Product Guide Direct Contact Liquid Cooling Industry leading data center solutions for HPC, Cloud and Enterprise markets. www.coolitsystems.com Phone: +1 403.235.4895
The Future of Data Center Cooling CooIIT Systems Innovates and Delivers CoolIT Systems is the world leader in energy efficient liquid cooling solutions for HPC, Cloud and Enterprise markets. As an experienced innovator with over 60 patents and more than 2 million liquid cooling units deployed in desktop computers, servers and data centers around the world, CoolIT's Direct Contact Liquid Cooling (DCLC ) technology is the top choice for OEMs and system integrators. Proven Technology Selling 30-40,000 units/month >2M units deployed worldwide 99.998% leak free and improving 60+ issued patents Worldwide Service Network Since 2001, CoolIT has been dedicated to innovating and manufacturing reliable liquid cooling technology. In order to provide superior manufacturing and service capacity to its growing list of global customers, CoolIT has engaged in a commercial partnership with STULZ, a world leading solution provider of energy efficient temperature and humidity management technology. With 7 production plants, 17 subsidiaries and more than 140 partners around the world, the strategic relationship with STULZ increases CoolIT's ability to better serve the data center industry with forward-thinking designs, solutions and services. Disclosed Customers Solution Partners Technology Partners CoolIT Systems, Inc. All rights reserved.
Direct Contact Liquid Cooling (DCLC Maximizing Data Center Performance ) Direct Contact Liquid Cooling (DCLC ) uses the exceptional thermal conductivity of liquid to provide dense, concentrated cooling to targeted surface areas. By integrating DCLC, dependence on fans, expensive air conditioning and air handling systems is drastically reduced, enabling extremely high rack densities, reduced power use and access to higher performance potential. Supported by options for data centers with or without facility water hook up, any server in any rack can be liquid cooled by CoolIT, and can immediately benefit from measurable OPEX savings. Performance Facilitate peak performance for higher powered or overclocked processors Efficiency Benefit from a significant reduction in total data center energy consumed Density Enable 100% utilization of rack and data center spaces Scalability Meet fluctuating demands through the ability to modify data center capacity Quiet Relieve employees from the disruption of screaming server fans Savings Generate immediate and measurable OPEX benefits and reduce overall TCO OPEX (annualized) Rack Density ASHRAE W3-W5 (2 C-45 C) warm liquid cooling eliminates the need for chilled water supply, delivering a rapid ROI. The initial cost of integrating liquid cooling is quickly offset by several factors: High density solutions require less data center equipment (racks, switches, etc.), lowering overall CAPEX Warm liquid cooling reduces OPEX by an average of 22% 22% REDUCTION Operating Expenses 80% INCREASE Rack Capacity www.coolitsystems.com Phone: +1 403.235.4895
A Modular Approach to Liquid Cooling Three simple steps to configure a cooling system for your unique application Rack DCLC utilizes a three module "building block" approach (Server Module, Manifold Module and Heat Exchange Module) that provides a tremendous amount of product flexibility when integrating liquid cooling into any compute environment or configuration. Step 1: Select Server Module CoolIT Systems' Server Modules can cool any combination of CPU, GPU and Memory components, with customization available for VR, ASIC, FPGA and other devices. Servers remain hot-swappable and simple to service. CPU Cooling: CoolIT's R4, RP2 and RX1 (purpose-built for Intel Xeon and Intel Xeon Phi) are passive CPU cooling solutions managed by centralized pumping architectures. These coldplate assemblies are specifically designed to accommodate lower profile footprints, such as 1U blades and other custom chassis. GPU Cooling: CoolIT's GPU cooling product line supports passive coldplate assemblies for NVIDIA and AMD. Designed specifically to support NVIDIA Tesla P100 GPU accelerator, the CoolIT GP1 is a full coverage coldplate that enables NVIDIA Pascal SXM2 solutions in 1U applications. Memory Cooling: CoolIT's full coverage Memory Cooling solutions are designed for standard height memory modules and custom configurations. Routing coolant directly above the DIMMs simplifies design and maximizes serviceability. Combined with processor coldplates, 80% of total server heat can be captured by liquid. A key component of the Server Module, CoolIT Systems patented Split-Flow Coldplates are solid copper components which deliver superior performance for today s high thermal density processors. The Split-Flow design uses microchannel architecture to minimize pressure drop, maximize coolant flow, and direct the coolest liquid to the hottest area of the processor first. At only 2.4mm in height, Coldplates are easily integrated into extremely compact, low-profile blade architectures, and allow for optimal performance. Custom Coldplate designs are available. CoolIT Systems, Inc. All rights reserved.
