BGA SSD with EMI Shielding

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2 BGA SSD with EMI Shielding Jong-ok Chun Senior Managing Director Sun System Co.,Ltd OCT-2017

3 Trend of SSD Form-Factor Form Factor Inch - Slim SATA 100x70mm 54x39mm msata 50x30mm M x80mm M x42mm BGA SSD 16x20mm 11.5x13mm Module Integration System in Board Level - 4~8 Layer stack up - SATA I/F Connector System in Board Level - 8~12 Layer stack up - SATA / PCIe PCB Edge I/F connector System in Package Level - Solder Down BGA I/F - SATA / PCIe Year, OCT

4 Why BGA SSD? Fast OS Booting Data security Excellent Perf for small data file sizes (4KB) ( Log, sensor data, IoT data, Internet ) Data protection for power suddenly turn off ( Firmware solution without power back-up Capacitor ) Automatically controls the temperature of BGA PKG (Built-in temperature sensor and Firmware) New type of next-generation data storage, OCT

5 Architecture of BGA SSD Host System SiP BGA SSD 3.3V/1.8V/1.2V DRAM or DRAM-less Power (3.3V) PMIC (options) Power Line / Plane De-caps SATA PCIe Host Interface Differential Pair SATA : 4 Lane PCIe : 4~16 Lane SSD Controller NAND FLASH Ground Temp Sensor OSC, OCT

6 Why Do SSD Cause EMI Issue? When SSD performs read and write operations, Generates harmonic spurious from clock of the SSD Controller & DRAM, NAND Cellular 3G/4G Cellular 3G/4G WiFi / BT 400MHz 800MHz 1GHz 1.7GHz 2.2GHz 2.4GHz 2.5GHz Frequency Band f0 (CLK)= 400MHz 2f0 = 800MHz 5f0 = 2,000MHz 6f0 = 2,400MHz Fundamental Freq, OCT

7 What s the problem with SSD s EMI? EMI (Electro Magnetic Interference) can be a critical problem! Clock Harmonics High Speed data rate Clock Harmonics Receiver Sensitivity Degradation LTE RX Band WiFi RX Band RX Sensitivity= -174dBm + 10Log(BW) +NF+ SINR, OCT

8 EMI Source in BGA SSD PDN(Power Delivery Network) : - PMIC,1.2V, 1.8V, 3.3V - High Peak Current Consumption Many Data Pins and Devices - Controller, DRAM, NAND, PMIC - DQ, Addr, GPIO Clock Harmonics Poor Ground ( Return path ) as High Impedance Source (DRAM, Controller, NAND, Power/GND) Antenna ( Pick up by Cable, Power line & GND, Circuit coupling ) Signal Path, Main Board Routing 7, OCT- 2017

9 Key Components NAND FLASH ( 2D, 3D ) SSD Controller DRAM Passives - Sensor - Oscillator - R, L,C EMI Shielding (Option) + EMI Shielding System in Package < Side View > < Top View >, OCT- 2017

10 EMI Shielding Specification Conformal coating thickness - Bottom : SUS >=0.2um - Middle : Cu >=2.2um - Top : SUS >=0.2um Coating Surface - All parts except the bottom are coated Inline Sputtering System 0.2 um SUS, protection Mold Compound 2.2um Cu, EMI Shield 0.2um SUS, promotion adhesion, OCT

11 Read / Write Speed Performance BGA SSD mounted to M.2 PCB Board Perform read / write operations for EMI emissions BGA SSD Solder Down Test Board (M.2 PCB Board), OCT- 2017

12 EMI Test Environment Near Field Scan Far Field Setup TEM CELL Scanner VNA Notebook for Read / Write Non-Shielded Shielded Non-Shielded Shielded, OCT

13 Near Field Scan 30 ~ 1000 MHz Non-Shielded SSD Shielded SSD Hot spot Hot spot Clock Harmonics (83MHz ) Clock Harmonics (83MHz ) Noise Floor Noise Floor, OCT- 2017

14 Near Field Scan 1GHz ~ 8GHz Non-Shielded SSD Shielded SSD Hot spot Hot spot, OCT- 2017

15 Far Field Test ( 0.1 ~ 8.5GHz ) resonance phenomenon, OCT

16 Far Field Simulation Far Field at 2GHz Excitations at Host Interface Solder Balls 17dB SE (Shielding Effectiveness) between shielded and non-shielded Non-Shielded Shielded, OCT- 2017

17 Summary Data storage devices are moving to slim and thin, high-speed data transfer, and BGA SSD will lead this market EMI between the BGA SSD and the peripheral wireless (IoT) devices must be blocked First applied package level EMI shielding to BGA SSDs in actual products and had an EMI shielding effectiveness of 15dB~20dB, OCT

18 If you are interested in BGA SSD, please let me know as : rfjob@sunsysm.com / rfjob@naver.com Jong-ok Chun Thank you for your attention!, OCT

TITLE. on SSD Boards. Image. Topic: Topic: Seong-Jin Mun, (Samsung Electronics Inc.)

TITLE. on SSD Boards. Image. Topic: Topic: Seong-Jin Mun, (Samsung Electronics Inc.) TITLE Topic: Far-Field o Nam elementum EMI commodo Analysis mattis. Pellentesque Methodology and Verification on SSD Boards Topic: o malesuada blandit euismod. Seong-Jin Mun, (Samsung Electronics Inc.)

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