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19-3558; Rev 4; 8/09 EVALUATION KIT AVAILABLE 27-Bit, 3MHz-to-35MHz General Description The digital video parallel-to-serial converter serializes 27 bits of parallel data into a serial data stream. Eighteen bits of video data and 9 bits of control data are encoded and multiplexed onto the serial interface, reducing the serial data rate. The data enable input determines when the video or control data is serialized. The pairs with the MAX9218 deserializer to form a complete digital video serial link. Interconnect can be controlled-impedance PCB traces or twisted-pair cable. Proprietary data encoding reduces EMI and provides DC balance. DC balance allows AC-coupling, providing isolation between the transmitting and receiving ends of the interface. The LVDS output is internally terminated with 100Ω. ESD tolerance is specified for ISO 10605 with ±10kV contact discharge and ±30kV air discharge. The operates from a +3.3V core supply and features a separate input supply for interfacing to 1.8V to 3.3V logic levels. This device is available in 48-lead Thin QFN and LQFP packages and is specified from -40 C to +85 C. Applications Navigation System Display In-Vehicle Entertainment System Video Camera LCD Displays Features Proprietary Data Encoding for DC Balance and Reduced EMI Control Data Sent During Video Blanking Five Control Data Inputs Are Single-Bit-Error Tolerant Output Common-Mode Filter Reduces EMI Greater than 10m STP Cable Drive Wide ±2% Reference Clock Tolerance ISO 10605 ESD Protection Separate Input Supply Allows Interface to 1.8V to 3.3V Logic +3.3V Core Supply Space-Saving Thin QFN and LQFP Packages -40 C to +85 C Operating Temperature Ordering Information PART TEMP RANGE PIN- PACKAGE ECM+ -40 C to +85 C 48 LQFP ECM/V+ -40 C to +85 C 48 LQFP ETM+ -40 C to +85 C 48 Thin QFN-EP* +Denotes a lead(pb)-free/rohs-compliant package. /V denotes an automotive qualified part. *EP = Exposed pad. Pin Configurations TOP VIEW VCCPLL PLL GND I.C. 36 35 34 33 32 31 30 29 28 27 26 25 VCCLVDS LVDS GND LVDS GND CMF VCCLVDS LVDS GND LVDS GND CMF VCCPLL PLL GND I.C. GND V CC RGB_IN0 RGB_IN1 RGB_IN2 RGB_IN3 RGB_IN4 RGB_IN5 RGB_IN6 RGB_IN7 RGB_IN8 RGB_IN9 37 38 39 40 41 42 43 44 45 46 47 48 + 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 I.C. DE_IN CNTL_IN8 CNTL_IN7 CNTL_IN6 CNTL_IN5 CNTL_IN4 CNTL_IN3 CNTL_IN2 V CC GND GND V CC RGB_IN0 RGB_IN1 RGB_IN2 RGB_IN3 RGB_IN4 RGB_IN5 RGB_IN6 RGB_IN7 RGB_IN8 RGB_IN9 37 38 39 40 41 42 43 44 45 46 47 48 36 35 34 33 32 31 30 29 28 27 26 25 + 24 23 22 21 20 19 18 17 16 15 14 13 I.C DE_IN CNTL_IN8 CNTL_IN7 CNTL_IN6 CNTL_IN5 CNTL_IN4 CNTL_IN3 CNTL_IN2 V CC GND GND VCCIN RGB_IN10 RGB_IN11 RGB_IN12 RGB_IN13 RGB_IN14 RGB_IN15 RGB_IN16 RGB_IN17 CNTL_IN0 CNTL_IN1 LQFP GND VCCIN RGB_IN10 RGB_IN11 RGB_IN12 RGB_IN13 RGB_IN14 RGB_IN15 RGB_IN16 RGB_IN17 CNTL_IN0 CNTL_IN1 THIN QFN-EP 1 2 3 4 5 6 7 8 9 10 11 12 Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim s website at www.maxim-ic.com.

