Research @ Intel: Driving the Future of IT Technologies Kevin C. Kahn Senior Fellow, Intel Labs Intel Corporation
kp Intel Labs Mission To fuel Intel s growth, we deliver breakthrough technologies that bring the benefits of the ongoing digital revolution to everyone
Investment Level Driving Intel s Technology Pipeline From Research to Products via Joint Pathfinding Platform Launch Intel Labs: Research & Prove New Technologies Intel Labs & Biz Groups: Joint Pathfinding Business Groups: Development & Integration into Products 3 Technology Maturity Our job isn t just vision we aren t done until technology moves out of the lab and into products
Intel Labs: Broad Agenda People and Practices 1 Trust and Privacy Connected Experiences Cloud Computing 2 Everyday Sensing and Perception Throughput & Visual Computing Mobility and Wireless Future Microarchitecture Eco Innovation & Energy Efficiency And much more. 4 Intel Confidential Si Photonics and Electronics 3
A Rapidly Changing World
Innovation Increasingly Driven by the User Experience
Understanding What People Really Want and What They Don t Want Over a Decade of Global Ethnographic Research Best-in-Class Methodology for People-Centered Research
Interaction & Experience Research Anthropologists, social scientists, prototypes... real people, different cultures
People-Centered Research Leads to Technological Innovation Smart TV Health Guide ClassMate PC
Performance Scaling Challenges and the Cloud Energy Efficiency Design Complexity Programming Strategy Emerging Applications
Cloud datacenters: Cloud Computing Today 1000s of networked computers Millions of threads and petabytes of data The dilemma of cloud computing: DC operating costs can exceed capital investment Key Issues: Managing Power & Managing Heat Example: Intel s Open Cirrus testbed Intel Labs Pittsburgh
Cloud Computing Tomorrow Opportunity: Lower power, higher density via integration Greater efficiency and better programmability Example: Intel s Open Cirrus testbed Intel Labs Pittsburgh
Single-chip Cloud Computer (SCC) Experimental many-core CPU on 45 nm Hi-K metal-gate silicon 48 IA-compatible cores the most ever built on a single chip Network of 2-core nodes mimics cloud computing at chip level Fine-grained power management scales from 25-125W Supports proven, highly parallel scale-out programming models
MEMORY CONTROLLER MC MC MC MC Inside the SCC Dual-core SCC Tile 24 Tiles 24 Routers 48 IA cores 8 voltage, islands 28 frequency islands Tiles at different F 6 tile banks at V V&F control for I/O network, MCs ROUTER 1TILE R R R R R R 2 nd -Gen 2D mesh 1/3 power 256 GB/s bisection bw 64 GB/s duplex link bw 4 Integrated MCs
SCC Summary: Meeting the Scalability Challenges Learn more at www.intel.com/go/terascale
Why Photonics? Copper wires reaching physical limits ~10 Gbps or higher becoming challenging Distance/speed tradeoff costing more in energy Alternative: Transmit data over optical fiber Much further reach at any given speed Multiple signals can travel on one fiber Thin & light = easy cable management Challenge: Optical technology costs
50G Silicon Photonics Link First Silicon Photonics data link with integrated lasers Research milestone using Hybrid Silicon Lasers Concept vehicle runs at 50Gbps, scalable to Terabit/s. Integrates our previous breakthrough building blocks Brings silicon manufacturing to optical communications Could make optical affordable for any compute platform, revolutionize apps & architectures
The 50G Silicon Photonics Link Transmitting and Receiving Light with Silicon Optical Fiber Integrated Transmitter Chip Integrated Receiver Chip Transmit Module Receiver Module
Integrated Transmitter Chip Integrates Hybrid Silicon Lasers With Modulators for data encoding and a Multiplexer to put 4 optical channels onto 1 fiber 1101001110 Electrical data in Up to 12.5 Gbps/channel Alignment Pin 50Gbps out on one optical fiber Connector Parallel channels are key to scaling bandwidths at low costs
Integrated Receiver Chip Integrates a coupler to receive incoming light with a demultiplexer to split optical signals and Ge-on-Si photodetectors to convert photons to electrons Electrical data out Up to12.5 Gbps per channel Alignment Pin Coupler 1101001110 1101001110 50Gbps in on one optical fiber 1101001110 1101001110 Connector Receives 4 optical channels at 12.5Gbps and converts to electrical data
Enabling for High Volume Assembly Printed circuit board Driver IC Pluggable Fiber cable connection Light Out Tx flip chip bonded Alignment Pins Uses PC-board techniques, passive optical connections
The Path to Tera-scale Data Rates Today: 12.5 Gbps x 4 = 50Gbps 25 Gbps x 4 = 100Gbps Scale UP 40G, 100G Scale OUT 12.5 Gbps x 8 = 100Gbps Speed Width Rate 12.5 x4 50G 12.5 x8 100G 25 x16 400G 40 x25 1T Future Terabit+ Links x16, x32 Could enable cost-effective high speed I/O for data-intensive applications
Intel Drives the Future Intel Labs researches top to bottom in IT Broad mission to deliver tomorrows technologies Connects to best academic research Teams with product groups to drive to reality If it is key to tomorrow s information world we probably are working on it!