P8M644YA9, 16M648YA9. PIN ASSIGNMENT (Front View) 168-PIN DIMM. 4-8Mx16 SDRAM TSOP P8M644YA9 8-8Mx16 SDRAM TSOP P16M648YA9

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SDRAM MODULE P8M644YA9, 16M648YA9 8M, 16M x 64 DIMM Features: PC100 and PC133 - compatible JEDEC - Standard 168-pin, dual in-line memory module (DIMM). TSOP components. Single 3.3v +. 3v power supply. Nonbuffered fully synchronous; all signals measured on positive edge of system clock. Internal pipelined operation; column address can be changed every clock cycle. Quad internal banks for hiding row access/precharge. 64ms 4096 cycle refresh. All inputs, outputs, clocks LVTTL compatible. Options: Part Number: 4-8Mx16 SDRAM TSOP P8M644YA9 8-8Mx16 SDRAM TSOP P16M648YA9 KEY DIMM MODULE TIMING PARAMETERS Module Component Clock CAS Latency Marking Marking Freq -8A -8A 100MHZ 3-75A -75A 133MHZ 3 GENERAL DESCRIPTION The P8M644YA9 and P16M648YA9 are high performance dynamic random-access 64MB and modules respectively. These modules are organized in a x64 configuration, and utilize quad bank architecture with a synchronous interface. All signals are registered on the positive edge of the clock signals CK0 through CK3. Read and write accesses to the SDRAM are burst oriented; accesses start at a location and continue for a programmed number of locations in a sequence. Accesses begin with an ACTIVE command, which is followed by a READ or WRITE command. PIN ASSIGNMENT (Front View) 168-PIN DIMM Pin Name Pin Name Pin Name Pin Name 1 Vss 43 Vss 85 Vss 127 Vss 2 DQ0 44 DU 86 DQ32 128 CKE0 3 DQ1 45 S2# 87 DQ33 129 S3# 4 DQ2 46 DQMB2 88 DQ34 130 DQMB6 5 DQ3 47 DQMB3 89 DQ35 131 DQMB7 6 Vcc 48 DU 90 Vcc 132 RFU 7 DQ4 49 Vcc 91 DQ 133 Vcc 8 DQ5 50 NC 92 DQ37 134 NC 9 DQ6 51 NC 93 DQ38 135 NC 10 DQ7 52 NC 94 DQ39 1 NC 11 DQ8 53 NC 95 DQ40 137 NC 12 Vss 54 Vss 96 Vss 138 Vss 13 DQ9 55 DQ16 97 DQ41 139 DQ48 14 DQ10 56 DQ17 98 DQ42 140 DQ49 15 DQ11 57 DQ18 99 DQ43 141 DQ50 16 DQ12 58 DQ19 100 DQ44 142 DQ51 17 DQ13 59 Vcc 101 DQ45 143 Vcc 18 Vcc 60 DQ20 102 Vcc 144 DQ52 19 DQ14 61 NC 103 DQ46 145 NC 20 DQ15 62 NC 104 DQ47 146 NC 21 NC 63 CKE1 105 NC 147 NC 22 NC 64 Vss 106 NC 148 Vss 23 Vss 65 DQ21 107 Vss 149 DQ53 24 NC 66 DQ22 108 NC 150 DQ54 25 NC 67 DQ23 109 NC 151 DQ55 26 Vcc 68 Vss 110 Vcc 152 Vss 27 WE# 69 DQ24 111 CAS# 153 DQ56 28 DQMB0 70 DQ25 112 DQMB4 154 DQ57 29 QQMB1 71 DQ26 113 DQMB5 155 DQ58 30 SO# DQ27 114 S1# 156 DQ59 31 DU 73 Vcc 115 RAS# 157 Vcc 32 Vss 74 DQ28 116 Vss 158 DQ60 33 A0 75 DQ29 117 A1 159 DQ61 34 A2 76 DQ30 118 A3 160 DQ62 35 A4 77 DQ31 119 A5 161 DQ63 A6 78 Vss 120 A7 162 Vss 37 A8 79 CK2 121 A9 163 CK3 38 A10/AP 80 NC 122 BA0 164 NC 39 BA1 81 wp 123 A11 165 SA0 40 Vcc 82 SDA 124 Vcc 166 SA1 41 Vcc 83 SCL 125 CK1 167 SA2 42 CK0 84 Vcc 126 RFU 168 Vcc ABSOLUTE MAXIMUM RATINGS: Voltage on Vcc Supply relative to Vss... -1 to +4.6V Operating Temperature T A (Ambient)... 25 to +70 C Storage Temperature...-55 to +125 C Power Dissipation 4 or 8 W Short Circuit Output Current..50 ma Stresses beyond these may cause permanent damage to the device. This is a stress rating only and functional operation of the device at or beyond these conditions is not implied. Exposure to these conditions for extended periods may affect reliability. P8M644YA9, P16M648YA9 1 SpecTek reserves the right to change products Rev: 3/6/02 or specifications without notice. 2002 SpecTek

