+5V, 20Mbps PROFIBUS RS485/RS422 Transceivers Advanced Failsafe, 1/8th Unit Load, ±15kV ESD-Protected

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SP1486E +5V, 20Mbps PROFIUS RS485/RS422 Transceivers Advanced Failsafe, 1/8th Unit Load, ±15kV ESD-Protected FEATURES Recommended for PROFIUS applications High differential output drive, minimum 2.1V into 54Ω load 5.0V Single Supply Operation 1ns driver and receiver skew 20 Mbps data rate 1/8th Unit Load, 256 transceivers on bus Robust ESD Protection for RS485 pins ±15kV Air-Gap Discharge ±15kV Human ody Model ±8kV Contact Discharge Hot Swap glitch protection on control inputs Receiver failsafe on open, short or terminated lines Driver short circuit current limit and thermal shutdown for overload protection Very low 300μA static power consumption 1μA shutdown mode 1 2 3 4 RO RE DE DI D R SP1486E V CC APPLICATIONS High Speed RS485 Communications Industrial Process Control PROFIUS applications A GND 8 7 6 5 +5V RT 100nF DESCRIPTION SP1486E is a half duplex differential line transceiver suitable for high speed bidirectional communication on multipoint bus transmission lines. Each device contains one differential driver and one differential receiver. Devices comply with TIA/EIA-485 and TIA/EIA-422 standards and also meet the higher drive and tighter skew requirements of PROFIUS applications. Lead-free and RoHS compliant packages are available for all models. PROFIUS is in wide use in industrial control and automation applications and the SP1486E is ruggedized for use in harsh operating conditions. Receivers are specially designed to fail-safe to a logic high output state if the inputs are left un-driven or shorted. All RS485 bus-pins are protected against severe ESD events up to ±15kV (Air-Gap and Human ody Model) and up to ±8kV Contact Discharge (IEC 1000-4-2). Drivers are protected from excess current flow caused by bus contention or output short-circuits by both an internal current limit and a thermal-overload shutdown. Devices are rated for Industrial (-40 to +85ºC) operating temperature. Receivers have exceptionally high input impedance, which places only 1/8th the standard load on a shared bus. Up to 256 transceivers may coexist while preserving full signal margin. All devices operate from a single 5.0 V power supply and draw negligible quiescent power. oth driver and receiver can be enabled and disabled independently and the device enters a low power shutdown mode if both driver and receiver are disabled. The bus-pin outputs of disabled modules are in high impedance state. The high impedance driver output is maintained over the entire common-mode voltage range from -7 to +12V. 1

PIN ASSIGNMENTS Pin Name Pin Function Pin Function 1 RO Receiver Output. When RE is low and if (A ) -40mV, RO is High. If (A ) - 200mV, RO is low. 2 RE Receiver Output Enable. RO is enabled when RE is low. When RE is high, RO is high impedance. Drive RE high and DE low to enter shutdown mode. RE is a hot-swap input. 3 DE Driver Output Enable. When DE is high, outputs are enabled. When DE is low, outputs are high impedance. Drive DE low and RE high to enter shutdown mode. DE is a hot-swap input. 4 DI Driver Input. With DE high, a low level on DI forces non-inverting output low and inverting output high. Similarly, a high level on DI forces non-inverting output high and inverting output low. 5 GND Ground 6 A Non-inverting Receiver Input and Non-inverting Driver Output 7 Inverting Receiver Input and Inverting Driver Output 8 Vcc Positive Supply Vcc. ypass Vcc to GND with a 0.1uF capacitor. 2