Step 2: Select Manifold Module The Rack DCLC Manifold Module manages liquid distribution between the Heat Exchange Module and any number of Server Modules. Manifold Modules can be customized to suit any server or rack environment. CoolIT Systems Manifold Modules are incredibly reliable and robust, utilizing a stainless steel body combined with 100% non-drip quick disconnects. Rack Manifold: Made with reliable stainless steel and 100% non-drip quick disconnects, CoolIT's Rack Manifolds can be installed horizontally or vertically for connection at the front or back of the rack. Chassis Manifold: User-friendly Chassis Manifold design deploys blind-mate quick disconnects to integrate into blade-style chassis and accommodates small misalignments when connecting server. Dry-break Quick Disconnects: Stäubli is CoolIT's expert choice for quick disconnect technology. Featuring double shut-off valves, these 100% non-drip quick disconnects are made of metal to ensure long-lasting component reliability. Step 3: Select Heat Exchange Module While Server Modules and Manifold Modules are installed with each system and are local to the rack, the appropriate heat rejection method may vary. CoolIT Systems' Rack DCLC product line offers a variety of Heat Exchange Modules depending on load requirements and availability of facility water, including CHx (Liquid-to-Liquid), AHx (Liquid-to-Air) and custom options. CHx Modules (Liquid-to-Liquid) AHx Modules (Liquid-to-Air) Customized solutions for your unique environment www.coolitsystems.com Phone: +1 403.235.4895
Liquid-to-Liquid heat exchanger which manages a network of IT cabinets The CHx650 Module manages the distribution of clean, treated coolant to and from a network of IT cabinets. This stand-alone CHx accepts ASHRAE W3-W5 warm facility water and can support 650kW of processor load per network. The CHx650 Module is customizable to fit various data center environments. Standard equipment groups offer N+1 redundancy, and when deployed can provide tier 4 resiliency. Key Features Manages 650kW of IT load ASHRAE W3-W5 (2 C-45 C) warm water cooling Redundant centralized pumps Integrated control and monitoring system (Webserver, Modbus, IPMI, SNMP) 4 LCD screen with touch functionality Internal leak detection system Stand-alone solution Integrated fill-pump Key Benefits Warm water cooling reduces the need for chillers Quick and easy installation and service Significantly reduces OPEX Reduces the need for CRACs Isolates facility water from racks Serviceable onsite - no down time for maintenance High temperature return water can be used for heat re-use CHx650 Module Cooling Cooling Capacity Capacity Maximum Cooling Load (kw) vs. Facility Liquid Input Temperature ( C) Capacity (kw) 1000 750 500 250 Cooling Capacity (@ 30 C facility liquid) Power Consumption (Max) Racks per Solution ROI (months) 650kW 4.2kW 5-20 1-6 0 10 20 30 40 50 Facility Liquid Integration Yes Facility Input Temperature ( C) CoolIT Systems, Inc. All rights reserved.