ABSOLUTE MAXIMUM RATINGS V CC_ to _GND...-0.5V to +4.0V Any Ground to Any Ground...-0.5V to +0.5V, to LVDS GND...-0.5V to +4.0V, Short Circuit to LVDS GND or V CCLVDS...Continuous, Short Through 0.125µF (or smaller), 25V Series Capacitor...-0.5V to +16V RGB_IN[17:0], CNTL_IN[8:0], DE_IN,,,,, CMF to GND...-0.5V to (V CCIN + 0.5V) Continuous Power Dissipation (T A = +70 C) 48-Lead LQFP (derate 21.7mW/ C above +70 C)...1739mW 48-Lead Thin QFN (derate 37mW/ C above +70 C).2963mW ESD Protection Machine Model (R D = 0Ω, CS = 200pF) All Pins to GND...±200V Human Body Model (R D = 1.5kΩ, CS = 100pF) All Pins to GND...±2kV ISO 10605 (R D = 2kΩ, C S = 330pF) Contact Discharge (, ) to GND...±10kV Air Discharge (, ) to GND...±30kV Storage Temperature Range...-65 C to +150 C Junction Temperature...+150 C Lead Temperature (soldering, 10s)...+300 C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (V CC_ = +3.0V to +3.6V, R L = 100Ω ±1%, = high, T A = -40 C to +85 C, unless otherwise noted. Typical values are at V CC_ = +3.3V, T A = +25 C.) (Notes 1, 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS SINGLE-ENDED INPUTS (RGB_IN[17:0], CNTL_IN[8:0], DE_IN,,, RNG_) V CCIN = 1.71V to <3V 0.65V CCIN V CCIN + 0.3 High-Level Input Voltage V IH 2 V CCIN + 0.3 V V CCIN = 1.71V to <3V -0.3 0.3V CCIN Low-Level Input Voltage V IL -0.3 +0.8 V Input Current I IN V CCIN = 1.71V to 3.6V, V IN = -0.3V to (V CCIN + 0.3V), = high or low -70 +70 µa Input Clamp Voltage V CL I CL = -18mA -1.5 V LVDS OUTPUTS (, ) Differential Output Voltage V OD Figure 1 250 335 450 mv Change in V OD Between Complementary Output States ΔV OD Figure 1 20 mv Common-Mode Voltage V OS Figure 1 1.125 1.29 1.375 V Change in V OS Between Complementary Output States ΔV OS Figure 1 20 mv Output Short-Circuit Current I OS V or V = 0 or 3.6V -15 ±8 +15 ma Magnitude of Differential Output Short-Circuit Current Output High-Impedance Current I OZ or = low V CC_ = 0 I OSD V OD = 0 5.5 15 ma V = 0, V = 3.6V V = 3.6V, V = 0-1 +1 µa 2

DC ELECTRICAL CHARACTERISTICS (continued) (V CC_ = +3.0V to +3.6V, R L = 100Ω ±1%, = high, T A = -40 C to +85 C, unless otherwise noted. Typical values are at V CC_ = +3.3V, T A = +25 C.) (Notes 1, 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Differential Output Resistance R O 78 110 147 Ω Worst-Case Supply Current I CCW R L = 100Ω ± 1%, C L = 5pF, continuous 10 transition words, modulation off 3MHz 15 25 5MHz 18 25 10MHz 23 28 20MHz 33 39 35MHz 50 70 Power-Down Supply Current I CCZ (Note 3) 50 µa ma AC ELECTRICAL CHARACTERISTICS (V CC_ = +3.0V to +3.6V, R L = 100Ω ±1%, C L = 5pF, = high, T A = -40 C to +85 C, unless otherwise noted. Typical values are at V CC_ = +3.3V, T A = +25 C.) (Note 4) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS TIMING REQUIREMENTS Clock Period t T Figure 2 28.57 333.00 ns Clock Frequency f CLK 3 35 MHz Clock Frequency Difference from Deserializer Reference Clock Δf CLK -2 +2 % Clock Duty Cycle DC t HIGH /t T or t LOW /t T, Figure 2 35 50 65 % Clock Transition Time t R, t F Figure 2 2.5 ns SWITCHING CHARACTERISTICS Output Rise Time t RISE 20% to 80%, V OD 250mV, modulation off, Figure 3 215 350 ps Output Fall Time t FALL 80% to 20%, V OD 250mV, modulation off, Figure 3 206 350 ps Input Setup Time t SET Figure 4 3 ns Input Hold Time t HOLD Figure 4 3 ns Serializer Delay t SD Figure 5 PLL Lock Time t LOCK Figure 6 16385 x t T ns Power-Down Delay t PD Figure 7 1 µs 3.15 x t T 3.2 x t T ns 3