Absolute Maximum Ratings These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. Supply Voltage (VCC)...+ 7.0V Input voltage at control input pins (RE, DE)... -0.3V to Vcc+0.3V Driver input voltage (DI)...-0.3V to Vc c+0.3v Driver output voltage (A, )...+13V Receiver output voltage (RO)...-0.3V to (Vcc + 0.3V) Receiver input voltage (A, )...+13V Package Power Dissipation...450mW @ Ta=25 C Maximum Junction Temperature... 150 C 8-Pin SOICN Øja =...128.4 C/W Storage Temperature...-65 C to +150 C RECOMMENDED OPERATING CONDITIONS Vcc=5V ±10%, Tmin to Tmax, unless otherwise noted, Typical values are Vcc=5V and Ta=25 C Recommended Operating Conditions Min. Typ. Max. Unit Supply Voltage, Vc c 4.5 5 5.5 V Input Voltage on A and pins -7 12 V High-level input voltage (DI, DE or RE), Vih 2 Vcc Low-level input voltage (DI, DE or RE), Vil 0 0.8 Output Current Driver -60 60 Receiver -8 8 V V ma Signaling Rate, 20 Mbps Operating Free Air Temperature, Ta Industrial Grade (E) -40 85 C Junction Temperature, Tj -40 150 C Note: The least positive (most negative) limit is designated as the maximum value. 3

ELECTRICAL CHARACTERISTICS PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Digital Input Signals: DI, DE, RE Logic input thresholds High, Vih 2.0 Low, Vil 0.8 V Logic Input Current Ta=25 C, after first transition ±1 μa Input Hysteresis Ta=25 C 100 mv Driver Differential Driver Output (VOD) No Load Vcc V Differential Driver Output Rl=100Ω (RS422) 2.1 Vc c Rl=54Ω (RS485) 2.1 2.7 Vc c V Differential Driver Output Vc m=-7 to +12V 2.1 2.7 Vc c Change in Magnitude of Differential Output Voltage (ΔVOD) (Note 1) Rl=54 or 100Ω ±0.2 V Driver Common Mode Output Voltage (Vo c) Rl=54 or 100Ω 3 V Change in Common Mode Output Voltage (ΔVOC) Rl=54 or 100Ω ±0.2 V Driver Short Circuit Current Limit -7V Vo u t +12V ±250 ma Receiver Receiver Input Resistance -7V Vc m 12V 96 KΩ Input Current (A, pins) DE=0, RE=0, Vcc=0 or 5.5V Vin=12V 125 Vin=-7V -100 μa Receiver Differential Threshold (VA-V) -7V Vc m 12V -200-125 -40 mv Receiver Input Hysteresis 25 mv Receiver Output Voltage Vo h Io u t=-8ma, Vid=-40mV Vcc-1.5 V Vo l Io u t=8ma, Vid=-200mV 0.4 High-Z Receiver Output Current Vc c=5.5v, 0 Vo u t Vc c ± 1 μa Receiver Output Short Circuit Current 0V Vro Vcc ± 95 ma Supply and Protection Supply Current IQ, Active Mode No load, DI=0 or Vc c 0.30 1 ma Shutdown Mode DE=0, RE=Vcc, DI=Vcc or 0 1 μa Thermal Shutdown Temperature Junction temperature 165 Thermal Shutdown Hysteresis 15 o C Notes: 1. Change in Magnitude of Differential Output Voltage and Change in Magnitude of Common Mode Output Voltage are the changes in output voltage when DI input changes state. 2. The transceivers are put into shutdown by bringing RE high and DE low. If the inputs are in this state for less than 50ns the device does not enter shutdown. If the enable inputs are held in this state for at least 600ns the device is assured to be in shutdown. In this low power mode most circuitry is disabled and supply current is typically 1nA. 3. Characterized, not 100% tested 4