Liquid-to-Liquid heat exchanger which manages a single IT cabinet The CHx80 Module meets today's most demanding HPC requirements. Capable of managing 80kW+ of heat load in a remarkably small 4U of space, this system provides cooling for 120 servers or more. The CHx80 is an extremely efficient heat exchanger that uses ASHRAE W3-W5 warm water to manage processor and component heat. As a result, users can expect a significant reduction in data center OPEX. Key Features Manages 80kW+ cooling capacity per rack ASHRAE W3-W5 (2 C-45 C) warm water cooling Redundant centralized pumps Dry-break quick disconnects 4.3 LCD screen with touch functionality Integrated control and monitoring system (Webserver, Modbus, SNMP) Internal and external leak detection system 4U rack mount chassis Integrated fill-pump Key Benefits Warm water cooling reduces the need for chillers Manages 120+ servers per rack Quick and easy installation and service Uses only 652W Can be located anywhere in a rack High temperature return water can be used for heat re-use CHx80 Module Cooling Capacity Total Cooling Capacity (W) vs. Facility Flow Rate (L/min) @ Varying Facility Liquid Temperatures ( C) Max Power (W) 120000 100000 80000 60000 40000 20000 0 15%PG Coolant (Secondary and Primary), 40L/min Seconday Flow Facility water temperature 20 C 30 C 40 C 20 25 30 35 40 45 50 55 60 65 70 Facility Flow Rate (L/min) Cooling Capacity (@ 30 C facility water) Power Consumption (Max) Racks per Solution ROI (months) Facility Water Integration 80kW 652W @ 115VAC 1 1-6 Yes www.coolitsystems.com Phone: +1 403.235.4895
Liquid-to-Liquid heat exchanger which manages a single IT cabinet The CHx40 Module manages the distribution of coolant and heat exchange within a single IT cabinet. This 2U CHx accepts ASHRAE W3-W5 warm facility water and manages 40kW+ of processor load per rack. Key Features Manages 40kW+ cooling capacity per rack ASHRAE W3-W5 (2 C-45 C) warm water cooling Redundant centralized pumps Integrated control and monitoring system (Webserver, Modbus, IPMI, SNMP) 4.3 LCD screen with touch functionality Internal leak detection system Dry-break quick disconnects 2U rack mount chassis Key Benefits Warm water cooling reduces the need for chillers Manages 50+ servers per rack Quick and easy installation and service Dramatically increases CPU/GPU density Reduces the need for CRACs High temperature return water can be used for heat re-use CHx40 Module Cooling Capacity CHx40 Cooling Capacity Maximum Cooling Load (kw) vs. Facility Flow Rate (L/min) Cooling Capacity (kw) 60 50 40 30 20 10 Facility water temperature 20 C 30 C 40 C Cooling Capacity (@ 30 C facility water) Power Consumption (Max) Racks per Solution ROI (months) Facility Water Integration 40kW 110-120W 1 1-6 Yes 0 10 20 30 40 Facility Flow Rate (L/min) CoolIT Systems, Inc. All rights reserved.
Liquid-to-Air heat exchanger which manages powerful clusters in limited space The AHx20 Module packs an incredible amount of heat load management into a small form factor. Available in top-of-rack or in-rack configurations, this AHx solution provides superior processor performance and enables very high densities. The AHx20 Module is perfect for compute environments that are short on space, big on compute, and do not have access to facility water. Key Features Manages 20kW+ cooling capacity per rack No facility water required Redundant centralized pumps Integrated control and monitoring system (Webserver, Modbus, IPMI, SNMP) 4.3" LCD screen with touch functionality Internal leak detection system Dry-break quick disconnects Key Benefits Dramatically increases CPU/GPU density Stand-alone rack-based liquid cooling Monitor system health remotely Easily upgradable to CHx Module AHx20 Module Cooling Capacity Maximum Cooling Load (kw) vs. Facility Air Inlet Temperature ( C) 30 Cooling Capacity (@ 25 C facility air) 20kW Capacity (kw) 22.5 15 7.5 0 10 20 30 40 50 Power Consumption (Max) Racks per Solution ROI (months) Facility Water Integration 300W 1 1-12 No Facility Air Inlet Temperature ( C) www.coolitsystems.com Phone: +1 403.235.4895
