SPECIFICATION Of CMOS MEMS Analog Microphone. Model No.: JL-M2417

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SPECIFICATION Of CMOS MEMS Analog Microphone ( RoHS Compliance ) : : ISSUED BY J.C 09-27-2012 CHECKED BY APPROVED BY Version 00 Pages 1 / 11

Revision History Version Description Date Author Approved 00 Initial release Version 00 Pages 2 / 11

Product Descriptions The M2417A is one of the smallest analog output microphone which uses CMOS foundry process technology. The M2417A is integrated with an acoustic transducer and an analog amplify circuit into a single chip which eliminates the need for inter-die wire bonds to achieve a smaller and more reliable microphone. As a result of a monolithic solution, the tiny M2417A CMOS MEMS microphones are ideal for use in many compact portable consumer electronic devices such as cellular phone, headset and other space limited applications. Features Innovated technology to achieve a single chip CMOS MEMS microphone High reliability microphone by CMOS semiconductor process High stability microphone without membrane aging High durability under SMT to improve manufacture efficiency and reliability Adapted to automatic pick and replace handler Smallest analog output microphone with footprint of only 4.08mm² Miniature 2.40mm x 1.70mm x 1.00mm Small package size by wafer level package approach, WLP Applications Compact thin-profile cellular phones Compact headsets Space limited portable consumer electronic devices Multi-micropne devices, Microphone array -- Noise cancellation, Noise reduction -- Echo cancellation -- Beam forming Version 00 Pages 3 / 11

1 Acoustical and Electrical characteristics: Parameters Test Conditions Symbol Min. Typ. Max. Unit Acoustical Sensitivity 1KHz, 94dBSPL S -39-36 -33 dbv/pa Signal to Noise ratio A-weighted S/N 57 dba Equivalent Noise Level A-weighted ENL 37 dba Total Harmonic Distortion @114dB SPL THD < 5 % Electrical Supply Voltage The recommended Vdd 2.0 3.6 V voltage is more than 2.1V Current Consumption Isb 200 250 μa Power Supply Rejection Ratio 1KHz, 100mV P-P PSRR -60 db square wave superimposed on Vdd 2.6V Output Impedance Zout 200 Output DC Offset 1.2 V 2 Frequency response Version 00 Pages 4 / 11

3 Dimensions Unit : mm Version 00 Pages 5 / 11

4 Pin Definition and Function 4 3 1 2 4 3 1 2 Pin No. 1 2 3 4 Symbol OUTPUT GND GND VDD Function Analog signal output GROUND GROUND Power supply 5 Recommended PCB Land Pattern Unit : mm Version 00 Pages 6 / 11

6 Application Circuit VDD OUT A GND Vref Version 00 Pages 7 / 11

7 Reliability test : After the the following test, the sensitivity of microphone shall not deviate more than 3dB from its initial value. TEST High Temperature Storage DESCRIPTION +105 C environment for 1,000 hours. The test refers to IEC 60068-2-2 Test Ba. Low Temperature Storage -40 C environment for 1,000 hours. The test refers to IEC 60068-2-2 Test Aa. High Temperature Operation +105 C environment while under bias for 1,000 hours. The test refers to IEC 60068-2-2 Test Ba. Low Temperature Operation Temperature / Humidity bias Thermal Shock Reflow -40 C environment while under bias for 1,000 hours. The test refers to IEC 60068-2-2 Test Aa. +85 C and 85% R.H. environment while under bias for 1,000 hours. The test refer to JESD22-A101-B 100 cycles of air-air thermal shock from -40 C to +125 C with 15 minute soaks. The test refers to IEC 60068-2-14. 5 reflow cycles with peak temperature of +260 C. The test refers to J-STD-020D Vibration 4 cycles lasting 12 minutes from 20 to 2,000 Hz in X, Y and Z direction with peak acceleration of 20g. The test refers to MIL 883E, Method 2007.2, A Mechanical Shock Electrostatic Discharge 3 pulses of 10,000g in the X, Y and Z direction. The test refers to IEC60068-2-27, Test Ea. 3 discharges at ±8KV direct contact to lid when unit is grounded and 3 discharges at ±2KV direct contact to I/O pins. The test refers to JESD22-A114 ( HMB ) and JESD22-A115 ( MM ). Version 00 Pages 8 / 11

8 Solder Reflow Profile Stage Temperature Profile Time Pre-heat 170 C ~ 180 C 60 ~ 120 seconds Solder Melt Above 230 C 60 ~ 150 seconds Peak 260 C maximum N/A Version 00 Pages 9 / 11

9 Packing Unit : mm Carrier Tape A0 B0 K0 F P1 W 1.95±0.1 2.65±0.1 1.30±0.1 3.50±0.1 4.00±0.1 8.00±0.1 Version 00 Pages 10 / 11

Reel Specifications: 7 : 3,000 pcs A N W1 W2 B C D 178±1 60±0.5 9±0.5 11.8 4.9 13 +0.5/-0.2 23.9 Version 00 Pages 11 / 11