Selective Soldering. from InterSelect Germany. of Selective Soldering Machines. Perfect Service. German Quality.

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The new Generation of Selective Soldering Machines Worldwide Network. Innovative Products. Perfect Service. German Quality. Selective Soldering from InterSelect Germany A wide range from a small stand-alone unit to modular In-Line machines. IS-B-335/460/650 Stand-alone unit IS-I-460/700 In-Line Simple, flexible and cost-saving at optimum process reliability.

IS-B-335/460/650 Selective Stand-alone Soldering Systems The InterSelect 335, 460 und 650 stand-alone selective soldering systems are designed to meet the needs of lean manufacturing in combination with flexibility and throughput at minimal cost. IS-B-335S, IS-B-460S/D/P and IS-B-650S/P selective soldering systems are completely automated stand-alone systems with a unique manual hand loaded sliding system, able to handle boards up to 650x650mm (25.6 x25.6 ). The most economic machine, the IS-B-335 needs just 1 sqm of space. All soldering units are equipped with our inert hot nitrogen atmosphere for better soldering results and to assist the prevention of oxidation. Each solder pot comes with this inert atmosphere feature. As well as all machines come with a micro jet fluxer system for clean soldering results and very low flux consumption. All machines can be equipped with a unique large top and bottom side preheating system, controlled by a pyrometer. All process parameters are ready for data transfer. The best machine in its class, with unique features Unique Features The large soldering area can handle almost every board IS-B-335: 335 x 335 mm IS-B-460: 460 x 460 mm IS-B-650: 650 x 650 mm Smallest footprints in its class IS-B-335: just 1 m² IS-B-460: just 1,45 m² IS-B-650: just 2,25 m² Large adjustable, energy-efficient top and bottom preheaters (heater size matches PCB size) IS-B-335: adjustable 1,5 to 4,5 kw per side IS-B-460: adjustable 1,5 to 6 kw per side IS-B-650: adjustable 1,5 to 7,5 kw per side Optional Standard Features Automatic laser wave height control an correction Integrated PC with Windows 7 features the user-friendly software Laser pyrometer control with profiling Network-comapatible remote maintenance Multi wave for extremely fast cycle times Mini wave for solder joints with close components Create soldering program while the machine is running with the optional IS Photoscan offline programming software 7 and 0 axis system enable use of wetable and jet nozzles This stand-alone selective concept covers six basic machines: IS-B-335S IS-B-460D 1 x Solder pot 2 x Solder pots for different alloys IS-B-460S IS-B-460P 1 x Solder pot 2 x Solder pots for double speed 2 x Micro Drop Fluxer for double speed 50% cycle time IS-B-650S IS-B-650P 1 x Solder pot 2 x Solder pots for double speed 2 x Micro Drop Fluxer for double speed 50% cycle time

IS-I-460S and IS-I-700S modular In-Line Selective Soldering Systems The InterSelect In-Line and modular selective soldering systems are designed to meet the needs of lean manufacturing in combination with flexibility and very high throughput at minimal cost. This concept covers three basic modules: Selective soldering module, Fluxing module and Preheat module The IS-I-460S and IS-I-700S are completely automated In-line and modular versions from InterSelect Germany which can handle boards up to 460x460mm (18 x 18 ) and 700x700mm (27,6 x 27,6 ). It has a SMEMA pass-through conveyor that features automatic conveyor width adjustment. The IS-I-460S and IS-I-700S combine very high throughput with precise process controls. The soldering unit is equipped with our inert hot nitrogen atmosphere for better soldering results and to assist the prevention of oxidation. Each solder pot comes with this inert atmosphere feature. The X, Y and Z axis moving solder pot system is installed in many machines and has proven its reliability. Also these machines are equipped with a unique top side designed preheating system, controlled by a pyrometer. All process parameters are ready for data transfer. The best machine in its class, with unique features Unique Features The large soldering area can handle almost every board IS-I-460: 460 x 460 mm IS-I-700: 700 x 700 mm smallest footprints in its class IS-I-460: just 1,1 m² IS-I-700: just 1,8 m² Large adjustable, energy-efficient top and bottom preheaters (heater size matches PCB size) IS-I-460: adjustable 1,5 to 6 kw IS-I-700: adjustable 1,5 to 7,5 kw Optional Automatic laser wave height control an correction Standard Features Integrated PC with Windows 7 features the user-friendly software Laser pyrometer control with profiling Multi wave for extremely fast cycle times Network-comapatible remote maintenance Mini wave for solder joints with close components Create soldering program while the machine is running with the optional IS Photoscan offline programming software The IS-I-460FM and IS-I-700FM are fluxing modules which can be set in line with the corresponding selective modules. While one board is soldered in the soldering module another board is fluxed in the fluxing module, so through put can be highly increased. Of course the fluxing modules also can be used as stand-alone fluxer. The IS-I-460PM and IS-I-700PM are preheat modules which can be set in line with the corresponding selective modules. While one board is soldered in the soldering module another board is preheated in the preheat module, so through put can be highly increased. Of course the preheating modules also can be used as stand-alone preheater. fluxing preheat Variant 1: IS-I-460S or IS-I-700S as individual soldering module: low throughput requirements or during introduction phase of a new product. Variant 3: fluxing module, preheat module and a IS-I- 460S or IS-I-700S soldering module: for high mass assemblies or longer preheat cycles. fluxing preheat Variant 2: two IS-I-460S or IS-I-700S soldering modules: high throughput requirements. Reduction of cycle time parallel processing with two boards in one time Variant 4: fluxing module, preheat module and two IS-I-460S or IS-I-700S soldering modules: for high mass assemblies and high throughput requirements.

