ERNI MicroStac www.erni.com Catalog E 074521 07/06 Edition 6
www.erni.com 2 www.erni.com/contact/ Catalog E 074505 01/02 Edition 3
Table of Contents Applications........................................................................................... 4 Technical Features...................................................................................... 4 Electrical And Mechanical Characteristics.................................................................... 6 6 Pin Single Row Version................................................................................ 8 12 Pin Single Row Version.............................................................................. 10 50 Pin Dual Row Version................................................................................ 12 Packaging........................................................................................... 14 Mating Conditions for MicroStac.......................................................................... 15 More SMT Connectors from ERNI......................................................................... 16 Part Number Index.................................................................................... 18 www.erni.com/contact/ 3
Applications Sensor engineering: Light barriers, switches Medical engineering: Intensive medical equipment, portable diagnostics Mobile communication: Mobile phones, PDAs, organizer, memory modules Car electronics: Car radios, mobile car phones, mobile car office equipment Control engineering: Mini PLCs, fieldbus modules, mini solenoid sytems Facility management: Signal and indicator devices, alarm systems and bus modules Technical Features Derating Curve In spite of the small design of the ERNI MicroStac series, they reach a high current rating. The contacts feature large radiant surfaces to derive heat. The derating curve shows the 50pin version without PCB. Current (A 3 2,5 2 1,5 1 0,5 Temperature [ C] 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 Base curve [A] 2 1,95 1,9 1,82 1,72 1,6 1,45 1,28 1,05 0,75 0,45 Derating curve [A] 1,6 1,56 1,52 1,456 1,376 1,28 1,16 1,024 0,84 0,6 0,36 4 www.erni.com/contact/
Technical Features Controlled SMT Reflow Soldering Process The heat-resistant thermoplastic insulator and precision coplanar contacts permit a controlled SMT soldering process. Easy Recognition and Safe Handling The black insulator ensures easy visual recognition by the automatic pick-and-place equipment. Safe Packaging and Fully Automated Feed The antistatic tape-and-reel packaging not only protects the high-precision contacts and coplanarity of our MicroStac connectors, but also permits placement of connectors by automated pick and place equipmentequipment www.erni.com/contact/ 5
Electrical And Mechanical Characteristics Number of Pins Technical data Climate Category Bearing and operating temperature area Current rating Standard DIN EN 60068-1 test b IEC60512 test 5b 1 Row and 2 Row Types 6, 12 and 50-55/125/21-55/125 C By ambient temperature: 20 C 1,6 A 70 C 1,3 A 100 C 0,8 A Air and creepage distance Comparative figure of voltage Voltage rating Dielectric strength IEC 60112 IEC 60664 IEC 60512 0,4mm CTI-250 Has to be determined according to client-specific using case (degree of environmental pollution) according to IEC 60664 contact contact 500V Contact resistance Insulation resistance Vibration Contact disturbance (while vibration sine) Shock halfsine Contact disturbance (while shock halfsine) Mechanical operation (mating cycles) Insertion and withdrawal force IEC 60512 test 2a IEC 60512 test 3a IEC 60512 test 6d IEC 60512 test 2e IEC 60512 test 6c IEC 60512 test 2e IEC 60512 test 9a IEC 60512 test 13b < 10 mω > 10 4 MΩ 10 2000 Hz 20g < 1 µs 50g 11 ms < 1 µs > 10 mating cycles 6 cont.: 12 N max. 12 cont.: 24 N max. 50 cont.: 100 N max. 6 www.erni.com/contact/
Electrical And Mechanical Characteristics Number of Pins Process-conditions Hand soldering temperature max. SMT-Reflow soldering temperature max. Coplanarity Materials Housing: plastic material (symbol) CTI value UL flame rating UL file Contact and mating area Base material Plating Termination area Base material Plating Standard IEC 68-2-20 IEC 68-2-20 IEC 60112 1 Row and 2 Row Types 6, 12 and 50 3,5s at 350 C 10s at 260 C < 0,1mm PA 46 CTI 250 UL 94 V-0 E 47960 Cu alloy Gold plated Cu alloy Sn Enviroment compatibility recycling no flame-retardent additives, no toxic additives allow easy recycling www.erni.com/contact/ 7
