A Highly Integrated and Comprehensive SiP Solutions for IoT Teck Lee Senior Technical Manager, ASE Group, Taiwan.
Introduction
IoT Segmentation Source: Yole, 2016/10
SAW Filter SAW Filter SiP Heterogeneous Integration Die1 28nm/Fab1 Digital + Die2 40nm/Fab2 Analog + + + Die4 14nm/Fab4 Power Die3 20nm/Fab3 Memory + MEMS Sensor + + + Die1 28nm/Fab1 Digital Die3 20nm/Fab3 Memory Die2 40nm/Fab2 Analog MEMS Sensor Die4 14nm/Fab4 Power Die/Package, Components System-in-Package (SiP) Miniaturization by SiP core technologies Heterogeneous integration with different technologies Design / Performance Optimization Lower cost alternative than SoC Fast-turn-tailor-made changes Higher quality, production efficiency and re-configurable
Enabling Technologies Applications ASE SiP Key Milestone WiFi Module 3G+WiMax Module Biometric Sensor Module M.2 SSD Module WiFi+BT Combo Module WiFi+BT+GPS+FM 4 in 1 Module LTE Modem Module 2005 2007 2010 2011 2013 2014 2015 2016 Cu Pillar w/ MUF Glass Integrated Passive Device (IPD) a-easi (Embedded Die in LF) Double Sided Module Passive SW SAW/BAW PA Cap bank HyPas Platform Hybrid WB+FC w/ MUF Sputter Conformal Shielding Compartment Shielding Antenna on Package (AoP) SESUB (Embedded Die in SUB)
SiP Module and System Integration Solution
Wireless Connectivity - BLE Application: Bluetooth Low Energy (BLE) for wearable products Challenge: Size reduction; conventional module size and antenna size occupy large area making wearable products less attractive BLE 4.0 (2.4 GHz) Single Chip RF Passive 20 Pcs Substrate : 4 layer, 0.3 mm Metal Lid, 0201 Before: Single Sided Module with Chip Antenna Module Size : 15.0 x 15.0 x 2.0 mm Service provided: Module design, manufacturing, system-level testing & firmware co-qualification Technology: Antenna on Package (AoP) Conformal Shielding Improvement: 82% module XY size reduction Solution : AoP Module Size : 6.5 x 6.5 x 1.2 mm (82% XY reduction)
Wireless Connectivity - WLAN Application: WiFi 802.11 a/b/g/n 2x2 for smartphone & wearable products Challenge: size reduction, especially on XY dimension 802.11 a/b/g/n 2x2 + BT 4.0 Dual Band (2.4 & 5 GHz) RF Passive 50 Pcs Substrate : 2+2+2, 0.3 mm MUF, C/S, 01005, 100um SMT clearance Before: Single Sided Module Module Size: 10.0 x 6.6 x 1.1 mm Substrate SI Solution: Double Sided Molding Module Module Size: 7.75 x 5.4 x 1.3 mm (30 % XY reduction) SI Service provided: Module design & manufacturing Technology: Double side SMT Double side molding & exposed molding Conformal shielding Improvement: 30% module XY size reduction
Sensor Integrated SiP: Sensor + AFE/MCU Application: Smart Handheld (Ambient Light / Proximity / Gesture), Body Motion & Physiological Sign Sensing Challenge: Product mechanical constraint, especially on XY dimension Bottom View Top View Before: Double-sided module Module Size: PCB-27 x 10 x 3 mm; Sensor-15x10mm Solution: Embedded die substrate Module Size : 8 x 8 x 1.2 mm (~80 % XY size reduction) Service provided: Design, materials, assembly & manufacturing, system-level testing & firmware co-qualification Technologies: Stacked die & WB High density SMT Embedded die substrate Improvement: 80% module XY size reduction
BLE+MCU+Sensors for Smart Bike Features: 1. Security Lock/Unlock: Accelerator, BLE Beacon 2. Fitness Monitor: HRM/SpO2 Sensor 3. Turn Lighting: Gesture Sensor 4. UV, Front/Rear Lighting: UV/ALS Sensor 4 1 2 3 4
HyPas Platform Solutions
HyPas Platform What is HyPas? High Performance Passives and Package Hybrid Solution 3D Inductor and Highly Integrated SiP Module Features: With or Without Glass High-Q 3D tall pillar inductor Glass Functional passive form by integrated L+C Embedded active/passive ability Compatible with Fan-out process Low profile and compact form factor Cap bank RFIC Compatible to traditional SMT & FC process WB tuning mechanism EMI shielding Passive SW SAW/BAW PA Cap bank
3D Solution: HyPas vs. TGV IPD with TGV HyPas with Tall Pillar (TP) 100um RFIC (Si) 50um RFIC (Si) MIM-Cap. Total: 900um 2.4x2.4mm RF Module TGV 280um Total: 400um Cap bank < 2x2mm RF Module 150um - Glass with TGV - Glass IPD cap - Top 1RDL/ Bottom 1 RDL - TGV Diameter 60um/ Depth 250um - 3D Inductor - RFIC with 70um Cu pillar - FC with MUF assembly - WLCSP assembly with 250um ball - No TGV - Embedded IPD cap bank - Top 2RDL/ Bottom 2 RDL - Tall Pillar Diameter < 30um, > 120um Pillar High - 3D Inductor - RFIC with 70um Cu pillar - FC with MUF assembly - Pre-solder
Summary
Summary ASE offers variety of technology solution for SiP requirements HyPas Platform is a High performance Passives/ Packaging solution Highly integrated SiP solution is especially suited for IOT End Devices