2-line IPAD, EMI filter and ESD protection Datasheet production data Features Packaged in lead-free Flip Chip Very low resistance: 0.35 Ω High attenuation: -45 db at 900 MHz Very low PCB space consumption: 0.89 mm x 1.26 mm Very thin package: 0.65 mm High efficiency in ESD suppression IEC6 1000-4-2 level 4 High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging Complies with the following standards IEC 61000-4-2 level 4: ±15 kv (air discharge) ±8 kv (contact discharge) Application Mobile phones Description The EMIF02-SPK02F2 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering. The EMIF02-SPK02F2 flip-chip packaging means the package size is equal to the die size. That's why the EMIF02-SPK02F2 is a very small device. Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 30 kv. Figure 1. Figure 2. Input Flip-Chip package (5 bumps) Pin configuration (bump side) 3 O1 O2 2 GND I2 1 I1 A B C Functional schematic Output TM: IPAD is a trademark of STMicroelectronics April 2012 Doc ID 15035 Rev 3 1/12 This is information on a product in full production. www.st.com 12
Characteristics EMIF02-SPK02F2 1 Characteristics Table 1. Absolute maximum ratings (T amb = 25 C) Symbol Parameter Value Unit V PP ESD discharge IEC 61000-4-2 Air discharge Contact discharge I SPK Maximum rms current per channel 350 ma T j Junction temperature range -30 to 125 C T stg Storage temperature range -55 to + 150 C 30 30 kv Figure 3. Electrical characteristics - definitions Symbol Parameter V BR = Breakdown voltage V = Clamping voltage I RM = Leakage current @ V V RM = Stand-off voltage I F = Forward current I PP = Peak pulse current I R = Breakdown current V F = Forward voltage drop Rd = Dynamic resistance αt = Voltage temperature RM V Slope: 1/R d I PP I PP Slope: 1/R d V Table 2. Electrical characteristics - values (T amb = 25 C) Symbol Test conditions Min Typ Max Unit V BR I R = 1 ma 6 V I RM V RM = 3 V 400 na R I/O 0.35 0.8 Ω C LINE V R = 0 V DC, 1 MHz 185 250 315 pf F c Cut-off frequency: Z SOURCE = Z LOAD = 50 Ω 20 MHz 2/12 Doc ID 15035 Rev 3
Characteristics Figure 4. Attenuation measurements versus frequency 0.00 S21 (db) -10.00-20.00-30.00-40.00-50.00 F (Hz) 100.0k 1.0M 10.0M 100.0M 1.0G I1-O1 I2-O2 Figure 5. Crosstalk measurements versus frequency 0.00 XTalk (db) -10.00-20.00-30.00-40.00-50.00-60.00-70.00-80.00 F (Hz) 100.0k 1.0M 10.0M 100.0M 1.0G I1-O2 Doc ID 15035 Rev 3 3/12
Characteristics EMIF02-SPK02F2 Figure 6. ESD test conditions 2 x -20 db 50 Ω input Figure 7. Clamping voltage V versus peak pulse current I PP for short pulse duration such as ESD surges I PP (A) 40 35 30 Typical breakdown dynamic resistance R D : 140 mω t P = 100 ns T J initial = 25 C 25 ) (A 20 I PP 15 10 5 0 V (V) 0 2 4 6 8 10 12 14 16 V (V) Note: For further information on the dynamic characteristic see the STMicroelectronics application note AN4022, TVS short pulse R d measurement and correlation with TVS clamping voltage during ESD. 4/12 Doc ID 15035 Rev 3
