L30ESDL5V0C6-4X SOT23-6L. STAND-OFF VOLTAGE Volts POWER DISSIPATION WATTS ESD PROTECTION DEVICE GENERAL DESCRIPTION FEATURES APPLICATION

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Transcription:

LITE-ON SEMICONDUCT L0ESDLV0C-X ESD PROTECTION DEVICE STANOFF VOLTAGE -.0 Volts POWER DISSIPATION - 00 WATTS GENERAL DESCRIPTION The L0ESDLV0C-X is low capacitance TVS arrays designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to highspeed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients). FEATURES Protects up to four lines & power line Low capacitance:.pf typical ( to ) IEC 000-- ( Lighting), A (8/0us) IEC 000-- ( ESD ), > ±7KV ( air ) ; > ±7KV ( contact ). APPLICATION Digital Visual Interface (DVI) Monitors and Flat Panel Displays USB.0 0/00/000 Ethernet IEEE 9 Firewire Port SOT-L SOT-L DIM. MIN. MAX. A 0.90. A 0.00 0. A 0.90.0 b 0.0 0.0 c 0.08 0. D..00 E.0.7 E..9 e 0.9 typ. e.90 typ. L 0.0 0.0 All Dimensions in millimeter PIN A SSIGNMENT,,, Lines MECHANICAL DATA Case Material: "Green" molding compound UL flammability classification 9V-0 (No Br.Sb, Cl) Terminals: Lead Free Plating Component in accordance to RoHs 0//EU lines Protection Ground MAXIMUM RATINGS (Tj= unless otherwise noticed) Rating Symbol Value Unit Peak Pulse Power (tp = 8/0us) Ppk 00 W Peak Pulse Current (tp = 8/0us) Ipp A Operating Junction Temperature Range TJ - to + Storage Temperature Range Tstg - to + 0 Soldering Temperature, t max = 0s TL 0 ELECTRICAL CHARACTERISTICS (Tj= unless otherwise noticed) Parameter Symbol Conditions MIn Typ Max Unit Reverse standoff voltage V RWM Any pin to ground --- ---.0 V Breakdown voltage VBR IR = ma.0 --- --- V Reverse leakage current IRM V DRM = V --- --- ua Clamping Voltage V C I PP = A, tp = 8/0µs, Any I /O pin to ground --- 8.7. V Clamping Voltage V C I PP = A, tp = 8/0µs, Any pin to ground --- 0. 7. V Clamping Voltage V C I PP = A, tp = 8/0µs, Any pin to ground ---. V Junction capacitance C J V R =.V, f = MHz, Any pin to ground ---..0 pf Junction capacitance C J V R =.V, f = MHz, Between pins ---.. pf REV., Oct-0, KSIR

RATING AND CHARACTERISTIC CURVES L0ESDLV0C-X Figure. 8/0 us pulse waveform according to IEC 000-- Figure. ESD pulse waveform according to IEC 000-- 0000. Peak Pulse Power (W) 000 00 0 TJ =, tp (us) = 8/0 us TJ =, tp (us) = 8/0 us exponentially decay waveform exponentially decay waveform 0 00 000 Pulse Time (us) Figure. Power Dissipation versus Pulse Time Ppp/Ppp ( ) 0.8 0. 0 0 0 7 00 0 Junction Temperature ( ) Figure. Peak pulse power versus TJ 000.0 TJ =, f=mhz, Vosc=00mV 00.0 Capacitance (pf) IR / IR ( ) 0.0.0 0 Any pin to ground 0 Reverse Voltage (V) 0. 0 0 7 00 0 Junction Temperature ( ) Figure. Typical Junction Capacitance Figure. Reverse Leakage Current versus TJ

RATING AND CHARACTERISTIC CURVES L0ESDLV0C-X +/-8KV ESD Contact discharge V (i/o) Figure 7. ESD Test Configuration Figure 8. Clamped +8 kv ESD voltage waveform Figure 9. Clamped -8 kv ESD voltage waveform

Application Information L0ESDLV0C-X L0ESDLV0C- To protect data lines and the power line, connect pin directly to the. Floated L0ESDLV0C- Complete isolation is desired, in this case, pin is not connected. Figure 0. Device Connection Options TMDS CLK+ TMDS CLK- L0ESDLV0C- L0ESDLV0C- TMDS D0+ TMDS D0- TMDS TMDS DVI - D Connector L0ESDLV0C- L0ESDLV0C- TMDS TMDS TMDS TMDS L0ESDLV0C- L0ESDLV0C- TMDS TMDS TMDS TMDS L0ESDLV0C- L0ESDLV0C- DDC DATA DDC CLK Figure. DVI Interface ESD Protection

Application Information L0ESDLV0C-X VGA Port V 9 0 7 8 V V RED GREEN BLUE SDA HSY VSY SCL L0ESDLV0C- L0ESDLV0C- VGA Port V 9 0 7 8 RED GREEN BLUE SDA HSY VSY SCL L0ESDLV0C- L0ESDLV0C- Figure. VGA Interface ESD Protection USB Port USB Controller L0ESDLV0C- USB Port USB Port USB Controller L0ESDLV0C- USB Port Figure. USB.0 Interface ESD Protection

Application Information L0ESDLV0C-X A+ A+ A- A- B+ L0ESDLV0C- L0ESDLV0C- B+ RJ B- C+ Gigabit B- Ethernet C+ Transceiver C- C- L0ESDLV0C- L0ESDLV0C- Figure. 0/00/000 Ethernet ESD Protection Power TPA+ Controller 9 Connector TPB+ L0ESDLV0C- TPA- TPA- TPB- Power TPA+ TPB- Controller 9 Connector TPB+ L0ESDLV0C- Figure. IEEE9 Interface ESD Protection

RATING AND CHARACTERISTIC CURVES L0ESDLV0C-X Marking & Orientation DEVICE L0ESDLV0C- L0ESDLV0C-C Wire Marking Packing Au VC Taping / Reel Cu VCV Taping / Reel Packaging Information DEVICE L0ESDLV0C- L0ESDLV0C-C Q'TY/REEL (PCS) REEL DIA. (IH) Q'TY/BOX (PCS) Q'TY/CARTON (PCS) 000 7 000 90K/80K SOT-L Soldering Pad Layout

Legal Disclaimer Notice L0ESDLV0C-X Important Notice and Disclaimer LSC reserves the right to make changes to this document and its products and specifications at any time without notice. Customers should obtain and confirm the latest product information and specifications before final design, purchase or use. LSC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does LSC assume any liability for application assistance or customer product design. LSC does not warrant or accept any liability with products which are purchased or used for any unintended or unauthorized application. No license is granted by implication or otherwise under any intellectual property rights of LSC. LSC products are not authorized for use as critical components in life support devices or systems without express written approval of LSC.