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Product Specification 15mm x 27mm Description One of the most capable Bluetooth modules available, the BT-21 Bluetooth OEM Module is designed for maximum flexibility. The BT-21 module includes 14 general purpose input/output lines, several serial interface options, analog-to-digital inputs, and up to 2M bps data throughput. The BT-21 is a surface mount PCB module that provides fully embedded, ready to use Bluetooth wireless technology. The reprogrammable flash memory contains embedded firmware for serial cable replacement using the Bluetooth SPP profile. Other popular Bluetooth profiles, such as OBEX, are also available. Customized firmware for peripheral device interaction, power optimization, security, and other proprietary features may be supported and can be ordered pre-loaded and configured. Additional Documentation BT Hardware Design Guide abserial User Guide abserial Reference Guide Features Bluetooth Radio - Fully embedded Bluetooth v2.0 Serial Profile - Class 2 radio - Complete RF ready module - Wireless data communications - Integrated chip antenna - 128-bit encryption security - Range up to 30m LOS - FCC & Bluetooth qualified ST Micro ARM7 microprocessor up to 50MHz Memory - 256K bytes flash memory - 64K bytes RAM memory Data Rate - 2M bps maximum data rate - Multipoint capability Amp ed RF, Inc. Serial Interface - UART, up to 480K baud (up to 3.25M baud on BT21.2) - Buffered SPI interface - I2C interface - USB v2.0 General I/O - 14 general purpose I/O - 4x12-bit A/D inputs User Interface - AT command set 2008 1 Amp ed RF Inc 1722 Ringwood Ave, Suite 250, San Jose, CA 95131, USA BT-21 Datasheet 9/29/08 www.ampedrf.com Page 1 of 12

Amp ed RF, Inc. Software Architecture Lower Layer Stack Full Bluetooth v2.0 data rate (3M bps maximum) Device power modes active, sleep and deep sleep Wake on Bluetooth feature optimized power consumption of host CPU Authentication and encryption Encryption key length from 8-bits to 128-bits maximum Persistent FLASH memory for BD Address and radio parameter storage All ACL (Asynchronous Connection Less) packet types (DM1, DH1, DM3, DH3, DM5, DH5, 2-DH1, 2-DH3, 2-DH5, 3-DH1 3-DH3, 3-DH5, AUX1) SCO (Synchronous Connection Oriented) packet types (HV1, HV2, HV3) Point to multipoint and scatternet support 3 master and 7 slave links allowed (10 active links simultaneously) Park, sniff, and hold modes fully supported to maximum allowed intervals Master slave switch supported during connection and post connection Dedicated Inquiry Access Code for improved inquiry scan performance Dynamic packet selection channel quality driven data rate to optimize link performance Dynamic power control interference reduction and link performance Bluetooth test modes per Bluetooth v2.0 specification 802.11b co-existence AWMA and AFH Vendor specific HCI commands to support device configuration and certification test modes Upper Layer Stack SPP, OBEX, SDAP, GAP, and DUN protocols RFComm, SDP, and L2CAP supported HCI Interface Bluetooth v2.0 specification compliant HCI UART transport layer (H4) Firmware upgrade over UART APPLICATIONS UPPER LAYER STACK EVENTS HCI LM BASEBAND COMMANDS ARM7 CPU FLASH MEMORY RF HCI STACK 2008 2 Amp ed RF Inc 1722 Ringwood Ave, Suite 250, San Jose, CA 95131, USA BT-21 Datasheet 9/29/08 www.ampedrf.com Page 2 of 12