AC ELECTRICAL CHARACTERISTICS (continued) (V CC_ = +3.0V to +3.6V, R L = 100Ω ±1%, C L = 5pF, = high, T A = -40 C to +85 C, unless otherwise noted. Typical values are at V CC_ = +3.3V, T A = +25 C.) (Note 4) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Peak-to-Peak Output Offset Voltage V OSp-p 700Mbps data rate, CMF open, Figure 8 700Mbps data rate, CMF 0.1µF to ground, Figure 8 22 70 12 50 mv Note 1: Current into a pin is defined as positive. Current out of a pin is defined as negative. All voltages are referenced to ground except V OD, ΔV OD, and ΔV OS. Note 2: Maximum and minimum limits over temperature are guaranteed by design and characterization. Devices are production tested at T A = +25 C. Note 3: All LVTTL/LVCMOS inputs, except at 0.3V or V CCIN - 0.3V. is 0.3V. Note 4: AC parameters are guaranteed by design and characterization and are not production tested. Limits are set at ±6 sigma. Typical Operating Characteristics (T A = +25 C, V CC_ = +3.3V, R L = 100Ω, modulation off, unless otherwise noted.) 60 50 WORST-CASE PATTERN SUPPLY CURRENT vs. FREQUENCY toc01 SUPPLY CURRENT (ma) 40 30 20 10 0 3 7 11 15 19 23 27 31 35 FREQUENCY (MHz) 4

PIN NAME FUNCTION 1, 13, 37 GND Input Buffer Supply and Digital Supply Ground Pin Description 2 V CCIN Input Buffer Supply Voltage. Bypass to GND with 0.1µF and 0.001µF capacitors in parallel as close to the device as possible, with the smallest value capacitor closest to the supply pin. 3 10, 39 48 RGB_IN[17:0] LVTTL/LVCMOS Red, Green, and Blue Digital Video Data Inputs. Eighteen data bits are loaded into the input latch on the rising edge of when DE_IN is high. Internally pulled down to GND. 11, 12, 15 21 CNTL_IN[8:0] LVTTL/LVCMOS Control Data Inputs. Control data are latched on the rising edge of when DE_IN is low. Internally pulled down to GND. 14, 38 V CC Digital Supply Voltage. Bypass to GND with 0.1µF and 0.001µF capacitors in parallel as close to the device as possible, with the smallest value capacitor closest to the supply pin. 22 DE_IN LVTTL/LVCMOS Data Enable Input. Logic-high selects RGB_IN[17:0] to be latched. Logic-low selects CNTL_IN[8:0] to be latched. DE_IN must be switching for proper operation. Internally pulled down to GND. 23 LVTTL/LVCMOS Parallel Clock Input. Latches data and control inputs and provides the PLL reference clock. Internally pulled down to GND. 24, 25 I.C. Internally connected to GND. Connect to GND or leave unconnected. 26 PLL GND PLL Supply Ground PLL Supply Voltage. Bypass to PLL GND with 0.1µF and 0.001µF capacitors in parallel as close 27 V CCPLL to the device as possible, with the smallest value capacitor closest to the supply pin. 28 LVTTL/LVCMOS Power-Down Input. Internally pulled down to GND. 29 CMF Common-Mode Filter. Optionally connect a capacitor between CMF and ground to filter common-mode switching noise. 30, 31 LVDS GND LVDS Supply Ground 32 Inverting LVDS Serial Data Output 33 Noninverting LVDS Serial Data Output 34 V CCLVDS LVDS Supply Voltage. Bypass to LVDS GND with 0.1µF and 0.001µF capacitors in parallel as close to the device as possible, with the smallest value capacitor closest to the supply pin. 35 LVTTL/LVCMOS Frequency Range Select Input. Set to the frequency range that includes the frequency as shown in Table 3. Internally pulled down to GND. 36 LVTTL/LVCMOS Frequency Range Select Input. Set to the frequency range that includes the frequency as shown in Table 3. Internally pulled down to GND. EP Exposed Pad (Thin QFN Package Only). Connect Thin QFN exposed pad to PCB GND. 5

