Mobile, Multimedia & Communications. Tommi Uhari Executive Vice President MMC Group

Similar documents
2008 Mobile World Congress. February 12, Barcelona

Wireless Factory December 15. Michel Windal

Wireless. Gilles Delfassy. Senior Vice President Wireless Terminals Business Unit

Sustaining profitable growth in Mobile

3GSM Congress. Carlo Bozotti President and Chief Executive Officer

GPS AND MOBILE HANDSETS

Barclay s 2009 Worldwide Wireless and Wireline Conference

Case No COMP/M STM / NXP / JV. REGULATION (EC) No 139/2004 MERGER PROCEDURE. Article 6(1)(b) NON-OPPOSITION Date: 27/06/2008

SMARTPHONE MARKETS AND TECHNOLOGIES

STMicroelectronics. Citigroup Technology Conference. Carlo Ferro Chief Financial Officer September 3, 2008

Q4 & FY 2008 Financial Results

Mixed-Signal Analog. C.S. Lee. Senior Vice President High-Volume Analog & Logic

Chipset) Industry Report, 2009

Dr. Sanjay Jha. COO, Qualcomm President, Qualcomm CDMA Technologies. Lehman Brothers Global Technology Conference December 6, 2007

Integrated mobile processors to challenge standalone application processors, says Petrov Group (part 2)

Managing the downturn, Ready for the Upswing

2010: TRANSITION & TRANSFORMATION

STMicroelectronics NATIXIS Payment Solutions Conference

Global a nd and China Mobile Mobile Phone Baseband Report,

Spreadtrum Communications, Inc. Investor Presentation 4Q12

Successful Strategies for Mobile and Wireless Businesses. Loic LIETAR Corporate VP, Corporate Business Development, STMicroelectronics

TCL and Thomson Creating a New Global Leader in the TV Industry

Investor Relations Presentation

Press Release January 22, 2010

The future of communications

The future of communications

STMicroelectronics Payment Solutions. December 6 th 2012

Technology for Innovators TM TI WIRELESS TECHNOLOGY DELIVERING ALL THE PROMISE OF 3G

Signal Processing IP for a Smarter, Connected World. May 2017

CSR Investor Presentation

The next billion mobile phone users

Multimedia Convergence & ACCI Sector Overview

IFX Day Secure Mobile Solutions. Dominik Bilo CMO Secure Mobile Solutions Business Group. November 16, Munich. IFX Day 2004.

ST-Ericsson reports fourth quarter 2010 financial results

DSP. Mike Hames. Senior Vice President Application-Specific Products

Archive 2017 BiTS Workshop- Image: Easyturn/iStock

MEMS & Advanced Analog

ST-Ericsson reports second quarter 2010 financial results

New York Analyst Day. November 12, 2009

New York Analyst Day. November 13, 2008

Mobile Handset RF (Radio Frequency) IC Industry Report,

Investor Presentation. December, 2007

Phone Wars The Hardware

Semiconductor Market Outlook. Analog Semiconductor Leaders' Forum October 2011

Global and China Mobile Phone Baseband Industry Report, Dec. 2010

Wearable Technologies and the IoT. David Lamb Market Development Manager, North Europe STMicroelectronics

Industry Landscape in Mobile Comupting.

Microcontrollers. Claude Dardanne Executive Vice President, General Manager, Microcontrollers, Memory & Secure MCU Group.

RESEARCH BULLETIN MARCH 27, 2013

Electronics_. Singapore - Global Electronics Hub. At a Glance

White Paper. The Case for Developing Custom Analog. Custom analog SoCs - real option for more product managers.

Location As A service KA Band Bologna 2015

Investing for Innovation. Warren East CEO

Hans Vestberg. President and ceo

ST Business & Operations

Nasdaq: DAIO. Anthony Ambrose. President and CEO. Data I/O Corporation May 2017 B. Riley & Co. Conference -- Investor Presentation

Smartphone Evolution and Revolution

Transceiver Strategies for 3.5G Handsets Next Generation Handsets Series

Nomadic devices Benefits and market outlook

Trends in R&D Investments Global ICT Companies 2007 to 2011

Thomas Seifert Senior Executive Vice President and General Manager, Memory Products Group

Global and China Mobile Phone & Tablet PC Processor Industry Report, May 2011

Current Analysis Webinar

ARM Holdings plc Morgan Stanley 7 th Annual TMT Conference 14 November Warren East Chief Executive Officer

Infineon On The Move. Peter J. Fischl Executive Vice President & CFO Infineon Technologies AG. CSFB Conference Miami/FL, USA March 4, 2005