CAPACITANCE: (This parameter is sampled. VCC = +3.3V m 0.3V; f = 1 MHz) Parameter Symbol Max Units 64MB Input Capacitance: A0 - A11, BAO-BA1, RAS#, CAS#, WE#, C l1 25 45 pf Input Capacitance: S0#-S3#, CK0-CK3 C l2 15 25 pf Input Capacitance: CKE0, CKE1, C l3 25 45 pf Input Capacitance: DQMB0#, DQMB7 C l4 8 15 pf Input Capacitance: SQL, SA0-SA2 C l5 6 6 pf Input/Output Capacitance: DQ0-DQ63, SDA C IO 10 15 pf DC ELECTRICAL CHARACTERISTICS AND RECOMMENDED OPERATING CONDITIONS: Parameter Symbol Min Max Units Supply Voltage Vcc/Vccq 3.0 3.6 V Input High (Logic 1) Voltage, All inputs V IH 2.0 Vcc +.3 V Input Low (Logic 0) Voltage, All inputs V IL -0.3 0.8 V Input Leakage Current Any input = 0V < VIN < Vcc All other pins not under test = 0V Output Leakage Current DQs are disabled; 0V < VOUT < VccQ I OZ -20 20 ua Output High Voltage (I OUT = -4 ma) V OH 2.4 V Output Low Voltage (I OUT = 4 ma) V OL 0.4 V I I I 2 I 3-10 -20-30 10 20 30 ua ICC OPERATING CONDITIONS AND MAXIMUM LIMITS: Vcc = 3.3V ± 10%V, Temp. = 25 to 70 C Supply Current Symbol -75A -8A Units Notes OPERATING CURRENT: ACTIVE mode, burst = CL = 2 Icc1 64MB 2, READ or WRITE, trc = trc (MIN), CAS latency = 3 CL = 3 Icc1 64MB 580 565 1150 1120 STANDBY CURRENT: POWER-DOWN mode, CKE = LOW, no accesses in progress tck = 15ns Icc2 64MB ma CLK = LOW Icc2 64MB STANDBY CURRENT: CS# = HIGH, CKE = HIGH, Icc3 64MB tck = 15ns, both banks idle STANDBY CURRENT: CS# = HIGH, CKE = HIGH, tck = 15ns, Icc4 64MB both banks active after trcd met, no accesses in progress. OPERATING CURRENT: BURST mode after trcd CL = 2 Icc5 64MB met, continuous burst, READ, WRITE, tck > tck. MIN, other bank active CL = 3 Icc5 64MB AUTO REFRESH CURRENT trc > trc (MIN) CL = 2 Icc6 64MB CL = 3 Icc6 64MB 280 560 240 480 240 480 200 400 ma ma 3, 4 ma 3, 4 600 1200 560 1120 1000 2000 1000 2000 1. Icc is dependent on output loading and cycle rates. Specified values are obtained with minimum cycle time and the outputs open. 2. The Icc current will decrease as the CAS latency is reduced. This is because maximum cycle rate is slower as CAS latency is reduced. 3. Address transitions average one transition every 30ns. 4. Other input signals are allowed to transition no more than once in any 30ns period. P8M644YL9, P16M648YL9 2 SpecTek reserves the right to change products

AC ELECTRICAL CHARACTERISTICS: Vcc = 3.3V ± 10%V, Temp. = 25 to 70 C (CL = CAS Latency) AC CHARACTERISTICS -75A -75A -8A -8A PARAMETER SYM MIN MAX MIN MAX UNITS NOTES Access time from CLK (positive edge) CL = 3 tac 5.4 6 ns Access time from CLK (positive edge) CL = 2 tac ns Address hold time tah 0.8 1 ns Address setup time tas 1.5 2 ns CLK high level width tch 2.5 3 ns CLK low level width tcl 2.5 3 ns Clock cycle time CL = 3 tck 7.5 10 ns Clock cycle time CL = 2 tck ns CKE hold time tckh 0.8 1 ns CKE setup time tcks 1.5 2 ns CS#, RAS#, CAS#, WE#, DQM hold time tcmh 0.8 1 ns CS#, RAS#, CAS#, WE#, DQM