Hardware Specifications Amp ed RF, Inc. General Conditions (V IN = 3.0V and 25 C) Recommended Operating Conditions Rating Min Typical Max Unit Operating Temperature Range -20-80 C Supply Voltage V IN 2.8 3.0 3.4 Volts Signal Pin Voltage - 3.0 - Volts RF Frequency 2400-2483.5 MHz Absolute Maximum Ratings Rating Min Typical Max Unit Storage temperature range -55 - +150 C Supply voltage, V IN -0.3 - + 3.6 Volts I/O pin voltage, V IO -0.3 - + 4.0 Volts RF input power - - -5 dbm Current Consumption Modes Avg Unit Typical Power Consumption ACL data 115K Baud UART at max throughput (Master) 35.0 ma ACL data 115K Baud UART at max throughput (Slave) 35.0 ma Connection, no data traffic, master 16.0 ma Connection, no data traffic, slave 24.0 ma Connection in sniff (Tsniff=100ms), no data traffic, master 8.0 ma Connection in sniff (Tsniff=100ms), no data traffic, slave 8.4 ma Connection in sniff (Tsniff=375ms), no data traffic, master 2.0 ma Connection in sniff (Tsniff=375ms), no data traffic, slave 2.5 ma Standby, without deep sleep 14.0 ma Standby, with deep sleep 0.11 ma Page/Inquiry scan, deep sleep 1.4 ma 2008 3 Amp ed RF Inc 1722 Ringwood Ave, Suite 250, San Jose, CA 95131, USA BT-21 Datasheet 9/29/08 www.ampedrf.com Page 3 of 12

Amp ed RF, Inc. I/O Operating Characteristics Symbol Parameter Min Max Unit Conditions V IL Low-Level Input Voltage - 0.9 Volts V IN, 3.0V V IH High-Level Input Voltage 2.1 - Volts V IN, 3.0V V OL Low-Level Output Voltage - 0.4 Volts V IN, 3.0V V OH High-Level Output Voltage 2.2 - Volts V IN, 3.0V I OL Low -Level Output Current - 4.0 ma V = 0.4 V OL I OH High-Level Output Current - 4.0 ma V = 2.2 V OH R PU Pull-up Resistor 80 120 KΩ Resistor Turned On R PD Pull-down Resistor 80 120 KΩ Resistor Turned On Selected RF Characteristics Parameters Conditions BT Spec Typical Unit Antenna load 50 ohm Radio Receiver Sensitivity level BER <.001 with DH5-70 -84 dbm Maximum usable level BER <.001 with DH1-20 -9 dbm Input VSWR 2.5:1 Radio Transmitter Maximum output power 50 Ω load -6 to +4 +5 dbm Initial Carrier Frequency Tolerance ± 75 0 khz 20 db Bandwidth for modulated carrier 1000 932 khz 2008 4 Amp ed RF Inc 1722 Ringwood Ave, Suite 250, San Jose, CA 95131, USA BT-21 Datasheet 9/29/08 www.ampedrf.com Page 4 of 12

Amp ed RF, Inc. Pin Assignment Name Type Pin # Description ALT Function UART Interface RXD I 8 Receive data TXD O 6 Transmit data CTS I 9 Clear to send (active low) RTS O 10 Request to send (active low) Reserved Available on BT21.2 Boot 0 I 2 Boot Loader (active high) GPIO [11] I/O 11 General Purpose Input/Output GPIO [12] I/O 12 General Purpose Input/Output Power and Ground Reset V DD 24 V DD GND 23 GND RESETN I 3 Reset input (active low for 5 ms); GPIO General Purpose Input/Output GPIO [0] I/O 16 General Purpose Input/Output SPI MISO GPIO [1] I/O 17 General Purpose Input/Output SPI MOSI GPIO [2] I/O 19 General Purpose Input/Output SPI SS GPIO [3] I/O 1 General Purpose Input/Output SPI CLK GPIO [4] I/O 18 General Purpose Input/Output UART 2 RXD GPIO [5] I/O 20 General Purpose Input/Output UART 2 TXD GPIO [6] I/O 22 General Purpose Input/Output ADC 0 GPIO [7] I/O 13 General Purpose Input/Output ADC 1 GPIO [8] I/O 4 General Purpose Input/Output ADC 2 GPIO [9] I/O 7 General Purpose Input/Output ADC 3 GPIO [10] I/O 5 General Purpose Input/Output GPIO [13] I/O 15 General Purpose Input/Output GPIO [14] I/O 14 General Purpose Input/Output GPIO [15] I/O 21 General Purpose Input/Output 5 2008 Amp ed RF Inc 1722 Ringwood Ave, Suite 250, San Jose, CA 95131, USA BT-21 Datasheet 9/29/08 www.ampedrf.com Page 5 of 12

Amp ed RF, Inc. BT-21 Drawing 2008 6 Amp ed RF Inc 1722 Ringwood Ave, Suite 250, San Jose, CA 95131, USA BT-21 Datasheet 9/29/08 www.ampedrf.com Page 6 of 12

