Data sheet acquired from Harris Semiconductor SCHS020C Revised October 2003
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1 Data sheet acquired from Harris Semiconductor SCHS020C Revised October 2003 The CD4009UB and CD4010B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and 16-lead thin shink small-outline packages (PW and PWR suffixes). Copyright 2003, Texas Instruments Incorporated
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5 PACKAGE OPTION ADDENDUM 24-Aug-2018 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan CD4009UBE ACTIVE PDIP N Green (RoHS CD4009UBEE4 ACTIVE PDIP N Green (RoHS (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp ( C) CU NIPDAU N / A for Pkg Type -55 to 125 CD4009UBE CU NIPDAU N / A for Pkg Type -55 to 125 CD4009UBE Device Marking CD4009UBF3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 CD4009UBF3A (4/5) Samples CD4009UBM ACTIVE SOIC D Green (RoHS CD4009UBMT ACTIVE SOIC D Green (RoHS CD4009UBPWR ACTIVE TSSOP PW Green (RoHS CD4010BE ACTIVE PDIP N Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4009UBM CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4009UBM CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM009UB CU NIPDAU N / A for Pkg Type -55 to 125 CD4010BE CD4010BF ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 CD4010BF CD4010BF3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 CD4010BF3A CD4010BM ACTIVE SOIC D Green (RoHS CD4010BM96 ACTIVE SOIC D Green (RoHS CD4010BMG4 ACTIVE SOIC D Green (RoHS CD4010BNSR ACTIVE SO NS Green (RoHS CD4010BPW ACTIVE TSSOP PW Green (RoHS CD4010BPWR ACTIVE TSSOP PW Green (RoHS CD4010BPWRG4 ACTIVE TSSOP PW Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4010BM CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4010BM CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4010BM CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4010B CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM010B CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM010B CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM010B (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. Addendum-Page 1
6 PACKAGE OPTION ADDENDUM 24-Aug-2018 NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF CD4009UB, CD4009UB-MIL, CD4010B, CD4010B-MIL : Catalog: CD4009UB, CD4010B Automotive: CD4010B-Q1, CD4010B-Q1 Military: CD4009UB-MIL, CD4010B-MIL NOTE: Qualified Version Definitions: Addendum-Page 2
7 PACKAGE OPTION ADDENDUM 24-Aug-2018 Catalog - TI's standard catalog product Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Military - QML certified for Military and Defense Applications Addendum-Page 3
8 PACKAGE MATERIALS INFORMATION 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant CD4009UBPWR TSSOP PW Q1 CD4010BM96 SOIC D Q1 CD4010BNSR SO NS Q1 CD4010BPWR TSSOP PW Q1 Pack Materials-Page 1
9 PACKAGE MATERIALS INFORMATION 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD4009UBPWR TSSOP PW CD4010BM96 SOIC D CD4010BNSR SO NS CD4010BPWR TSSOP PW Pack Materials-Page 2
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12 SCALE PW0016A PACKAGE OUTLINE TSSOP mm max height SMALL OUTLINE PACKAGE A TYP 6.2 PIN 1 INDEX AREA 16 14X 0.65 C SEATING PLANE 0.1 C 2X NOTE B NOTE X C A B 1.2 MAX SEE DETAIL A (0.15) TYP 0.25 GAGE PLANE A 20 DETAIL A TYPICAL /A 02/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO
13 PW0016A EXAMPLE BOARD LAYOUT TSSOP mm max height SMALL OUTLINE PACKAGE 16X (1.5) SYMM 1 16X (0.45) 16 (R0.05) TYP SYMM 14X (0.65) 8 9 (5.8) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SOLDER MASK OPENING METAL METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METAL EXPOSED METAL 0.05 MAX ALL AROUND 0.05 MIN ALL AROUND NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS SOLDER MASK DEFINED /A 02/2017 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
14 PW0016A EXAMPLE STENCIL DESIGN TSSOP mm max height SMALL OUTLINE PACKAGE 16X (0.45) 1 16X (1.5) SYMM 16 (R0.05) TYP SYMM 14X (0.65) 8 9 (5.8) SOLDER PASTE EXAMPLE BASED ON mm THICK STENCIL SCALE: 10X /A 02/2017 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design.
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18 IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES AS IS AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI s products are provided subject to TI s Terms of Sale ( or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI s provision of these resources does not expand or otherwise alter TI s applicable warranties or warranty disclaimers for TI products. Mailing Address: Texas Instruments, Post Office Box , Dallas, Texas Copyright 2018, Texas Instruments Incorporated
CD STAGE FREQUENCY DIVIDER
The B types are supplied in 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).