setup time tcms 1.5 2 ns Data-in hold time tdh 0.8 1 ns Data-in setup time tds 1.5 2 ns Data-out high impedance time thz 5.4 9 ns 1 Data-out low impedance time tlz 1 2 ns Data-out hold time toh 2.7 3 ns ACTIVE to PRECHARGE command period tras 44 120K 50 16K ns AUTO REFRESH and ACTIVE to ACTIVE trc 66 80 ns command period ACTIVE to READ or WRITE delay trcd 20 30 ns Refresh period (4096 cycles) tt = 1ns. tref 64 64 ms PRECHARGE command period trp 20 30 ns ACTIVE bank A to ACTIVE bank B command trrd 15 20 ns period Transition time tt 0.3 1.2.3 2 ns Write recovery time twr 15 20 ns Exit SELF REFRESH to ACTIVE command txsr 75 80 ns 1. thz defines the time at which the output achieves the open circuit condition; it is not a reference to Voh or Vol. The last valid data element will meet toh before going high-z. 2. * See 8 Speed Options Chart on page 2. AC ELECTRICAL CHARACTERISTICS: Vcc = 3.3V ± 10%V, Temp. = 25 to 70 C (CL = CAS Latency) PARAMETER SYM -75-8A UNITS NOTES READ/WRITE command to READ/WRITE command tccd 1 1 tck 1 CKE to clock disable or power down entry mode tcked 1 1 tck 2 CKE to clock enable or power down exit setup mode tped 1 1 tck 2 DQM to input data delay tdqd 0 0 tck 1 DQM to data mask during WRITEs tdqm 0 0 tck 1 DQM to data high-impedance during READs tdqz 2 2 tck 1 WRITE command to input data delay tdwd 0 0 tck 1 Data-in to ACTIVATE command tdal 5 5 tck 3 Data-in tp precharge reference clock minimum cycle rate, twr Timing tdpl 2 2 tck Last data-in to burst stop command tbdl 1 1 tck 1 Last data-in to new READ/WRITE command tcdl 1 1 tck 1 Last data-in to precharge command trdl 2 2 tck 1 LOAD MODE REGISTER command to command tmrd 2 2 tck 1 Data-out to high impedance from precharge CL = 3 troh 3 3 tck 1 Data-out to high impedance from precharge CL = 2 troh tck 1 1. Clocks required specified by JEDEC functionality and not dependent on any timing parameter. 2. Timing actually specified by tcks, clock(s) specified as a reference only at a minimum cycle rate. 3. Timing actually specified by twr plus trp clock(s) specified as a reference only at a minimum cycle rate. P8M644YL9, P16M648YL9 3 SpecTek reserves the right to change products

SERIAL PRESENCE-DETECT OPERATION - This module incorporates Serial Presence-Detect (SPD). The SPD function is implemented using a 2,048 bit EEPROM, containing 256 bytes of nonvolatile storage. The first 128 bytes can be programmed by SpecTek to identify the module type and various DRAM organization and timing parameters. The remaining 128 bytes of storage are available for use by the customer. System READ/WRITE operations between the master (system logic) and the slave EEPROM device (DIMM) occur via a standard IIC bus using the DIMM s SCL (clock) and SDA (data) signals, together with SA(2:0), which provide 8 unique DIMM/EEPROM addresses. SPD CLOCK AND DATA CONVENTIONS - Data states on the SDA line can change only during SCL LOW. SDA state changes during SCL HIGH are reserved for indicating start and stop conditions (Figures 1 and 2). SPD START CONDITION - All commands are preceded by the start condition, which is a HIGH to LOW transition of SDA when SCL is HIGH. The