RGB_IN CNTL_IN DE_IN 1 0 INPUT LATCH DC BALANCE/ ENCODE PAR-TO-SER Functional Diagram CMF PLL TIMING AND CONTROL R L / 2 V OD R L / 2 V OS GND (() + ()) / 2 V OS (-) V OS (+) V OS (-) ΔV OS = V OS (+) - V OS (-) V OD (+) V OD = 0V () - () V OD (-) ΔV OD = V OD (+) - V OD (-) V OD (-) Figure 1. LVDS DC Output Load and Parameters 6

t T t HIGH V IHmin V ILmax t F t R t LOW Figure 2. Parallel Clock Requirements R L C L C L 80% 80% () - () 20% 20% t RISE t FALL Figure 3. Output Rise and Fall Times V IHmin V ILmax t SET t HOLD RGB_IN[17:0] CNTL_IN[8:0] DE_IN Figure 4. Synchronous Input Timing V IHmin V ILmax V IHmin V ILmax 7

RGB_IN CNTL_IN N N + 1 N + 2 N + 3 EXPANDED TIME SCALE N + 4 N - 1 N OUT_ t SD BIT 0 BIT 19 Figure 5. Serializer Delay V ILmax tlock () - () HIGH-Z V OD = 0V Figure 6. PLL Lock Time V ILmax t PD () - () HIGH-Z Figure 7. Power-Down Delay 8

(() + ()) / 2 V OS(P-P) V OS(P-P) Figure 8. Peak-to-Peak Output Offset Voltage Detailed Description The DC-balanced serializer operates at a parallel clock frequency of 3MHz to 35MHz, serializing 18 bits of parallel video data RGB_IN[17:0] when the data enable input DE_IN is high, or 9 bits of parallel control data CNTL_IN[8:0] when DE_IN is low. The RGB video input data are encoded using 2 overhead bits, EN0 and EN1, resulting in a serial word length of 20 bits (Table 1). Control inputs are mapped to 19 bits and encoded with 1 overhead bit, EN0, also resulting in a 20-bit serial word. Encoding reduces EMI and maintains DC balance across the serial cable. Two transition words, which contain a unique bit sequence, are inserted at the transition boundaries of video-to-control and control-to-video phases. Control data inputs C0 to C4 are mapped to 3 bits each in the serial control word (Table 2). At the deserializer, 2 or 3 bits at the same state determine the state of the recovered bit, providing single bit-error tolerance for C0 to C4. Control data that may be visible if an error occurs, such as VSYNC and HSYNC, can be connected to these inputs. Control data inputs C5 to C8 are mapped to 1 bit each. Table 1. Serial Video Phase Word Format 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 EN0 EN1 S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 S10 S11 S12 S13 S14 S15 S16 S17 Bit 0 is the LSB and is serialized first. EN[1:0] are encoding bits. S[17:0] are encoded symbols. Table 2. Serial Control Phase Word Format 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 E N 0 C0 C0 C0 C1 C1 C1 C2 C2 C2 C3 C3 C3 C4 C4 C4 C5 C6 C7 C8 Bit 0 is the LSB and is serialized first. C[8:0] are the control inputs. 9

