SD Memory Card Connectors DM Series Withstands higher force of card insertion. Card Nov..6 Feb..8 Copyright 8 6 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Features. Withstands higher force of card insertion Metal cover extends over the back of the connector allowing it to withstand force of up to 4N (static load) when dropped or accidentally hit. (Fig.). No damage to the card when accidentally pulled-out The connectors will release the card when a moderate pull-out force of about 4N is applied. There will be no damage to the lock components and all connector functions will not be affected. (Fig.) 3. Accidental card fall-out prevention Built-in lock feature holds the card securely in place. (Fig.3) 4. Reliable Card Insertion and Withdrawal Built-in Push-in / Push-out ejection mechanism assures simple and reliable card insertion and withdrawal. 5. Designed to accept Secure Digital I/O card (Built-in Ground Contact) The connector allows use of various expansion modules, including the Bluetooth communication modules. Standard type Metal cover extends over the back of the connector. Metal cover extends over the back of the connector. No damage to the card when accidentally pulled-out. Accidental card fall-out prevention Card Reverse type Fig. Fig. Fig.3 C39
Product Specifications Current rating.5a DC Rating Voltage rating 5V AC Operating temperature range : -5ç to +85ç (Note ) Storage temperature range : -4ç to +85ç (Note ) Operating humidity range : Relative humidity 95% max. (No condensation) Nov..6 Feb..8 Copyright 8 6 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Item Specification Conditions. Insulation resistance. Withstanding voltage 3. Contact resistance 4. Vibration 5. Humidity 6. Temperature cycle Mø min. (Initial value) No flashover or insulation breakdown mø max. (Initial value) No electrical discontinuity of ns or more Contact resistance : 4mø max. from initial value Insulation resistance : Mø min. Contact resistance : 4mø max. from initial value Insulation resistance : Mø min. 7. Durability (mating/un-mating) Contact resistance : 4mø max. from initial value 8. Resistance to soldering heat No deformation of components affecting performance. DM AA - SF - PEJ 5V DC 5V AC / one minute ma DC Frequency : to 55Hz, single amplitude of.75mm, hours / 3 axis 96 hours at temperature of 4ç ± ç and humidity of 9% to 95% Temperature : -55ç/ +5ç to +35ç/ +85ç/ +5ç to +35ç Duration : 3 / 5 / 3 / 5 (Minutes) 5 cycles cycles at 4 to 6 cycles per hour Reflow : At the recommended temperature profile Manual soldering : 35ç for 3 seconds Note : Includes temperature rise caused by current flow. Note : The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation. Materials / Finish Component Material Finish Remarks Insulator Heat resistant thermoplastic compound Color: Black UL94V- Contacts Phosphor bronze Contact area: Gold plating Termination area: Tinned copper plating - Cover Stainless steel Termination area: Tinned copper plating - Others Stainless steel Piano wire Product Number Structure Series name Connector type 3 4 : DM : AA : Standard receptacle : B : Reverse receptacle - Nickel plating - 3 Terminal type SF : Right angle surface mount DSF : Reverse right angle surface mount 4 Eject mechanism codes PEJ : Card Push insert/push withdraw C4
Standard type BPCB mounting pattern 4.5±.5.7±.5 5.4±.5.4±.5 5±.5 P=.5±.5 +..35±.5 +. 9-.±.5 ±.5.±.5 Nov..6 Feb..8 Copyright 8 6 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 8 3. 9.75 8.5 t=.,w=.6 5 5.65 P.5 3.5 Part No. HRS No. DMAA-SF-PEJ(8) 69-4-8 8 4.5 (Card slot dimension).4 -Ø..55.9.5 3. 4.55 4-.5.75±.5 8.5±.5 9.±.5 3- +. +. No.4 No. No.3 No. No.9 No.5.6±.5 Card detection switch Write protection switch.±.5 No.6 No.7 No.8 indicates the center line of card slot. Card detection switch When card is ejected When card is inserted When card is ejected -Ø.3 +. 9. 3-.5 8.5.75 Write protection switch 4- +. When card is inserted WRITE PROTECT WRITE ENABLE OPEN CLOSE OPEN OPEN CLOSE 4.55±.5 3.±.5 Weight:.g BCard insertion/withdrawal dimensions 5 5 6 Card pushed-in for insertion Card fully inserted Card ejected (Card ejected dimension) C4
Reverse type BPCB mounting pattern -.5±.5.8±.5 P=.5±.5.5±.5 9.47±.5.8±.5.±.5 9.75±.5 8.5±.5.5±.5 5.65±.5.8±.5.4±.5 CARD DETECT COMMON FOR CD & WP Nov..6 Feb..8 Copyright 8 6 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 9.9 Part No. :Card ejected(card ejected dimension) (6):Card fully inserted (5):Card pushed for insertion 8.63 6.95 (4.35) HRS No. DMB-DSF-PEJ(8) 69-3-5 8.7 +. (Land) 7.65 5.6 A(5:) B(5:) C(5:).3 +. (Through hole) 8.68 6.85 8. +. (Land).8 +. (Through hole) (R.4) (R.6) 6-.65.5 9.9.85 7.45.9 +. -. (Land) 8.5±.5 3.5±.5.5 +. (Through hole).5.35 C A 8-.±.5 Center of Card dimension (.77). +. (Land).8 +. (Through hole) (R.4) (R.6) 3 A 5.6.3±.5.57±.5.3±.5 4.3±.5 4.5±.5.93±.5.4 +. -. (Land) +. (Through hole) No.7 No.6 No.5 No.4 No.3 No. No.8 No. No.9 7..4±.5 B WP. +. (Land).8 +. (Through hole) (R.4) 3.48±.5 6.98±.5 8.5±.5 (R.6) (.5) CLindicates the center line of the card slot. indicates the dimension of DIP terminals. Card detection switch When card When card is ejected is ejected OPEN CLOSE Write protection switch When card When card is ejected is ejected WRITE PROTECT WRITE ENABLE OPEN OPEN CLOSE Weight:.g C4
BPackaging specifications Embossed Carrier Tape Dimensions (Standard type) 45 pcs/reel.75±. Ø.5 +. 4±. ±.5 36±. 4.35±.3 3.4±.3 44±.3 Nov..6 Feb..8 Copyright 8 6 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 4.4±. 44±.3 4.4±..±..75±. ±.5 4±. Unreeling direction Embossed Carrier Tape Dimensions(Reverse type) 45 pcs/reel.±. Reel dimensions Ø.5 +. D Unreeling direction 36±. 4.6±.3 3.4±.3 Unreeling direction 44.4 + (Ø5) (Ø38) End section Mounting section(45) Lead section (4mm min.) Blank section(6mm min.) Embossed carrier tape Blank section (mm min.) Top cover tape C43
Powered by TCPDF (www.tcpdf.org) BRecommended Temperature Profile Nov..6 Feb..8 Copyright 8 6 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Temperature (ç) 5 5 5 5ç 3ç min. ç 9 to seconds Preheating Time (Seconds) Peak : 5ç MAX 5 seconds Soldering HRS test condition Solder method : Reflow, IR/hot air Environment : Room air Solder composition : Paste, 96.5%Sn/3.%Ag/.5%Cu (Senju Metal Industry, Co., Ltd.'s Part Number:M75-GRN36-K-V) Test board : Glass epoxy 6mm mm.mm thick Metal mask :.5mm thick Number of reflow cycles : cycles max. The temperature profiles shown are based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume / thickness and board size / thickness. Consult your solder paste and equipment manufacturer for specific recommendations. C44