IFX Day Campeon June 24, 2010 Peter Bauer Member of the Management Board Chief Executive Officer

A backward glance and a forward view

HVB Group German Investment Conference

HOME NETWORKING SEMICONDUCTOR VENDORS

NXP Connects the Car 25 Jul. 2013

Corporate Presentation. September 2004

Next generation BlueMoon Family

Annual General Meeting. A pioneer in technologies for Digital Radio and Smart Audio devices 9 th May 2017

Printing and Personal Systems

Standalone application processors are wining in mobility markets, says Petrov Group

Capital Markets Day Rick Simonson Chief Financial Officer

Technologies Driving Growth & Innovation in Automotive Electronics Vishal Suresh Asst. Director Business Development & Strategic Partnerships

Connectivity and Audio

What Operators Want vs. What Device Vendors Provide, Conflict?

Production Surge Boosts Automotive Semiconductor Market

Infineon Communication On The Move

WIRELESS M2M AND MOBILE BROADBAND DEVICES

Technology & Manufacturing. Laurent Bosson Executive Vice President Front End Technology & Manufacturing

Half Year Results FY th December,

Business update: Automotive

Imaging, BiCMOS ASIC and Silicon Photonics. Eric Aussedat Executive Vice President General Manager, Imaging, Bi-CMOS ASIC and Silicon Photonics Group

$2.65B. Microcontrollers & Digital ICs Group. MDG: Group at a Glance Key Financial Data by Sub-Group +25% -7% +34% +3% 32% of ST 2017 revenues $0.

Technology in Action. Chapter Topics. Participation Question. Chapter 8 Summary Questions. Participation Question 8/17/11

Connected & Smart Home Research Package

Spreadtrum Communications, Inc.

European nanoelectronics innovation: One strategy Multiple instruments

Technology in Action. Chapter 8 Mobile Computing: Keeping Your Data on Hand. Copyright 2010 Pearson Education, Inc. Publishing as Prentice Hall

Delivering in Consumer. Leon Husson Executive Vice President Consumer Businesses Semiconductor Division

i.mx Product Family and Freescale codec offering to meet Automotive and Industrial Requirements

CTIS 487: Lecture Notes 1

Regional Market Trends. Robert Andersson Executive Vice President, Customer and Market Operations

Financial Review Rick Simonson Chief Financial Officer

Technology and Manufacturing

Manufacturing in the More-than-Moore era

UWB, The Ultimate Choice for PAN Technologies. Dave Sroka PL WUSB/USB International Product Marketing Manager

Transcription:

Mobile, Multimedia & Communications Tommi Uhari Executive Vice President MMC Group

2007 Accomplishments Leading positions* # 1 in Analog/mixed signal # 1 in 3G RF # 3 in Wireless Focus on high-growth segments and leading customers Complete mainstream multimedia platform with modem Positive momentum in 2007 EMP business ramped up 3X growth in connectivity Strong demand from existing customer base *Source: isuppli, ST 2

ST Wireless Revenues (ex Flash) Last Twelve Months in US$M LTM Wireless Revenues = $2.28B (+11% Y-o-Y) Q108 (+18% Y-o-Y) 700 600 500 400 300 200 100 0 Q106 Q206 Q306 Q406 Q107 Q207 Q307 Q407 Q108 3

Handset Market Remains Concentrated 2% 100% Top 5 Handset OEMs 1% 80% 60% 0% 2006 2007 40% RIM Apple 20% Innovation in Smartphones is driving share gains 0% 2004 2005 2006 2007 Nokia Samsung SEMC LG Motorola Source: ST and ABI Research 4

but Wireless Semi Market is Fragmented Mastering all the key products and IPs is necessary for success ST is working with all of the top 5 players and several of the emerging leaders ST/NXP joint venture started consolidation of the fragmented semi market 100% 80% 60% 40% 20% 0% Handset OEMs Wireless Semi TOP 5 TOP 15 Others Source: ST, isuppli and ABI Research 5

ST Mobile Strategy Technologies Multimedia Connectivity Imaging Intellectual property Focus on leading global customers Consolidation 6

Wireless Multimedia Platform Ingredients ST Strengths Multimedia Analog/Mixed Signal CMOS RF Connectivity Design for Low Power SoC Integration Software Integration Reference Design Partnering Processor Cellular Modem IP High-Level OS 32nm and beyond 7

Complete Wireless Multimedia Platform RF Front End Before SW Integration perimeter After SW Integration perimeter RF RF Front End RF DBB MS-ABB APE Connectivity 3G+ Stack DBB Modem IP IP APE MS-ABB Connectivity ASIC ASSP Licensed IP 8

