Recent IoT/Automotive device Trends and testing challenges Presented To: SiP Conference China 2018 Presented By: Kotaro HASEGAWA

Sensing Image Sensing, LIDAR High Dynamic Range, Faster data transfer Processor/Memory embedded CIS Sensor fusion as integrated module Analyzing Decision Testing: Dark test sensitive, Image overlay As embedded devices Interface standardization Processing, AI Automotive FPGA, ASIC are rapidly growth GPU for AI is new segment of growth. Game changing and new company comes Testing: Guaranteed under many situation. Gap between Virtual Test driving and Real situation Source: SEMA 2016 COURTESY SAFELIGHT AUTOGLASS AND BOSCH 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 9

Controlling Engine, Motor Safety control Timing and level high accuracy control (x4 in 2years ) Integrated ECU to reduce harness on Vehicle. Higher temperature operation ( ~ 200 ) Energy efficiency 48V battery integration, Higher engine management accuracy Testing: Energy saving operation, low energy efficiency test High voltage rating test EV/HV Power Train ESD, Alternator Safety / Body ABS, Air Bag, Motor Cont., Breaking SOI BCD 200V/300V BCD 80V/120V 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 10

Trend of Integration Sensor + Processor + Memory Imaging, Magnetic, Pressure Power + MCU (ISPM) MCU + memory MCU +BaseBand + RF + antenna Motor Driver + MCU I/F CPU SiP High integrated SoC Module Hybrid packaging 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 11

SiP benefits Fast market launch Different process integration IP/Die/Process Reusability Low noise Faster bus communication SiP Small footprint 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 12

SiP technical challenges for testing Interposer connectivity, warpage, die shifting Limited test port on package Highly integration cause more testing requirement Die to die communication, timing marginal Stress (Level, Timing, Processing) testing for high quality SiP Packaging type variety for handling 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 13

IC level quality control to be 0 defect Early stage detecting (KGD) Package test with Quality Tracking, control De-facto Standard platform Massive Parallel for standardized device Best Cost of Test T2000, V93K 30+ years Automotive experiences 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 15

Function Test Application Layer Test DUT Centric Fixed mother board Legacy System Level Test Limited Failure coverage More high integrated complex device More stress condition is required Scan testing required DC parametric test required Fixed mother board design No flexibility Cannot execute trimming, fusing process Power profiling requirement coverage 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 18

Function Test Fixed mother board Scan/DFT Test Parameter Test Level/Timing Stress Test DPS stress test WS FT Application Layer Test DUT Centric Legacy System Level Test Hybrid SLT Physical Layer Test ATE Centric Legacy ATE Test Time For Mass Prod. Parallel Test Hybrid SLT /Trim End product 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 19

Measurement system for SiP EVA100 Ease of Use (Device behavior base arch.) Scalable to manufacturing System Level Test with Power Supply control (Vbuming, Profiling etc) Deep depth SCAN resources High Accuracy Parametric resources with high pin count (1024ch) Full package of Debugging, Analyzing feature 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 20

DUT Centric Device Test System Level Test Input DUT Output Input DUT I/F Output I/O CPU Resister, Test Mode Script Resister Test Program Test Program 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 21

Test program integrated system level testing I2C Test Flow WiFi SoftAP Test 11b (2.4GHz) Flow Editor SPI UART WiFi SoftAP Test 11g (2.4GHz) WiFi SoftAP Test 11n (2.4GHz) Test Result WiFi SoftAP Test 11a (5GHz) WiFi SoftAP Test 11n (5GHz) WiFi SoftAP Test 11ac (5GHz) HDMI validation Confirm by Instruments 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 22

R&D, QA (Temp., Voltage stress) Module Tester Compact SLT Cell High-mix low-volume Many I/F (USB, Ethernet, ) Large Scale SLT Cell Ultra high volume production & Long time of SLT Robot Arm 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 23