Data sheet acquired from Harris Semiconductor SCHS041D Revised October 2003
Data sheet acquired from Harris Semiconductor SCHS041D Revised October 2003 The CD4043B and CD4044B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line
Data sheet acquired from Harris Semiconductor SCHS041D Revised October 2003
Data sheet acquired from Harris Semiconductor SCHS041D Revised October 2003 The CD4043B and CD4044B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line
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SCBS007E APRIL 1987 REVISED NOVEMBER 1993 BiCMOS Design Substantially Reduces I CCZ Output Ports Have Equivalent 25-Ω Resistors; No External Resistors Are Required Specifically Designed to Drive MOS DRAMs
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SLUS247F APRIL 1997 REVISED NOVEMBER 2007 FEATURES Fully Programmable Reset Threshold Fully Programmable Reset Period Fully Programmable Watchdog Period 2% Accurate Reset Threshold Input Voltage Down to
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1.5 C ACCURATE DIGITAL TEMPERATURE SENSOR WITH SPI INTERFACE
FEATURES Accuracy: ±. C from C to 8 C (max) Controlled Baseline Low Quiescent Current: 0 µa (max) One Assembly/Test Site, One Fabrication Wide Supply Range:.7 V to. V Site Tiny T- Package Extended Temperature
SN74BCT756 OCTAL BUFFER/DRIVER WITH OPEN-COLLECTOR OUTPUTS
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Technical Documents. LMS3635/55-Q1, 3.5-A /5.5-A, 36-V Synchronous, 400-kHz, Step-Down Converter 100% 98% 94% 92% 88% 86% 84% 82% VOUT
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features applications description
features Four 8-Bit D/A Converters Microprocessor Compatible TTL/CMOS Compatible Single Supply Operation Possible CMOS Technology applications Process Control Automatic Test Equipment Automatic Calibration
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AVAILABLE OPTIONS PACKAGE
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FEATURES APPLICATIONS
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APPLICATIONS FEATURES DESCRIPTION
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Applications Receive Chain Protection Commercial and Military Radar 5 mm x 5 mm QFN Package Product Features Functional Block Diagram Frequency Range: 2.0 to 5.5 GHz Insertion Loss: < 1.0 db Peak Power
Features. Part Number Compliance Marking Reel Size (inches) Tape Width (mm) Quantity DT1240A-08LP Standard MW ,000/Tape & Reel
8 CHANNEL LOW CAPACITANCE TVS DIODE ARRAY Product Summary V BR (Min) I PP (Max) C I/O (Typ) 5V 5.5A 0.6pF Description The is a high-performance device suitable for protecting four high-speed I/Os. These
2-Line BUS-Port ESD-Protection - Flow Through Design FEATURES VBUS052CD-FAH VBUS052CD-FAH-GS MOLDING COMPOUND FLAMMABILITY RATING
2-Line BUS-Port ESD-Protection - Flow Through Design 21325 NC NC 6 5 4 MARKING (example only) 21323 Dot = pin 1 marking Y = type code (see table below) XX = date code 1 2 3 YXX 219 FEATURES Compact LLP113-L
0.5 C Digital Out Temperature Sensor
0.5 C Digital Out Temperature Sensor FEATURES EIGHT ADDRESSES DIGITAL OUTPUT: Two-Wire Serial Interface RESOLUTION: 9- to 12-Bits, User-Selectable ACCURACY: ±0.5 C (max) from 20 C to +100 C LOW QUIESCENT
SN54AHC574, SN74AHC574 OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
Operating Range 2-V to 5.5-V V CC 3-State Outputs Drive Bus Lines Directly Latch-Up Performance Exceeds 250 ma Per JESD 17 SN54AHC574...J OR W PACKAGE SN74AHC574... DB, DGV, DW, N, NS, OR PW PACKAGE (TOP
MHz BAW Filter
Applications S-Band For high-selectivity applications Product Features Usable bandwidth 30 MHz Low loss High selectivity Single-ended operation Ceramic chip-scale Package (CSP) Small Size Hermetic RoHS
Features. Case Material: Molded Plastic, Green Molding Compound. Computers and Peripheral
LOW CAPACITANCE BIDIRECTIONAL TVS DIODE Product Summary V BR (Min) I PP (Max) C T (Typ) 15V 9A 2pF Description This new generation TVS is designed to protect sensitive electronics from the damage due to
SKY LF: 0.1 to 3.0 GHz GaAs SPDT Switch
DATA SHEET SKY13323-378LF:.1 to 3. GHz GaAs SPDT Switch Applications WLAN 82.11 b/g networks WLAN repeaters INPUT ISM band radios Low power transmit receive systems OUTPUT1 OUTPUT2 Features Positive voltage
TSL250R, TSL251R, TSL252R
TSL250R, TSL251R, TSL252R Light-to-Voltage Optical Sensors General Description The TSL250R, TSL251R, and TSL252R are light-to-voltage optical sensors, each combining a photodiode and a transimpedance amplifier
Technical Documents. CC1310 Simplelink Ultra-Low Power Sub-1 GHz Wireless MCU
1 Product Folder Sample & Buy Technical Documents Tools & Software Support & Community CC1310 SWRS184 FEBRUARY 2015 CC1310 Simplelink Ultra-Low Power Sub-1 GHz Wireless MCU 1 Device Overview Pin Compatible
TPS2041, TPS2051 POWER-DISTRIBUTION SWITCHES
135-mΩ -Maximum (5-V Input) High-Side MOSFET Switch 500 ma Continuous Current Short-Circuit and Thermal Protection With Overcurrent Logic Output Operating Range... 2.7 V to 5.5 V Logic-Level Enable Input
RClamp7524T. Low Capacitance RClamp 4-Line ESD Protection. PROTECTION PRODUCTS Description. Features. Mechanical Characteristics.