Successful Parallel Business Models ASICs Platform Flexible Product Offering Required Nokia Samsung Motorola SEMC LG Emerging Leaders 9

Leadership in Wireless ASICs Major presence at tier-one OEMs Emphasis on fast-growing 3G segment Strong position in 2G / 2.5G / 2.75G RF, analog / mixed signal and DBB Record sales & shipments High-volume manufacturing capability Outstanding supply chain 10

Wireless Multimedia Platform NOKIA-ST technology agreement on 3G Leading chipset supplier to Nokia 45nm; production 2010 Nomadik platform shipping to 3 tier-one customers Nokia, LG, Samsung Pre-integration platform Symbian/S60 platform Cameras WLAN Bluetooth Energy management MEMS and TV-Out devices Next-generation Nomadik introduced at 2008 MWC 3-D graphics Adaptable for modem integration 11

Product Highlight: 3G Digital Baseband EMP DBB shipments 3X unit growth expected in 2008 ST continues to be a strategic partner to EMP in technology nodes beyond 90nm 12

Product Highlights: Connectivity WLAN handset market share >30% Bluetooth handset market share from standing start to >10% in 2 years ST connectivity products designed-in >150 phones; over half on the market today Increasing presence at 4 of top 5 Ramping up Bluetooth headsets 13

ST s Imaging Business Sensors Camera modules Image processors Business model 14

Product Highlights: Imaging Leading pixel performance Expanding our customer base Reflowable cameras shipping in volume Transitioning to wafer level camera 3MP Digital Auto-focus sampling Moving to higher resolution sensor Design win for 5MP sensor Diversifying customer base 25% of 2008 Imaging sales will be outside largest customer 15

US$ MM 6,000 5,000 4,000 3,000 2,000 1,000 0 Source: Company Information 16 Qualcomm Texas Instruments ST/ NXP Wireless STMicroelectronics Infineon Technologies NXP MediaTek Broadcom Freescale Semiconductor RF Micro Devices Renesas Technology Skyworks Solutions CSR Marvell Technology Group Intel Samsung Electronics Creating a Clear #3 Player in Wireless 2007 Ranking (est.) 1. Qualcomm 2. TI 3. ST/NXP 4. Mediatek/ADI 5. Infineon/Agere 6. Freescale 7. Broadcom 22% 18% 14% 6% 5.5% 5% 2.4%

Complementary Customers and Products ST Leading supplier to Nokia and EMP Leading 3G and Multimedia technology Strong Connectivity supplier NXP Wireless Leading supplier to Samsung Established 2G platform supplier to tier-one and tier-two handset OEMs TD-SCDMA (Chinese standard) Strong Connectivity supplier Combination NewCo will become a leading supplier to Nokia, Samsung and SEMC Strong opportunity to build 2G/2.5G market share at major customers Critical scale of revenue to sustain leading edge R&D roadmap Hedge against timing of 3G market transition Enhanced position in Connectivity through complementary products offering Consolidate leadership in RF and Energy Management Leverages ST s industrial base by significantly increasing Advanced CMOS wafer volumes High level of identified cost synergies in excess of $250M in 2011 17

Market Leading Product Portfolio + Wireless Assets Emerging but well positioned: GPS Baseband BT combos #3 or #4 #1 RF TRx PMU / ABB FM standalone USB WLAN Source: ST, NXP 18

Wireless Roadmap + Wireless Assets Multimedia Platform + TD-SCDMA 3G+ MODEM Digital Baseband Connect. Combos Analog / RF / PMU + 2G / 2.5G / 2.75G single-chip + GPS, USB-Audio and Acc, UWB + RFCMOS Imaging MEMS 2008 2009 19

Complete Portfolio for Mobile Applications + Wireless Assets User Interface Displays Keyboard Speakers Microphones Cameras Sensors Audio Accessories (USB headsets) Connectivity Multimedia Processing BT UWB WLAN USB Application Processors Multimedia Co-processors Application Software FM GPS VoIP UMA DRM Broadcast Digital Radio Broadcast TV Baseband Processor GSM/GPRS/EDGE/UMTS/LTE Telecom Software JV solution Via Parents PMU Smart card Security SIM PA RF Via Partners Cellular Pipe 20

Conclusion Delivered results in 2007, positive outlook for 2008 and beyond 3G market growth is supporting our wireless strategy Successfully expanding customer base Well positioned and committed to ASICs Platform business is ramping Mobile multimedia is becoming mainstream Wireless multimedia, imaging and connectivity create a unique and complete platform Merger of ST/NXP wireless businesses will create a wireless leader 21