6 Pin Single Row Version The SMT connector series MicroStac with 0.8 mm pitch and with SMT termination is based on a hermaphroditic design. As result of this the male and the female connector are identical. The same style for male and female connector meet the requirement for a economical connector solution in modern applications in electronics. The dual-sided PCB application contact principle provides for a tilt-proof and insertion-proof connector position on the PCB. The gripper surface is integrated within the insulator body. This obviates the need for the standard assembly hood. Optionally, versions featuring positioning pegs are also available. Using the MicroStac a board-to-board height from 5.0 mm up to 6.5 mm is achieved. Dimensional Drawing 7,16 0,425 4,35 1,15 3,9 1,45 Pos. 1 0,9 5 x 0,8 = 4 0,8 Koplanarität der Anschlüsse <_ 0,1mm Coplanarity area of termination <_ 0,1mm 3,2 1 3,95 0,6-0,03 0,8-0,03 6,3 ±0,03 Leiterplatten-Layout Vorschlag PCB-Layout Proposal +0,03 0,65 6,3 ±0,03 +0,03 0,85 All dimensions in mm 4,3 1,35 Pos. 1 0,8 0,44 5 x 0,8 = 4 1,65 1,15±0,03 Bezugslinie für gestecktes Paar Referenceline for mated pair 8 www.erni.com/contact/
6 Pin Single Row Version Ordering Information Configuration Height No. of Pins Part Number Single row with peg, tape and reel, 1500 pcs/reel 6 114711 6, 12 polig 6, 12 pin 50 polig 50 pin 5,5 7,5 2,6 3,75 5 5 0,85 1,45 Bezugslinie für gestecktes Paar 4,2 Bezugslinie für gestecktes Paar Referenceline for mated pair Referenceline for mated pair All dimensions in mm www.erni.com/contact/ 9
12 Pin Single Row Version The SMT connector series MicroStac with 0.8 mm pitch and with SMT termination is based on a hermaphroditic design. As result of this the male and the female connector are identical. The same style for male and female connector meet the requirement for a economical connector solution in modern applications in electronics. The dual-sided PCB application contact principle provides for a tilt-proof and insertion-proof connector position on the PCB. The gripper surface is integrated within the insulator body. This obviates is the need for the standard assembly hood. Optionally, versions featuring positioning pegs are also available. Using the MicroStac a board-to-board height from 5.0 mm up to 6.5 mm is achieved. Dimensional Drawing 11,96 0,425 0,9 1 3,95 Pos. 1 0,6-0,03 0,8-0,03 11,1±0,03 11 x 0,8 8,8 = 0,8 4,35 1,45 1,15 3,9 Koplanarität der Anschlüsse <_ 0,1mm Coplanarity area of termination <_ 0,1mm 3,2 Leiterplatten-Layout Vorschlag PCB-Layout Proposal Pos. 1 +0,03 0,65 11,1±0,03 +0,03 0,85 All dimensions in mm 4,3 1,35 0,44 0,8 11 x 0,8 = 8,8 1,65 1,15±0,03 Bezugslinie für gestecktes Paar Referenceline for mated pair 10 www.erni.com/contact/
12 Pin Single Row Version Ordering Information Configuration Height No. of Pins Part Number Single row with peg, tape and reel, 1500 pcs/reel 12 114712 6, 12 polig 6, 12 pin 50 polig 50 pin 5,5 7,5 2,6 3,75 5 5 0,85 1,45 Bezugslinie für gestecktes Paar 4,2 Bezugslinie für gestecktes Paar Referenceline for mated pair Referenceline for mated pair All dimensions in mm www.erni.com/contact/ 11
50 Pin Dual Row Version The SMT connector series MicroStac with 0.8 mm pitch and with SMT termination is based on a hermaphroditic design. As result of this the male and the female connector are identical. The same style for male and female connector meet the requirement for a economical connector solution in modern applications in electronics. The dual-sided PCB application contact principle provides for a tilt-proof and insertion-proof connector position on the PCB. The gripper surface is integrated within the insulator body. This obviates is the need for the standard assembly hood. Optionally, versions featuring positioning pegs are also available. Using the MicroStac a board-to-board height from 5.0 mm up to 6.5 mm is achieved. Dimensional Drawing 22,5 3,75 1 4,15 4,55 0,6-0,03 0,8-0,03 3,1 21,5 ±0,03 3,32 3,98 7,3 Pos. 1 0,8 24 x 0,8 = 19,2 Koplanarität der Anschlüsse <_ 0,1mm Coplanarity area of termination <_ 0,1mm 3,9 7,25 Pos. 1 +0,03 0,65 Leiterplatten-Layout Vorschlag PCB-Layout Proposal 21,5 ±0,03 +0,03 0,85 Bezugslinie für gestecktes Paar Referenceline for mated pair 3,47 All dimensions in mm ±0,05 7,6 0,44 0,8 24 x 0,8 = 19,2 1,15±0,03 0,425 3,4 12 www.erni.com/contact/
