Packaging and Integration Technologies for Silicon Photonics Dr. Peter O Brien, Tyndall National Institute, Ireland.
Opportunities for Silicon Photonics Stress Sensors Active Optical Cable 300 mm Silicon Wafer Datacentres, high speed computing, handheld devices Sensing (pressure, vibration, thermal, ) Diagnostics (medical devices, clinical diagnostics, ) Highly compact and stable integrated optical system
Opportunities for Silicon Photonics Silicon Photonic Device Distributed Sensors on Guidewire Sensor Interrogator
The Fibre Coupling Challenge edge coupled (inverted taper) grating coupled (80 angle)
The Fibre Coupling Challenge angled fibre Planar Silicon Grating silicon photonic chip Fibre Coupling to Planar Silicon Grating Vertical Coupler Package
The Fibre Coupling Challenge Optical Fibre Proprietary Fibre Design Optical Fibre Ribbon Nano Waveguide Optical Interface Small Form Factor & High Efficiency (Single & Multiple Optical Channels) Optical Fibre Array
The Fibre Coupling Challenge Fully Assembled Prototypes (devices provided by IMEC, Belgium)
The Fibre Coupling Challenge Curved Planar Gratings (IMEC) Ring Resonator (Device #3 / Die:-2,-2) (peak transmission of -8.33dB) Packaging Process for Grating-Coupled Silicon Photonic Waveguides Using Angle-Polished Fibers IEEE Transactions on Components, Packaging and Manufacturing Technology, pp. 1 1, 2013.
The Fibre Coupling Challenge UV cure active alignment fibre input Si chip (AWG) fibre output 1550 nm SLD
The Fibre Coupling Challenge (manufacture) Fibre Array Si Chip Passive Alignment Process (vision based process) Fully Automatic Flipchip System
The Fibre Coupling Challenge (manufacture) Fibre Core Fibre V-Groove Grating Coupler Superposition of V-Groove and Grating Coupler Images on Flipchip System 87% of Alignments within 10% of Optimised Power (optimised power attained from active alignment process)
epixfab (Silicon Photonics Foundry) Belgium France Ireland Germany Netherlands Finland Canada www.epixfab.eu Design Wafer Fab Device Packaging
epixfab (Silicon Photonics Foundry) Package Design Device Assembly Design electronic controller receiver Test & Evaluation Fibre Packaging Packaging
epixfab (Silicon Photonics Foundry) Design rules for fiber array with 250 μm pitch (see epixfab website for details)
Hybrid Integration on Silicon (Photonics) pick & place collet electrical connections (flexible substrate) ceramic substrate (active alignment) SOI waveguide Alignment over waveguide grating (vision based packaging)
Hybrid Integration on Silicon (Photonics) electrical input Hybrid Integration of Wavelength-Tunable Laser with Silicon Photonic Integrated Circuit, Journal of Lightwave Technology, Vol 3, 2013. tunable laser AlN substrate laser connection fibre output device on Peltier
Hybrid Integration on Silicon (Electronics) High Speed Electrical (25Gbit/s) 20 µm Copper Pillars AgSn Cap Copper Fibre Array Flipchip IC DC Biasing Flipchip IC IC Flipchip Assembly & Thermal Management
Thank You & Questions