Unless otherwise noted Vcc= +5.0±0.5V, ambient temperature Ta from -40 to +85ºC TIMING CHARACTERISTICS DRIVER CHARACTERISTICS: Conditions Min. Typ. Max. Unit Data Signaling Rate Duty Cycle 40 to 60% 20 Mbps Driver Propagation Delay (tphl, tplh) 12 20 ns Driver Output Rise/Fall Time (tr, tf) RL = 54Ω, CL = 50pF, 6 10 ns Driver Differential Skew (tplh tphl) 1 5 ns Driver Enable to Output High (tzh) 50 ns Driver Enable to Output Low (tzl) RL = 500Ω, CL = 50pF, 50 ns Driver Disable from Output High (thz) 50 ns Driver Disable from Output Low (tlz) 50 ns Shutdown to Driver Output Valid (tzv) 150 ns RECEIVER CHARACTERISTICS: Conditions Min. Typ. Max. Unit Data Signaling Rate Duty Cycle 40 to 60% 20 Mbps Receiver Propagation Delay (tplh, tphl) Cl=15pF, Vid=±2V, 40 ns Propagation Delay Skew (tplh, tphl) 1 5 ns Receiver Output Rise/Fall Time Cl=15pF 15 ns Receiver Enable to Output High (tzh) Cl=15pF, RL=1kΩ 50 ns Receiver Enable to Output Low (tzl) Cl=15pF, RL=1kΩ 50 ns Receiver Disable from Output High (thz) Cl=15pF, RL=1kΩ 50 ns Receiver Disable from Output Low (tlz) Cl=15pF, RL=1kΩ 50 ns Shutdown to Receiver Output Valid (trov) 3500 ns Time to Shutdown (Note 2,3) 50 200 600 ns FUNCTION TALES Transmitting Inputs Outputs RE DE DI A X 1 1 1 0 X 1 0 0 1 0 0 X High-Z 1 0 X Shutdown Receiving Inputs Output RE DE V A - V RO 0 X -40mV 1 0 X -200mV 0 0 X Open/shorted 1 1 1 X High-Z 1 0 X Shutdown Note: Receiver inputs -200mV < VA - V < -40mV, should be considered indeterminate 5

TYPICAL PERFORMANCE CHARACTERISTICS 60 50 0.35 0.3 I =8mA, V ID=-200mV 40 30 20 Output-Low Voltage (V) 0.25 0.2 Output Low Voltage (V) 0.15 10 0 0 1 2 3 4 5 Output Low Voltage (V) Output Current vs Receiver Output Low Voltage 0.1-60 -40-20 0 20 40 60 80 100 Temperature (ºC) Receiver Output Low Voltage vs Temperature 35 30 25 20 15 10 5 Output-Low Voltage (V) 4 I =8mA, V ID=-40mV 3.9 3.8 3.7 Output High Voltage (V) 3.6 0 0 1 2 3 4 5 Output High Voltage (V) Output Current vs Receiver Output High Voltage 3.5-60 -40-20 0 20 40 60 80 100 Temperature (ºC) Receiver Output High Voltage vs Temperature 100 3.4 10 1 0.1 Output Voltage (V) 3.2 3 2.8 2.6 Output Voltage (V) 2.4 2.2 Rl=100Ω R L Rl=54Ω R L 0.01 0 1 2 3 4 5 6 Differential Output Voltage (V) Driver Output Current vs Differential Output Voltage 2-60 -40-20 0 20 40 60 80 100 Temperature (ºC) Driver Differential Output Voltage vs Temperature 6

TYPICAL PERFORMANCE CHARACTERISTICS 100 90 80 70 60 50 40 30 20 10 0 0 1 2 3 4 5 6 Output Low Voltage (V) Output Current vs Driver Output Low Voltage Driver Output Waveforms High to Low -120-100 -80-60 -40-20 0-2 -1 0 1 2 3 4 5 6 Output High Voltage (V) Output Current vs Driver Output High Voltage Driver Output Waveform Low to High 350 No-Load Supply Current (µa) 325 300 275 250 No-Load 225 Supply Current (ua) DE = Vcc DE = GND 200-60 -40-20 0 20 40 60 80 100 Temperature (ºC) No-load Supply Current vs Temperature Driver and Receiver Hot Swap Performance vs. Vcc 7

DESCRIPTION DI VCC D VOD R/2 R/2 VOC VID A R RE Driver DC Test Circuit Receiver DC Test Circuit DI D A VOD R L 54Ω C L 50pF 3.3V Driver Propagation Delay Time Test Circuit and Timing Diagram DI Vcc 0V A V O 1/2V O Vcc/2 t PLH t PHL Vcc/2 1/2V O V DIFF V A V V O + 0V V O 90% 10% t R 90% 10% t F t SKEW = t PLH - t PHL 8