Characteristics Figure 8. Output filter ESD response to IEC 61000-4-2 (+8 kv contact discharge) I1 to O1 1 V PP: ESD peak voltage 2 V :clamping voltage @ 30 ns 3 V :clamping voltage @ 60 ns 4 V :clamping voltage @ 100 ns 1 15.7 V 2 9.1 V 3 8.7 V 4 7.9 V Figure 9. Output filter ESD response to IEC 61000-4-2 (-8 kv contact discharge) I1 to O1 2-8.9 V 3-8.7V 4-7.9 V 1 16.1 V 1 V PP: ESD peak voltage 2 V :clamping voltage @ 30 ns 3 V :clamping voltage @ 60 ns 4 V :clamping voltage @ 100 ns Doc ID 15035 Rev 3 5/12
Characteristics EMIF02-SPK02F2 Figure 10. Output filter ESD response to IEC 61000-4-2 (+15 kv contact discharge) I1 to O1 1 V PP: ESD peak voltage 2 V :clamping voltage @ 30 ns 3 V :clamping voltage @ 60 ns 4 V :clamping voltage @ 100 ns 1 25.5 V 2 9.7 V 3 10 V 4 8.3 V Figure 11. Output filter ESD response to IEC 61000-4-2 (-15 kv contact discharge) I1 to O1 2-10.2 V 3-8.3V 4-8.2 V 1 23.8 V 1 V PP: ESD peak voltage 2 V :clamping voltage @ 30 ns 3 V :clamping voltage @ 60 ns 4 V :clamping voltage @ 100 ns 6/12 Doc ID 15035 Rev 3
Characteristics Figure 12. Output filter ESD response to IEC 61000-4-2 (+30 kv contact discharge) I1 to O1 1 V PP: ESD peak voltage 2 V :clamping voltage @ 30 ns 3 V :clamping voltage @ 60 ns 4 V :clamping voltage @ 100 ns 1 37.1 V 2 11.8 V 3 10.8 V 4 8.8 V Figure 13. Output filter ESD response to IEC 61000-4-2 (-30 kv contact discharge) I1 to O1 2-12.2 V 3-11.3 V 4-8.4 V 1-37.9 V 1 V PP: ESD peak voltage 2 V :clamping voltage @ 30 ns 3 V :clamping voltage @ 60 ns 4 V :clamping voltage @ 100 ns Doc ID 15035 Rev 3 7/12
Ordering information scheme EMIF02-SPK02F2 2 Ordering information scheme Figure 14. Ordering information scheme EMIF yy - xxx zz Fx EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip Chip x = 2: lead-free, pitch = 500 µm, bump = 315 µm 8/12 Doc ID 15035 Rev 3
Package information 3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Figure 15. Package dimensions 500 µm ± 10 250 µm ± 10 315 µm ± 50 650 µm ± 65 435 µm 500 µm ± 15 1.26 mm ± 50 µm 0.89 mm ± 50 µm Figure 16. Footprint Figure 17. Marking Copper pad Diameter: 250 µm recommended, 300 µm max. Solder stencil opening: 330 µm recommended Solder mask opening recommendation: 340 µm min. for 315 µm copper pad diameter Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) x y x w E z w Doc ID 15035 Rev 3 9/12
1.75 ± 0.1 3.5 ± 0.1 8 ± 0.3 Package information EMIF02-SPK02F2 Figure 18. Flip Chip tape and reel specification Dot identifying Pin A1 location 4 ± 0.1 Ø 1.5 ± 0.1 ST E xxz yww ST E xxz yww ST E xxz yww 0.73 ± 0.05 4 ± 0.1 All dimensions in mm User direction of unreeling Note: More information is available in the application notes: AN1235: Flip Chip: Package description and recommendations for use AN1751: EMI filters: Recommendations and measurements 10/12 Doc ID 15035 Rev 3
Ordering information 4 Ordering information Table 3. Ordering information Order code Marking Package Weight Base qty Delivery mode EMIF02-SPK02F2 JD Flip Chip 1.8 mg 5000 Tape and reel 7 5 Revision history Table 4. Document revision history Date Revision Changes 17-Sep-2008 1 Initial release. 12-Sep-2011 2 Updated Figure 15 and Figure 16. 3-Apr-2012 3 Updated cover page features and description.inserted Figure 6 to Figure 13. Doc ID 15035 Rev 3 11/12
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