50 Pin Dual Row Version Ordering Information Configuration Height No. of Pins Part Number Dual row with peg, tape and reel, 800 pcs/reel 50 114713 6, 12 polig 6, 12 pin 50 polig 50 pin 5,5 7,5 2,6 3,75 5 5 0,85 1,45 Bezugslinie für gestecktes Paar 4,2 Bezugslinie für gestecktes Paar Referenceline for mated pair Referenceline for mated pair All dimensions in mm www.erni.com/contact/ 13
Packaging 6 Pin Version Verpackt in Gurtverpackung Tape - on Reel Packaging Verpackungseinheit: 1500 Stück- Packaging unit: 1500 pcs Pos. 1 Abspulrichtung - Reel off Direction 4 330 150 8 16,5 12 Pin Version Verpackt in Gurtverpackung Tape - on Reel Packaging Verpackungseinheit: 1500 Stück- Packaging unit: 1500 pcs Pos. 1 Abspulrichtung - Reel off Direction 4 330 150 24,5 8 50 Pin Version Verpackt in Gurtverpackung Tape - on Reel Packaging Verpackungseinheit: 800 Stück- Packaging unit: 800 pcs Abspulrichtung - Reel off Direction 330 All dimensions in mm 150 44,5 Pos. 1 4 12 14 www.erni.com/contact/
4 Mating Conditions for MicroStac Misalignment Tolerances longitudinal: ±0.7mm; transverse: ±0.5mm 0.7 0.5 Angular Inclination Tolerances longitudinal: ±4 ; transverse: ±4 4 "Board to Board" Height distance: 5.0-6.5 mm All dimensions in mm 5.0-6.5 www.erni.com/contact/ 15
More SMT Connectors from ERNI Right Angle Surface Mount D-Sub Connector Modern Sub Rack Technology is increasing the demand for SMT components along with the requirement for the connectors supporting this technology. ERNI is meeting the need by developing a new generation of the classic I/O D-Sub connector which uses surface mount technology. High Speed Differential Connector System ERmet zeroxt for 10 GBit/s For modern high speed backplane designs with data transmission rates up to 10 Gbit/s ERNI has developed the new ERmet zeroxt Connector System with 100 Ohm matched differential impedance for enhanced signal integrity. The new connector system is specifically designed to meet the challenging electrical performance needs required by next generation designs utilizing low voltage differential signaling. The ERmet zeroxt now offers an innovative shielding design and SMT termination to provide very low cross-talk, low skew and improved trace routing. Additional features and benefits are a reliable female contact design, different mating levels and a rugged housing. SMC 1.27 mm pitch SMC connectors are excellently suited for efficient processing in modern SMT soldering systems. Easy population, optimum seating and attachment by integrated retaining clips, and the exact position of the connection pins make SMC connectors into a real SMT component. We supply SMC connectors on a reel for the automatic assembly. Single Port Mod Jacks Various pin configurations e.g. RJ 11, RJ 45 Shielded or unshielded Standard or ultra low profile Right angle Versions SMT termination LED versions 16 www.erni.com/contact/
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Part Number Index Part Number Page 114711.......... 9 114712......... 11 114713......... 13 18 www.erni.com/contact/
Member Catalog Catalog Katalog E 074519 D E 074521 004045 10/01 07/06 10/01 Edition Edition Ausgabe 2 7 1
ERNI Electronics GmbH Europe South America Africa Seestrasse 9, Postfach 73099 Adelberg, Deutschland Tel +49 (0)71 66 50-0 Fax +49 (0)71 66 50-282 info@erni.de ERNI Electronics, Inc. North America Canada Mexico 3005 E. Boundary Terrace Midlothian, VA 23112 USA Tel +1 (804) 228-4100 Fax +1 (804) 228-4099 info.usa@erni.com ERNI Asia Holding Pte Ltd. Blk 4008 Ang Mo Kio Avenue 10 #04-01/02 Techplace I Singapore 569625 Tel +65 6 555 5885 Fax +65 6 555 5995 info@erni-asia.com Asia www.erni.com ERNI Electronics GmbH 2006 Printed in Germany. A policy of continuous improvement is followed and the right to alter any published data without notice is reserved. 20 www.erni.com/contact/ Catalog Catalog E 074521 E 074521 07/06 07/06 Edition Edition 7 7