DESCRIPTION Driver Differential Output Test Circuit DE = 3.3V DI = 0 or Vcc D A/Y VOD 60Ω 375Ω /Z 375Ω V CM Driver Enable and Disable Times Test Circuit and Timing Diagram 0 or Vcc DI D Y S1 Z C L = 50pF R L = 500Ω GENERATOR 50Ω DE t ZH, t ZH (SHDN) Vcc/2 Vcc 0 V OM = (V OL + Vcc)/2 t HZ 0.25V 0 9

Driver Enable and Disable Times Test Circuit and Timing Diagram DESCRIPTION Vcc R L = 500Ω 0 or Vcc DI D Y S1 Z C L = 50pF GENERATOR 50Ω DE t DZL, t DZL (SHDN) Vcc/2 Vcc 0 t DLZ Vcc V OL V OM = (V OL + Vcc)/2 0.25V Receiver Propagation Delay Test Circuit and Timing Diagram VID A R RE C L 15pF A +1V -1V t RPLH t RPHL 1.5V V OH V OL 10

Receiver Enable and Disable Times Test Circuit DESCRIPTION 1.5V -1.5V S3 A R 1kΩ S1 S2 Vcc RE C L = 15pF GENERATOR 50Ω Receiver Enable and DisableTiming Diagram S1 is open, S2 is closed, S3 = 1.5V 3V 1.5V RE tzh, tzh(shdn) S1 is closed, S2 is open, S3 = -1.5V 3V RE 1.5V tzl, tzl(shdn) 0V VOH VCC VOH /2 0V VOL = VCC/2 VOL S1 is open, S2 is closed, S3 = 1.5V RE 1.5V 0.25V t HZ 3V VOH S1 is closed, S2 is open, S3 = -1.5V 3V 1.5V RE tlz 0V VCC 0V 0.25V VOL 11

DETAILED DESCRIPTION SP1486E is an advanced RS485/RS422 transceiver, ideal for PROFIUS applications. Each device contains one high speed driver and receiver capable of speeds up to 20Mbps with low skew. The device is designed for reliability in demanding operating conditions. It features a fail-safe circuitry that guarantees a logic-high receiver output when the receiver inputs are open or shorted, or when they are connected to a terminated transmission line with all drivers disabled. Control inputs (DE and RE) also feature a hotswap capability allowing live insertion without error data transfer. The device operates from a single 5.0V supply. Drivers are output short-circuit current limited. Thermal-shutdown circuitry protects drivers against excessive power dissipation. When activated, the thermal-shutdown circuitry places the driver outputs into a high-impedance state. PROFIUS (EN50170 or DIN19245) The PROFIUS standard originated in Europe but has spread worldwide as an industrial fieldbus for use in process automation and factory control. There are a number of different implementations, but one of the most widely used is PROFIUS-DP (Process Field us - Distributed Peripherals). DP uses RS485 as its physical layer along with a proprietary data-link layer. ADVANCED FAIL SAFE Ordinary RS485 differential receivers will be in an indeterminate state whenever A - is less than ±200mV. This situation can occur whenever the data bus is not being actively driven. The Advanced Failsafe feature of the SP1486E guarantees a logic-high receiver output if the receiver s differential inputs are shorted, opencircuit, or if they are shunted by a termination resistor. The receiver thresholds of the SP1486E are very precise and offset by at least a 40mV noise margin from ground. This results in a logic-high receiver output at zero volts input differential while maintaining compliance with the EIA/TIA- 485 standard of ±200mV. DESCRIPTION HOT-SWAP CAPAILITY When a micro-processor or other logic device undergoes its power-up sequence its logicoutputs are typically at high impedance. In this state they are unable to drive the DE and RE signals to a defined logic level. During this period, noise, parasitic coupling or leakage from other devices could cause standard CMOS enable inputs to drift to an incorrect logic level. If circuit boards are inserted into an energized backplane (commonly called live insertion or hot-swap ) power may be suddenly applied to all circuits. Without the hot-swap capability, this situation could improperly enable the transceiver s driver or receiver, driving invalid data onto shared busses and possibly causing driver contention or device damage. The SP1486E contains a special power-onreset circuit that holds DE low and RE high for approximately 10 microseconds. After this initial power-up sequence the hot-swap circuit becomes transparent, allowing for normal, unskewed enable and disable timings. ±15KV ESD PROTECTION ESD-protection structures are incorporated on all pins to protect against electrostatic discharges encountered during handling and assembly. The driver output and receiver inputs have extra protection against static electricity. Exar uses state of the art structures to protect these pins against ESD of ±15kV without damage. The ESD structures withstand high ESD in all states: normal operation, shutdown, and powered down. After an ESD event, the SP1486E keeps working without latch-up or damage. ESD protection can be tested in various ways. The transmitter outputs and receiver inputs of the SP1486E are characterized for protection to the following limits ±15kV using the Human ody Model ±8kV using the Contact Discharge method specified in IEC 1000-4-2 ±15kV Air-gap 12