CONTROL PHASE TRANSITION PHASE VIDEO PHASE TRANSITION PHASE CONTROL PHASE CNTL_IN DE_IN RGB_IN Figure 9. Transition Timing = NOT SAMPLED BY Transition Timing The transition words require interconnect bandwidth and displace control data. Therefore, control data is not sampled (see Figure 9): Two clock cycles before DE_IN goes high. During the video phase. Two clock cycles after DE_IN goes low. The last sampled control data are latched at the deserializer control data outputs during the transition and video phases. Video data are latched at the deserializer RGB data outputs during the transition and control phases. Applications Information AC-Coupling Benefits AC-coupling increases the common-mode voltage to the voltage rating of the capacitor. Two capacitors are sufficient for isolation, but four capacitors two at the serializer output and two at the deserializer input provide protection if either end of the cable is shorted to a high voltage. AC-coupling blocks low-frequency ground shifts and common-mode noise. The serializer can also be DC-coupled to the MAX9218 deserializer. Figure 10 shows an AC-coupled serializer and deserializer with two capacitors per link, and Figure 11 is the AC-coupled serializer and deserializer with four capacitors per link. Selection of AC-Coupling Capacitors See Figure 12 for calculating the capacitor values for AC-coupling, depending on the parallel clock frequency. The plot shows capacitor values for two- and fourcapacitor-per-link systems. For applications using less than 18MHz clock frequency, use 0.1µF capacitors. Frequency-Range Setting RNG[1:0] The RNG[1:0] inputs select the operating frequency range of the serializer. An external clock within this range is required for operation. Table 3 shows the selectable frequency ranges and corresponding data rates for the. 10

RGB_IN CNTL_IN DE_IN 1 0 INPUT LATCH DC BALANCE/ ENCODE PAR-TO-SER OUT CMF 130Ω * * 82Ω V CC 130Ω 82Ω IN DC BALANCE/ DECODE SER-TO-PAR 1 0 R/F OUTEN RGB_OUT CNTL_OUT DE_OUT PLL TIMING AND CONTROL PLL TIMING AND CONTROL PCLK_OUT REF_IN LOCK MAX9218 CERAMIC RF SURFACE-MOUNT CAPACITOR *CAPACITORS CAN BE AT EITHER END. 100Ω DIFFERENTIAL STP CABLE Figure 10. AC-Coupled Serializer and Deserializer with Two Capacitors per Link V CC RGB_IN CNTL_IN DE_IN 1 0 INPUT LATCH DC BALANCE/ ENCODE PAR-TO-SER OUT CMF 130Ω 82Ω 130Ω 82Ω IN DC BALANCE/ DECODE SER-TO-PAR 1 0 R/F OUTEN RGB_OUT CNTL_OUT DE_OUT PLL TIMING AND CONTROL PLL TIMING AND CONTROL PCLK_OUT REF_IN LOCK MAX9218 CERAMIC RF SURFACE-MOUNT CAPACITOR 100Ω DIFFERENTIAL STP CABLE Figure 11. AC-Coupled Serializer and Deserializer with Four Capacitors per Link 11

CAPACITOR VALUE (nf) 140 125 110 95 80 65 50 AC-COUPLING CAPACITOR VALUE vs. PARALLEL CLOCK FREQUENCY FOUR CAPACITORS PER LINK TWO CAPACITORS PER LINK fig12 Table 3. Parallel Clock Frequency Range Select PARALLEL CLOCK (MHz) SERIAL DATA RATE (Mbps) 0 0 3 to 5 60 to 100 0 1 5 to10 100 to 200 1 0 10 to 20 200 to 400 1 1 20 to 35 400 to 700 35 20 18 21 24 27 30 33 36 PARALLEL CLOCK FREQUENCY (MHz) R O / 2 CMF Figure 12. AC-Coupling Capacitor Values vs. Clock Frequency of 18MHz to 35MHz R O / 2 C CMF Termination The has an integrated 100Ω output-termination resistor. This resistor damps reflections from induced noise and mismatches between the transmission line impedance and termination resistors at the deserializer input. With = low or with the supply off, the output termination is switched out and the LVDS output is high impedance. Figure 13. Common-Mode Filter Capacitor Connection Common-Mode Filter The integrated 100Ω output termination is made up of two 50Ω resistors in series. The junction of the resistors is connected to the CMF pin for connecting an optional common-mode filter capacitor. Connect the filter capacitor to ground close to the as shown in Figure 13. The capacitor shunts common-mode switching current to ground to reduce EMI. 12