Low Capacitance RClamp 4-Line ESD Protection PROTECTION PRODUCTS Description RailClamp TVS arrays are ultra low capacitance ESD protection devices designed to protect high speed data interfaces. This series
features applications description
features Four 8-Bit D/A Converters Microprocessor Compatible TTL/CMOS Compatible Single Supply Operation Possible CMOS Technology applications Process Control Automatic Test Equipment Automatic Calibration
TMP100 EP, TMP101 EP DIGITAL TEMPERATURE SENSOR WITH I 2 C INTERFACE applications description/ordering information
Controlled Baseline One Assembly/Test Site, One Fabrication Site Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree Digital Output: I 2
SN54ALVTH16373, SN74ALVTH V/3.3-V 16-BIT TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS
SN54ALVTH16373, SN74ALVTH16373 2.5-V/3.3-V 16-BIT TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS SCES067F JUNE 1996 REVISED JANUARY 1999 State-of-the-Art Advanced BiCMOS Technology (ABT) Widebus Design
SKY LF: 20 MHz to 6.0 GHz GaAs SPDT Switch
DATA SHEET SKY13587-378LF: 2 MHz to 6. GHz GaAs SPDT Switch Applications WLAN 82.11 a/b/g/n networks Low power transmit/receive systems INPUT Industrial IoT Lighting OUTPUT1 OUTPUT2 Smart energy Connected
+2.5 V Low Power Precision Voltage Reference REF43
+2.5 V Low Power Precision Voltage Reference REF43 FEATURES PIN CONFIGURATION GENERAL DESCRIPTION The REF43 is a low power precision reference providing a stable 2.5 V output independent of variations
2.5 GHz SILICON MMIC WIDE-BAND AMPLIFIER
FEATURES WIDE FREQUENCY RESPONSE:. GHz HIGH GAIN: 3 db (UPC79T) SATURATED OUTPUT POWER: +11. dbm (UPC79T) INTERNAL CURRENT REGULATION MINIMIZES GAIN CHANGE OVER TEMPERATURE V SINGLE SUPPLY VOLTAGE SUPER
Features. Product Compliance Marking Reel Size (inches) Tape Width (mm) Quantity per Reel D5V0P4UR6SO-7 Standard DE ,000/Tape & Reel
YM ADVANCE INFORMATION CHANNEL LOW CAPACITANCE TVS DIODE ARRAY Product Summary V BR (Min) I PP (Max) C T (Typ).5V 5A.1pF Description The is a high-performance device suitable for protecting four high-speed
Is Now Part of To learn more about ON Semiconductor, please visit our website at
Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC
SKY LF: 0.01 to 6.0 GHz GaAs SPDT Switch
DATA SHEET SKY1335-385LF:.1 to 6. GHz GaAs SPDT Switch Applications WLAN 82.11 a/b/g networks INPUT WLAN repeaters ISM band radios OUTPUT1 OUTPUT2 Low power transmit receive systems Features Positive voltage
I/O 4 NC I/O 3 I/O 1 V SS I/O 2
4 CHANNEL LOW CAPACITANCE TVS DIODE ARRAY Features Low Clamping Voltage Typical 9V at 10A 100ns, TLP Typical 9V at 10A 8μs/20μs IEC 61000-4-2 (ESD): Air ±30kV, Contact ±30kV IEC 61000-4-4 (EFT): 60A(5/50ns,
Is Now Part of To learn more about ON Semiconductor, please visit our website at
Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC
Freescale Semiconductor, I
MOTOROLA SEMICONDUCTOR TECHNICAL DATA nc. Order number: Rev 3, 08/2004 3.3 V Zero Delay Buffer The is a 3.3 V Zero Delay Buffer designed to distribute high-speed clocks in PC, workstation, datacom, telecom
TQM4M9073 Through Line
Applications General Purpose Wireless RF bypass paths Microwave Radio Test & Measurement Scientific Instruments 16-pin 3x3mm leadless SMT package Product Features Functional Block Diagram DC 6 GHz 50 ohm
