W O R K S H E E T : P R O C E S S O R S

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1 W O R K S H E E T : P R O C E S S O R S Revision Date: 2/3/2013 Time 1.0 Hours OVERV IEW The following activities are designed to ensure that you understand the topics covered in your courseware, reading material and handouts. You should know all about processors and sockets especially how to install a processor and the types of processors available. LA B ACTIV ITIES Exercise 1: Processor and Socket Definitions Exercise 2: Identify Socket Components Exercise 3: Cooling Components Exercise 4: Identify and Label the Sockets and Processors Below Exercise 1: Processor and Socket Definitions Overview: The following are essential parts of Processors and Sockets Define these below. 1. Hyper-threading: 2. Insertion Force (ZIF) Sockets: 3. Land Grid Array (LGA) Sockets: 4. Thermal Compound: 5. Liquid Cooling: 6. Active Cooling System consists of 3 components, list them: Cyanna Education Services, 2013 Page 1

2 Exercise 2: Identify Socket Components Overview: Research a LGA 775 socket and identify the Parts of the Socket in the graphic below: B A. B. C. D D. E. E A C Exercise 3: Cooling Components Overview: Review the Cooling Components and identify them in the graphic below Cyanna Education Services, 2013 Page 2

3 Cyanna Education Services, 2013 Page 3

4 Exercise 4: Identify and Label the Sockets and Processors Below CPU SOCKETS / CPU SLOT CPU PROCESSORS Cyanna Education Services, 2013 Page 4

5 WORKSHEE T ANSWE RS EXERC ISE 1: PROCE SSOR DEFINITIONS Land Grid Array (LGA) Sockets is a part of the motherboard that now contains the pins instead of the more expensive CPU which has slightly raised contacts on the underside of the processor. After the processor is placed into the socket it has to be secured by pushing down the socket's load lever. It is extremely important that the processor be installed and removed carefully into the socket. If you are not careful you will damage the pins, and may have a useless motherboard. Zero Insertion Force (ZIF) Sockets - ZIF sockets are designed with a plastic or metal locking lever that locks the mechanism to secure the CPU s pins in the socket. The use of this socket greatly lowers the chances of breaking or bending the CPU pins during its installation or removal. Pin Grid Array (PGA) Sockets - The socket has holes in it so it can receive the pins that are on the underside of the CPU. The pins fit into the socket. Thermal Compound - is a paste that is applied to the surface of the CPU before the heat sink is placed on it. The thermal compound fills in any imperfections on the surface of the processor that can prevent the air from moving over it optimally. Liquid Cooling- provides a powerful and quieter cooling system that uses thermodynamics where the heat moves from the warmer objects to cooler objects. This type of cooling system is used by high-end PC users who want their systems to run faster without overclocking and thus burning out their components. I.e. gaming computers. Active Cooling System Uses 3 components to cool a computer (1) Thermal Compound (2) Heatsink and (3) a fan directly mounted onto the heatsink for forced-air cooling Active Cooling System consists of 3 components, list them: 1. Thermal compound/paste 2. Heatsink 3. Fan Cyanna Education Services, 2013 Page 5

6 EXERC ISE 2: IDENTIFY PROCE SSOR COMPONENTS Overview: Label the Parts of the Socket B D A. Socket Contacts B. Lever C. Load Plate D. Processor E. Holes for Heat sink (4) E A C EXERC ISE 3 : C OOLING COMPONENTS Overview: Identify the Cooling Components 1. Liquid Cooling System 2. Thermal Paste Cyanna Education Services, 2013 Page 6

7 3 3. _Air Gaps 4. Heat Sink and Fan 5. _Thermal Interface Material 5 Cyanna Education Services, 2013 Page 7

8 EXERC ISE 4: IDE NTIFY A ND LA BEL THE SOC KETS AND PROCE SSORS BE LOW CPU SOCKETS / CPU SLOT PGA-ZIF Socket PGA Socket LGA Socket CPU PROCESSORS PGA-ZIF Processor PGA Processor LGA Processor Cyanna Education Services, 2013 Page 8

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