3-line IPAD, EMI filter including ESD protection Description Datasheet production data The EMIF03-SIM06F3 chip is a highly integrated audio filter device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interface. Flip-chip package (11 bumps) The filter included ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up to 15 kv. Figure 1. Pin configuration (bump side) Features EMI symmetrical (I/O) low-pass filter 1 3 A High efficiency in ESD protection Lead-free package Very thin package High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging B C Complies with the following standards: IEC 61000-4- level 4 ± 15 kv (air discharge) ± 8 kv (contact discharge) Figure. Functional schematic D IEC 61000-4- level 1 ± kv (air discharge) ± kv (contact discharge) A1 10000 R4 100 R1 D1 D D3 A3 Application B1 R B3 Where EMI filtering in ESD sensitive equipment is required: Mobile phones and communication systems C1 A GND 100 R3 C GND C3 Computers, printers and MCU boards A and C bumps must be conneced together on the PCB December 013 DocID04459 Rev 1 1/7 This is information on a product in full production. www.st.com 7
Characteristics EMIF03-SIM06F3 1 Characteristics Table 1. Absolute maximum ratings (T amb = 5 C) Symbol Parameter Value Unit V PP Internal pins (A1, B1, C1): ESD discharge IEC 61000-4- (1), level 1 Air discharge Contact discharge External pins (A3, B3, C3, D1, D, D3): ESD discharge IEC 61000-4- (1), level 4 Air discharge Contact discharge 0 0 kv T op Operating temperature range - 40 to + 85 T stg Storage temperature range - 55 to 150 1. Measurements done on IEC 61000-4- test bench. For further details see Application note AN3353, IEC 61000-4- standard testing. Figure 3. Electrical characteristics (definitions) Symbol Parameter V BR = Breakdown voltage I RM = Leakage current @ VRM V RM = Stand-off voltage V CL = Clamping voltage I PP = Peak pulse current C line = Line capacitance R I/O = Series resistance between input and ouptput V CL PP Table. Electrical characteristics (T amb = 5 C) Symbol Test conditions Min. Typ. Max. Unit I RM V RM = 3 V 50 na V BR I R = 1 ma 6 V R1, R3 Tolerance ±0% 100 R Tolerance ±0% 47 R4 Tolerance ±0% 10 k V C line = 0 V, V osc = 30 mv, F = 10 MHz line 8 10 1 pf (measured under zero light conditions) /7 DocID04459 Rev 1
Characteristics Figure 4. Attenuation versus frequency Figure 5. Analog crosstalk versus frequency 0-5 -10-15 -0-5 -30-35 -40 S1(dB) F(Hz) 1M 3M 10M 30M 100M 300M 1G 3G Data Rst Clk XTalk (db) 0-10 -0-30 -40-50 -60 F(Hz) -70 1M 3M 10M 30M 100M 300M 1G 3G Data-D1 Data-Clk Data-Rst Rst-D Rst-D3 Figure 6. ESD response to IEC 61000-4- (+8 kv contact discharge) Figure 7. ESD response to IEC 61000-4- (-8 kv contact discharge) 10.0 V / Div 0.0 V / Div 1 V CL: Peak clamping voltage V CL :clamping voltage @ 30 ns 3 V CL :clamping voltage @ 60 ns 4 V CL :clamping voltage @ 100 ns -1.1 V -10.5 V -9.9 V -6.8 V 1 4 3 1.6 V 14.0 V 3 11.1 V 4 6.8 V 1 3 4 V CL: Peak clamping voltage V CL :clamping voltage @ 30 ns V CL :clamping voltage @ 60 ns V :clamping voltage @ 100 ns CL 0 ns / Div 0 ns / Div Figure 8. Line capacitance versus applied voltage C(pF) 16 14 1 10 8 6 4 bias (V) 0 0 4 6 8 D GND DocID04459 Rev 1 3/7
Package information EMIF03-SIM06F3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Figure 9. Flip-Chip package dimensions 55 ± 40 µm 500 µm ± 50 400 ± 30 µm 1140 ± 30 µm 170 µm 400 ± 30 µm 170 µm 1540 ± 30 µm Figure 10. Footprint recommendations Figure 11. Marking Copper pad Diameter: 0 µm recommended 60 µm maximum Solder mask opening: 300 µm minimum Solder stencil opening: 0 µm recommended Dot, ST logo ECOPACK grade xx = marking z = manufacturing location yww = datecode (y = year ww = week) x y x w z w 4/7 DocID04459 Rev 1
Package information Figure 1. Tape and reel specification Dot identifying Pin A1 location 0.0.0 4.0 Ø 1.50 8.0 1.65 1.75 3.5 0.59 1.8 4.0 All dimensions are typical values in mm User direction of unreeling Note: More information is available in the application notes: AN348, IPAD 400 µm Flip Chip: package description and recommendations for use AN1751, EMI filters: recommendations and measurements DocID04459 Rev 1 5/7
Ordering information EMIF03-SIM06F3 3 Ordering information Figure 13. Ordering information scheme EMIF 03 - SIM 06 F3 EMI filter Number of lines Information 3 letters = application digits = version Package F = Flip chip x = 3: Lead-free pitch = 400 µm, bump = 55 µm Table 3.Ordering information Order code Marking Package Weight Base qty Delivery mode EMIF03-SIM06F3 KP Flip Chip.3 mg 5000 Tape and reel (7 ) 4 Revision history Table 4.Document revision history Date Revision Changes 19-Dec-013 1 Initial release 6/7 DocID04459 Rev 1
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