description/ordering information
2-V to 5.5-V V CC Operation Max t pd of 10.5 ns at 5 V Typical V OLP (Output Ground Bounce) 2.3 V at V CC = 3.3 V, T A = 25 C
SKY LF: 0.1 to 6.0 GHz SP3T Switch
DATA SHEET SKY13373-46LF:.1 to 6. GHz SP3T Switch Applications WCDMA band and mode switching Antenna switch for multimode systems 82.11a/b/g/n WLANs J3 Features Broadband frequency range:.1 to 6. GHz Low
L9945. Automotive fully configurable 8-channel High/Low side MOSFET pre-driver suitable for 12 V and 24 V systems. Data brief.
Data brief Automotive fully configurable 8-channel High/Low side MOSFET pre-driver suitable for 12 V and 24 V systems Features TQFP64 exposed pad down Product status link L9945 Product summary GADG1606171506PS
SKYA21013: 0.1 to 6.0 GHz SPDT Switch
DATA SHEET SKYA21013: 0.1 to 6.0 GHz SPDT Switch Automotive Applications Infotainment RF1 Automated toll systems Garage door opener RF3 RF2 802.11 b/g/n WLAN, Bluetooth systems Wireless control systems
ESDA7P60-1U1M. High power transient voltage suppressor. Description. Features. Applications. Complies with the following standards:
High power transient voltage suppressor Description Datasheet - production data The ESDA7P60-1U1M is a unidirectional single line TVS diode designed to protect the power line against EOS and ESD transients.
DISCONTINUED. California Eastern Laboratories NX6506 SERIES
NECʼs 1550 nm InGaAsP MQW-DFB LASER DIODE IN CAN PACKAGE FOR 6 Mb/s AND 1.5 Gb/s APPLICATIONS FEATURES OPTICAL OUTPUT POWER: PO = 5.0 mw LOW THRESHO CURRENT: ITH = 10 ma DIFFERENTIAL EFFICIENCY: ηd = 0.5
SKY LF: 0.7 to 6.0 GHz High-Isolation (Single-Bit-Control) SPDT Switch
DATA SHEET SKY13522-6LF: 0.7 to 6.0 GHz High-Isolation (Single-Bit-Control) SPDT Switch Applications GSM/DCS/PCS/CDMA/WCDMA/TD-SCDMA single-ended filter switching Features Broadband frequency range: 0.7
ESDALC20-1BF4. Low clamping, low capacitance bidirectional single line ESD protection. Description. Features. Applications
Low clamping, low capacitance bidirectional single line ESD protection Description Datasheet - production data The ESDALC20-1BF4 is a bidirectional single line TVS diode designed to protect the data line
SOD123. Top View. Date Code Key Year Code A B C D E H I J K L
SURFACE MOUNT ZENER DIODE Features Mechanical Data Planar Die Construction 5mW Power Dissipation General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Totally Lead-Free & Fully
6-lead SOT23 Differential. 6-lead DFN Differential. CT100LW-KGD -40 C to +150 C Differential Wafer Form Unsawn Wafer
March 2019 1D Linear Sensor Features Operating Magnetic Field ange: ±20 mt Stable Magnetic Performance over Temperature Linearity Error: ±0.5% Differential Outputs Supply Voltage: 1.0 V to 5.5 V Operating
SKY LF: 0.1 to 6.0 GHz SP3T Switch
DATA SHEET SKY13588-460LF: 0.1 to 6.0 GHz SP3T Switch Applications WCDMA band and mode switching Antenna switch for multimode systems J3 802.11a/b/g/n WLANs Industrial IoT Lighting Smart energy Connected
Features. Bottom View
2 CHANNEL LOW CAPACITANCE CSP TVS DIODE ARRAY Product Summary V BR (Min) I PP (Max) C I/O (Max) 6V 5.5A.75pF Description This new generation TVS is designed to protect sensitive electronics from the damage