serial PD device continuously monitors the SDA and SCL lines for the start condition and will not respond to any command until this condition has been met. SPD STOP CONDITION - All communications are terminated by a stop condition, which is a LOW to HIGH transition of SDA when SCL is HIGH. The stop condition also places the serial PD device into standby power mode. SPD ACKNOWLEDGE - Acknowledge is a software convention used to indicate successful data transfers. The transmitting device, either master or slave, will release the bus after transmitting eight bits of data (Figure 3). The PD device will always respond with an acknowledge after recognition of a start condition and its slave address. If both the device and a write operation have been selected, the PD device will respond with an acknowledge after the receipt of each subsequent eight bit word. In the read mode the PD device will transmit eight bits of data, release the SDA line and monitor the line for an acknowledge. If an acknowledge is not detected, the slave will terminate further data transmissions and await the stop condition to return to standby power mode. SERIAL PRESENCE-DETECT EEPROM DC OPERATING CONDITIONS (VCC = +3.3V µ 0.3V) PARAMETER/CONDITION Symbol MIN MAX Units Notes Supply Voltage V CC 3.0 3.6 V Input High (Logic 1) Voltage, all inputs V IH Vcc x.7 Vcc x.5 V Input Low (Logic 0) Voltage, all inputs V IL -1.0 Vcc x.3 V OUTPUT LOW VOLTAGE, I OUT =3mA V OL 0.4 V INPUT LEAKAGE CURRENT, V IN = GND to Vcc I LI 10 µa OUTPUT LEAKAGE CURRENT, V OUT = GND to Vcc I LO 10 µa STANDBY CURRENT SCL=SDA=Vcc -0.3V, All other inputs = GND I SB 30 µa or 3.3V +10% POWER SUPPLY CURRENT SCL clock frequency = 100 KHz I CC 2 µa SERIAL PRESENCE-DETECT EEPROM AC OPERATING CONDITIONS (VCC = +3.3V µ 0.3V) AC CHARACTERISTICS PARAMETER/CONDITION Symbol MIN MAX Units Notes SCL LOW to SDA data-out valid t AA 0.3 3.5 µs IIdle bus time before a transition can start t BUF 4.7 µs Data-out hold time t DH 300 ns SDA and SCL fall time t F 300 ns Data-in hold time T HD:DAT 0 µs Start condition hold time T HD:STA 4 µs Clock HIGH period t HIGH 4 µs Noise suppresssion time constant at SCL, SDA inputs t l 100 ns Clock LOW period t LOW 4.7 µs SDA and SCL rise time t R 1 µs SCL clock frequency t SCL 100 KHz Data-in setup time T SU:DAT 250 ns Start condition setup time T SU:STA 4.7 µs Stop condition setup time T SU:STO 4.7 µs WRITE cycle time t WR 10 ms 1 1. The SPD EEPROM WRITE cycle time ( t WR) is the time from a valid stop condition of a WRITE sequence to the end of the EEPROM internal erase/program cycle. During the WRITE cycle the EEPROM bus interface circuit is disabled, SDA remains HIGH due to pull-up resistor, and the EEPROM does not respond to its slave address. P8M644YL9, P16M648YL9 4 SpecTek reserves the right to change products

SCL SDA DATA STABLE DATA CHANGE DATA STABLE Figure 1 DATA VALIDITY SCL SDA START BIT Figure 2 DEFINITION OF START AND STOP STOP BIT SCL from Master Data Output from Transmitter 8 9 Data Output from Receiver Figure 3 ACKNOWLEDGE RESPONSE FROM RECEIVER Acknowledge P8M644YL9, P16M648YL9 5 SpecTek reserves the right to change products