Amp ed RF, Inc. Hardware Block Diagram Battery or supply Regulator 2.75V 2.75V SPI BP Filter STLC2500C UART ARM MCU RAM Reset GPIO ROM BT_WakeUp 256K/Flash 64K/RAM UART 26 MHz Crystal BT stack up to HCI - abserial/application - GAP, SPP, DUN, OBEX - SDP/RFCOMM - L2CAP BT-21 Bluetooth Module Block Diagram 2008 7 Amp ed RF Inc 1722 Ringwood Ave, Suite 250, San Jose, CA 95131, USA BT-21 Datasheet 9/29/08 www.ampedrf.com Page 7 of 12

Hardware Design Amp ed RF, Inc. Amp ed RF modules support UART, USB, SPI, and GPIO hardware interfaces. Note that the usage of these interfaces is dependant upon the firmware that is loaded into the module, and is beyond the scope of this document. Notes All unused pins should be left floating; do not ground. All GND pins must be well grounded. The area around the module should be free of any ground planes, power planes, trace routings, or metal for 8 mm from the antenna in all directions. Traces should not be routed underneath the module. Module Reflow Installation The BT-21 is a surface mount Bluetooth module supplied on a 24 pin, 6-layer PCB. The final assembly recommended reflow profiles are: For non Pb-free applications, Sn63Pb37 solder is recommended. Maximum peak temperature of 208-210 C (below 220 C). Maximum rise and fall slope after liquidous of < 2 C/second. Maximum rise and fall slope after liquidous of < 2 C/second. Maximum time at liquidous of 50 90 seconds. For RoHS/Pb-free applications, Sn96.5/Ag3.0/Cu0.5 solder is recommended. Maximum peak temperature of 230-240 C (below 250 C). Maximum rise and fall slope after liquidous of < 2 C/second. Maximum rise and fall slope after liquidous of < 3 C/second. Maximum time at liquidous of 40 80 seconds. 8 2008 Amp ed RF Inc 1722 Ringwood Ave, Suite 250, San Jose, CA 95131, USA BT-21 Datasheet 9/29/08 www.ampedrf.com Page 8 of 12

GPIO Interface All GPIOs are capable of sinking and sourcing 4mA of I/O current. GPIO [0] to GPIO [7] are internally pulled down with 100KΩ (nominal) resistors GPIO [8] to GPIO [15] are internally pulled up with 100KΩ (nominal) resistors. Amp ed RF, Inc. UART Interface The UART is compatible with the 16550 industry standard. Four signals are provided with the UART interface. The TXD and RXD pins are used for data while the CTS and RTS pins are used for flow control. CTS RXD Host TXD RXD RTS CTS Amp ed RF Module R TS TXD Connection to Host Device 2008 9 Amp ed RF Inc 1722 Ringwood Ave, Suite 250, San Jose, CA 95131, USA BT-21 Datasheet 9/29/08 www.ampedrf.com Page 9 of 12

Amp ed RF, Inc. Amp ed RF Module Typical RS232 Circuit 2008 10 Amp ed RF Inc 1722 Ringwood Ave, Suite 250, San Jose, CA 95131, USA BT-21 Datasheet 9/29/08 www.ampedrf.com Page 10 of 12

PCB Layout Guidelines Amp ed RF, Inc. 2008 11 Amp ed RF Inc 1722 Ringwood Ave, Suite 250, San Jose, CA 95131, USA BT-21 Datasheet 9/29/08 www.ampedrf.com Page 11 of 12

FCC Regulatory Compliance This module has been tested and found to comply with the FCC Part15 Rules. These limits are designed to provide reasonable protection against harmful interference in approved installations. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Modifications or changes to this equipment not expressly approved by Amp ed RF may void the user s authority to operate this equipment. Amp ed RF, Inc. Modular Approval FCC ID: WDTBTMOD2 In accordance with FCC Part 15, the BT-21 is listed above as a Modular Transmitter device. FCC Label Instructions The outside of final products that contain a BT-21 device must display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: WDTBTMOD2 or Contains FCC ID: WDTBTMOD2. Any similar wording that expresses the same meaning may be used. 12 2008 Amp ed RF Inc 1722 Ringwood Ave, Suite 250, San Jose, CA 95131, USA BT-21 Datasheet 9/29/08 www.ampedrf.com Page 12 of 12