Case Studies Customer: Poznan Supercomputing and Networking Center Objective: Double compute capacity within existing infratructure and floor space HPC Setup 1.8 petaflops cluster 2 CoolIT Systems Rack DCLC CHx650 CPU, RAM and VRM cooled by liquid 30kW per rack 40-45 C primary fluid supply temperature Huawei E9000 chassis Huawei CH121 server 1,232 Huawei blade servers across 19 racks Results 85% of total IT load managed by liquid cooling 75% fan speed reduction Waste energy reused to heat surrounding buildings Ranked on TOP500 and Green500 lists Greenest supercomputer in Poland Reducing energy usage and lowering operating costs are permanently on our checklist when planning for new High Performance Computing clusters. Liquid cooling is the most efficient way to achieve our objectives and we are seeing excellent results and reliability from the combined Huawei and CoolIT Systems cluster. Radoslaw Januszewski, IT Specialist, PSNC Customer: Center for Biological Sequence Analysis at Denmark Technical University Objective: Maximize energy efficiency within containerized space HPC Setup CoolIT Systems Rack DCLC CHx40 Dual CPU liquid cooled server modules HP ProLiant DL560 Gen8 servers Modular data center 45 C primary fluid supply temperature 14kW total rack load (130W CPUs x 108) 563 gigaflops per server (at peak performance) Results 72% of total IT load managed by liquid cooling Waste energy reused to heat surrounding buildings Ranked on TOP500 List of Supercomputing Sites An important goal for CBS-DTU was provisioning these computational resources as efficiently as possible. CoolIT delivered a liquid cooled system that lowers the energy consumed for cooling and provides opportunities to reuse the waste heat from the servers. Peter Løngreen, Head of HPC, CBS-DTU CoolIT Systems, Inc. All rights reserved.
Chip-to-Atmosphere One Unified Solution and Service Vendor STULZ and CoolIT Systems have partnered to deliver innovative cooling solutions and worldwide service support to the data center industry. Chip-to-Atmosphere cooling solutions allow customers to capture dense heat loads at the source (inside the servers) and efficiently move it to the outside atmosphere. STULZ is world-renowned for its precision cooling products which are combined with CoolIT's industry leading Rack DCLC technology. The result is ultra-efficient total thermal solutions that support any OEM server at even the highest density configurations - all through one unified vendor. When integrated, CoolIT Systems' Rack DCLC solution can capture 60-80% of the servers' heat directly into liquid. To compliment this, STULZ precision cooling products capture the balance of the lower density heat efficiently. A considerable benefit forms when the total heat energy from both systems is consolidated, transported outside and then dissipated or recaptured for reuse, to heat nearby buildings, for example. The modular Chip-to-Atmosphere approach combines CoolIT's DCLC solutions with STULZ-engineered precision cooling systems to address high density data center configurations for today and tomorrow. 1. Server Module 2. Manifold Module 3. Heat Exchange Module 4. Precision Air Conditioner 5. Heat Rejection System STULZ Micro DC High density, stand-alone Micro Data Center liquid cooling solution STULZ Micro DC provides a completely enclosed, high-density computing environment that is suitable for applications beyond the typical white space. The Micro DC offers a significant reduction in size for highly dense heat load applications employing a combination of cooling from an integral precision cooling unit and direct contact liquid cooling. With support for racks up to 64kW, the Micro DC is the ideal solution to manage high performance computing requirements in any environment. Configurations can be purpose built to include various options for heat rejection. Typical IT and Cooling Configuration All cooling managed within rack structure with integrated STULZ CyberRow and CoolIT Systems' Rack DCLC system: Single 48u rack 1 STULZ CyberRow unit (N+1 available) 1 CHx80 Heat Exchange Module (4u) 100% of servers equipped with CoolIT Rack DCLC: ppue = 1.24 64 kw of servers equipped with DCLC 70% = 44.8 kw liquid cooled 30% = 19.2 kw air cooled For more information contact your CoolIT Systems sales representative. www.coolitsystems.com Phone: +1 403.235.4895
@coolitsystems sales@coolitsystems.com www.coolitsystems.com Phone: +1 403.235.4895