IEC 1000-4-2 The IEC 1000-4-2 standard covers ESD testing and performance of finished equipment. However, it does not specifically refer to integrated circuits. The SP1486E helps you design equipment to meet IEC 1000-4-2, without sacrificing board-space and cost for external ESD-protection components. The major difference between tests done using the Human ody Model and IEC 1000-4-2 is a higher peak current in IEC 1000-4-2. Series resistance is lower in the IEC 1000-4-2 model. Hence, the ESD withstand voltage measured to EC 1000-4-2 is generally lower than that measured using the human body model. The air-gap test involves approaching the device with a charged probe. The contact discharge method connects the probe to the device before the probe is energized. MACHINE MODEL The machine model for ESD tests all pins using a 200pF storage capacitor and zero discharge resistance. The objective is to emulate the stress caused when I/O pins are contacted by handling equipment during test and assembly. 256 TRANSCEIVERS ON THE US The standard RS485 receiver input impedance is 12kΩ (1 unit load). A standard driver can drive up to 32 unit loads. The SP1486E has only a 1/8th unit load receiver input impedance (96kΩ), thereby allowing eight times as many, up to 256, transceivers to be connected in parallel on a communication line. Any combination of these devices and other RS485 transceivers up to a total of 32 unit loads may be connected to the line. DESCRIPTION LOW POWER SHUTDOWN MODE Low-power shutdown mode is initiated by bringing both RE high and DE low simultaneously. While in shutdown devices typically draw only 50nA of supply current. DE and RE may be tied together and driven by a single control signal. Devices are guaranteed not to enter shutdown if RE is high and DE is low for less than 50ns. If the inputs are in this state for at least 600ns, the parts are shut-down. Enable times tz h and tz l apply when the part is not in low-power shutdown state. Enable times tz h(s h d n) and tz l(s h d n) apply when the parts are shut down. The drivers and receivers take longer to become enabled from low-power shutdown mode tz h(s h d n) and tz l(s h d n) than from driver/receiver-disable mode (tz h, tz l). DRIVER PUT PROTECTION Two mechanisms prevent excessive output current and power dissipation caused by faults or by bus contention. First, a driver-current limit on the output stage provides immediate protection against short circuits over the whole common-mode voltage range. Second, a thermalshutdown circuit forces the driver outputs into a high-impedance state if junction temperature becomes excessive. 13

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Part number Temperature range Package Type SP1486EEN-L From -40 to +85 C NSOIC 8 pin SP1486EEN-L/TR From -40 to +85 C NSOIC 8 pin Note: "/TR" is for tape and reel option. Reel quantity is 2,500 for NSOIC. DATE REVISION DESCRIPTION 03/08/07 J Legacy Sipex Datasheet ORDERING INFORMATION 06/10/09 1.0.0 Convert to Exar format, update ordering information, correct error on Driver Enable Times timing diagram and change revision to 1.0.0 Notice EXAR Corporation reserves the right to make changes to any products contained in this publication in order to improve design, performance or reliability. EXAR Corporation assumes no representation that the circuits are free of patent infringement. Charts and schedules contained herein are only for illustration purposes and may vary depending upon a user's specific application. While the information in this publication has been carefully checked; no responsibility, however, is assumed for inaccuracies. EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation receives, in writting, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized ; (b) the user assumes all such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances. Copyright 2009 EXAR Corporation Datasheet June 2009 Send your Interface technical inquiry with technical details to: uarttechsupport@exar.com Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited. 15