1k ohms ±5%, 1/8 w. R25 19B800607P104 Metal Film: 100k ohms ±5%, 1/8 w. R26 R27 19B800607P101 Metal Film: 100 ohms ±5%, 1/8 w. R28 19B800607P103 Metal Film: 10k ohms ±5%, 1/8 w. R29 R30 19B800607P104 Metal Film: 100k ohms ±5%, 1/8 w. R31 19B800607P101 Metal Film: 100 ohms ±5%, 1/8 w. R32 19B800607P104 Metal Film: 100k ohms ±5%, 1/8 w. R33 19B800607P103 Metal Film: 10k ohms ±5%, 1/8 w. R34 R35 19B800607P104 Metal Film: 100k ohms 5%, 1/8 w. R36 SWITCHES S1 19A701324P1 SW, PUSHBUTTON. S2 ALCO SE1DGPC SW, 2 Position Slide. S3 INTEGRATED CIRCUITS U1 DS Microcontroller SipStik. U2 U3 IDT 7134S70J CMOS Dual-Port RAM, 32k (4kX8-Bit). U4 U5 19A703471P318 Octal 3-State Noninverting Transparent Latch, 74HC573. U6 U8 19A149446P2 RS-232 Drivers/Receivers, MAX232A. U9 MC514538BDW Multivibrator (Retriggerable, Resettable). U10 19A703483P304 Hex Inverter, 74HC04A U11 19A703483P302 Quad 2-Input NAND Gate, 74HC00. SYMBOL PART NUMBER DESCRIPTION U12 19A705981P101 Static RAM (SRAM), HM62256A. U13 U14 19A703995P2 Hex Unbuffered Inverter, 74HCU04. U15 19A703483P321 Hex Schmitt-Trigger Inverter, 74HC14. Y1 19A702511G MHz. XU1 AMP SIMM Socket. XU2 CRYSTALS SOCKETS JUMPERS P2 19A702104P1 Jumper. BIVAR CI Insulator (Under Y1). XETEL Printed Wire Board. MISCELLANEOUS HARDWARE KIT 344A4019G1 (1e Installation) 1 19B802166P1 Guard 3 19B201955P9 SPC, Thread 4 N84P13004B6 Screw, Machine 5 19A701365P8 Washer 6 N80P13004B6 Screw, machine: Pan head; No x 1/4". 7 N404P13B6 Lockwasher, internal tooth: No P25 Washer, Fiber. 9 19J706152P5 Strap, Retaining P33 19A134011P1 HARNESS INSTALLATION HARDWARE KIT 19C337712G1 Clip. Screw (wire tie). 4

6 IC DATA MICROCONTROLLER U1/U2 DS2250 RS-232 DRIVERS/RECEIVERS U8 19A149446P2 (MAX232A) DUAL PORT SRAM U3/U4 IDT7134S70J (344A3040P201) MULTIVIBRATOR (Retriggerable, Resettable) U9 MC14538BDW OCTAL 3-STATE NONINVERTING TRANSPARENT LATCH U5, U6 19A703471P318 (74HC573) HEX INVERTER U10 19A703483P304 5

7 IC DATA QUAD 2-INPUT NAND GATE U11 19A703483P302 (74HC00) HEX UNBUFFERED INVERTER U14 19A703995P2 (74HCU04) STATIC RAM U12, U13 19A705981P101 (62256) HEX SCHMITT-TRIGGER INVERTER U15 19A703483P321 H(74HC14) 6

8 HARNESS ASSEMBLY INSTALLATION INSTRUCTIONS (19C337712, Sh. 1, Rev. 0) (19D438125, Sh. 3, Rev. 6) 7

9 OUTLINE DIAGRAM HARNESS (19D904442, Sh. 1, Rev. 0) GETC 1e Module (19D903536, Rev. 1) 8

10 SCHEMATIC DIAGRAM GETC 1e Module (19D903613, Sh. 1, Rev. 0) 9

11 SCHEMATIC DIAGRAM GETC 1e Module (19D903613, Sh. 2, Rev. 0) 10

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