Power-Down and Power-Off Driving low stops the PLL, switches out the integrated 100Ω output termination, and puts the output in high impedance to ground and differentially. With 0.3V and all LVTTL/LVCMOS inputs 0.3V or V CCIN - 0.3V, supply current is reduced to 50µA or less. Driving high starts PLL lock to and switches in the 100Ω output termination resistor. The LVDS output is not driven until the PLL locks. The LVDS output is high impedance to ground and 100Ω differential. The 100Ω integrated termination pulls and together while the PLL is locking so that V OD = 0V. If V CC = 0, the output resistor is switched out and the LVDS outputs are high impedance to ground and differentially. PLL Lock Time The PLL lock time is set by an internal counter. The lock time is 16,385 cycles. Power and clock should be stable to meet the lock-time specification. Input Buffer Supply The single-ended inputs (RGB_IN[17:0], CNTL_IN[8:0], DE_IN,,,, and ) are powered from V CCIN. V CCIN can be connected to a 1.71V to 3.6V supply, allowing logic inputs with a nominal swing of V CCIN. If no power is applied to V CCIN when power is applied to V CC, the inputs are disabled and is internally driven low, putting the device in the power-down state. Power-Supply Circuits and Bypassing The has isolated on-chip power domains. The digital core supply (V CC ) and single-ended input supply (V CCIN ) are isolated but have a common ground (GND). The PLL has separate power and ground (V CCPLL and V CCPLL GND) and the LVDS input also has separate power and ground (V CCLVDS and V CCLVDS GND). The grounds are isolated by diode connections. Bypass each V CC, V CCIN, V CCPLL, and V CCLVDS pin with high-frequency, surface-mount ceramic 0.1µF and 0.001µF capacitors in parallel as close to the device as possible, with the smallest value capacitor closest to the supply pin. LVDS Output The LVDS output is a current source. The voltage swing is proportional to the termination resistance. The output is rated for a differential load of 100Ω ±1%. Cables and Connectors Interconnect for LVDS typically has a differential impedance of 100Ω. Use cables and connectors that have matched differential impedance to minimize impedance discontinuities. Twisted-pair and shielded twisted-pair cables offer superior signal quality compared to ribbon cable and tend to generate less EMI due to magnetic field canceling effects. Balanced cables pick up noise as common mode, which is rejected by the LVDS receiver. 13

Board Layout Separate the LVTTL/LVCMOS inputs and LVDS output to prevent crosstalk. A four-layer PCB with separate layers for power, ground, and signals is recommended. ESD Protection The ESD tolerance is rated for Human Body Model, Machine Model, and ISO 10605. ISO 10605 specifies ESD tolerance for electronic systems. The Human Body Model, Machine Model, discharge components are C S = 100pF and R D = 1.5kΩ (Figure 14). The ISO 10605 discharge components are C S = 330pF and R D = 2kΩ (Figure 15). The Machine Model discharge components are C S = 200pF and R D = 0Ω (Figure 16). 1MΩ R D 1.5kΩ R D 0Ω HIGH- VOLTAGE DC SOURCE CHARGE-CURRENT- LIMIT RESISTOR C S 100pF DISCHARGE RESISTANCE STORAGE CAPACITOR DEVICE UNDER TEST HIGH- VOLTAGE DC SOURCE CHARGE-CURRENT- LIMIT RESISTOR C S 200pF DISCHARGE RESISTANCE STORAGE CAPACITOR DEVICE UNDER TEST Figure 14. Human Body ESD Test Circuit Figure 16. Machine Model ESD Test Circuit 50Ω TO 100Ω R D 2kΩ HIGH- VOLTAGE DC SOURCE CHARGE-CURRENT- LIMIT RESISTOR C S 330pF DISCHARGE RESISTANCE STORAGE CAPACITOR DEVICE UNDER TEST Figure 15. ISO 10605 Contact-Discharge ESD Test Circuit PROCESS: CMOS Chip Information Package Information For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. PACKAGE TYPE PACKAGE CODE DOCUMENT NO. 48 LQFP C48+5 21-0054 48 TQFN T4866+1 21-0141 14

REVISION NUMBER REVISION DATE 3 5/08 DESCRIPTION Corrected LQFP package, removed MOD function pins, added Machine Model ESD, and corrected diagrams Revision History PAGES CHANGED 1, 2, 5, 6, 10 15 4 8/09 Added automotive qualified part to Ordering Information 1 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 15 2009 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.