VP Easy 500 Vapour Phase Soldering System The Vapor Phase - Reflow - System is a perfect and easy to handle unit for lead and lead free solder-paste to soldering complex SMT components like QFP, BGA, flip chip and as well ceramic assemblies can be soldered in highest quality. Through the small footprint construction you will find easy a place for this unit. To set up the unit you need only a 380V connection. Your Advantages competitive Soldering-System for future lead-free technological standards oxidation free pre-heat and soldering uniform temperature distribution in the process room repetitious process conditions small operating costs no preparation of temperature profiles necessary better solder results at lower solder temperatures compared to conventional reflow ovens Process Sequence Everyone can start with production very fast. You only have to put the boards in the large 500x500mm working area, then close the clamshell and press start bottom. Automatically the soldering process starts and after cooling down open the clamshell and take your boards off. The parameters are all computer controlled via Siemens controller. System Concept Putting up the Easy 500 is easily possible in every location. The Siemens SPS controls and regulates the heating -, liquid- and vapor temperature, and guarantees a perfect solder result. The Easy 500 recognized automatically the used medium and set up the correct parameters. The unit is equipped with a closed stainless steel cabinet and a cooling aggregate. Technical Details VP Easy 500 Max. PCB Dimensions 500 x 500 mm Max. PCB Height 120 mm Cycle Time ca. 6 min Process Temperature adjustable, max. 260 C Capacity Medium ca. 3 kg Medium consumption ca. 1g per Cycle Connection 380V; 50/60Hz Power 5,5 kw System Dimensions 750 x 750 x 1100 mm (w/l/h) Weight 200 kg A Soldering-System for future lead-free technological standards: FinePitch BGA / QFP etc. 0201 / 01005 etc.

S-10 Selective Soldering- and De-Soldering System The Mini-Wave-System S-10 is perfect for soldering and desolder through hole components on PCBs. In the process the S-10 generates a solder wave which can be trimmed suitable for each different component by choosing one of a variety of nozzles. Besides our standard nozzles all kinds of custom nozzles can be provided. By triggering a foot switch the soldering process can be started and the wave raises until it touches the pins of the component. The temperature, soldering time and the height of the wave can be preadjusted and is digital controlled digital controller regulates: Solder temperatur Soldering time Wave height Nitrogen on/off Laser on/off 30 soldering profiles can be stored to the controller Overhead locator laser light pinpoints position for centering component over the wave. A large selection of nozzles for all component sizes is available. Height adjustable stainless steel platform Nitrogen supply (Option) Easy to change bayonet mount nozzles Technical Details S-10 Power 230V 50/60Hz Max. solder temp. 360 C Solder capacity 25 kg Dimensions 420 x 660 x 432 mm Weight 20 kg Warm-up time ca. 45 min various standard nozzle are available: 14-20 pin 24-28 pin 30-48 pin PGA PGA PGA Connector Connector 25x13mm 38x19mm 64x19mm 25x25mm 38x38mm 50x50mm 70x 9mm 102x19mm Custom nozzles available 10 20 30 40 50 60 70 80

Board Handling Transport System and Accessories We provide an extensive repertoire for PCB handling for automatic manufacturing production lines. Automatic circuit board loader and unloader, magazines, conveyor belts and many more. All from one source. Single Magazine Loader for PCB 50 460 mm Single Magazine Unloader PCB 50 460 mm Multi Magazine Loader PCB 50 460 mm Multi Magazine Unloader PCB 50 460 mm Inspection Conveyor 0,5-1,5 meter PCB 50 400 mm Standard Conveyor 0,5-1,5 meter PCB 50 400 mm SMT anti-statische Magazine model base material setting temperature C external dimensions (mm) adjustment range PCB size (mm) Length width height C-803 metal One Touch 85 355 320 563 50-250 350x(50-250) C-806 metal One Touch 85 460 400 563 50-330 460x(50-330) C-808 metal One Touch 85 535 460 570 50-390 535x(50-390) C-809 metal One Touch 85 535 530 570 50-460 350x(50-460) Highlights 1. surface resistance: 10 4 ~ 10 6 Ω 2. maximum temperature up to 85, optional up to 120 3. maximum amount of circuit boards per magazine: 50 pieces 4. simple one touch adjustment of the circuit boards 5. top and bottom completely made out of metal 6. compatible with all loaders and unloaders

Nitrogen Generator PN 1250/1350/1450 for purity up to 99,999% purity (Nm 3 /h) 95% 97% 98% 99% 99,5% 99,9% 99,99% 99,999% IS unit IS - PN 1250 5,79 5,04 3,15 1,26 0,63 1 solder pot IS - PN 1350 20,80 17,10 15,80 12,60 9,50 6,30 3,20 1,80 IS - PN 1450 31,20 25,60 23,70 18,90 14,20 9,50 4,80 2,40 1-2 solder pots 2 + solder pots IS - PN 1550 49,20 40,10 35,60 28,40 22,10 12,60 6,30 3,20 IS - PN 1650 84,00 59,90 63,80 46,60 37,80 23,20 11,70 5,80 IS - PN 1750 117,40 94,50 85,10 63,00 50,40 30,30 16,40 7,30 IS - PN 2000 140,70 116,50 98,30 77,50 63,00 38,80 19,40 9,70