ULTRA LOW CAPACITANCE STEERING DIODE/TVS ARRAY DESCRIPTION The is a dual USB port protection array that features ultra low capacitance. This device can be used in applications such as video cards, SMART phones, Gigabit Ethernet and other computer interfaces. Designed for ESD protection, the can clamp the effects of electrical fast transients on the power bus. The combines 8 low capacitance steering diodes for up to four individual data or transmission lines and one TVS diode for power bus protection. This device is available in the space-saving SOT-23-6 package configuration, which minimizes lead inductance to prevent overshoot voltages during high ESD current events. The meets the IEC 61000-4-2, 61000-4-2 and 61000-4-5 requirements. SOT-23-6 PACKAGE FEATURES Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns Compatible with IEC 61000-4-5 (Surge): 24A, 8/20µs - Level 2(Line- Gnd) & Level 3(Line-Line0 500 Watts Peak Pulse Power per Line(tp = 8/20µs) ESD Protection > 25 kilovolts Low Clamping Voltage Protection for 4 Lines Ultra Low Capacitance: 3.5pF Typical (IO to GND) RoHS Compliant REACH Compliant APPLICATIONS Gigabit Ethernet SMART Phones Portable Electronics Video Card Interfaces USB 2.0 Interfaces DVI Interfaces MECHANICAL CHARACTERISTICS Molded JEDEC SOT-23-6 Package Approximate Weight: 16 milligrams Lead-Free Nickel Paladium Gold Plating Solder Reflow Temperature - 260-270 C Flammability Rating UL 94V-0 8mm Tape and Reel per EIA Standard 481 PIN CONFIGURATION I/O 1 1 6 I/O 4 GND 2 5 REF I/O 2 3 4 I/O 3 05150.R17 6/18 Page 1
TYPICAL DEVICE CHARACTERISTICS RATINGS @ 25 C Unless Otherwise Specified PARAMETER SYMBOL VALUE UNITS Peak Pulse Power (tp = 8/20µs) - See Figure 1 P PP 500 Watts Operating Temperature T L -55 to 150 C Storage Temperature T STG -55 to 150 C Forward Surge Rating (5ms @ 25 C, I F = 10mA) V F 0.5 Min. - 1.2 Max. Volts Peak Pulse Current (tp = 8/20µs) - Note 1 I PP 30 Amps NOTES 1. Across TVS only - pin 2 to pin 5. PART NUMBER DEVICE MARKING ELECTRICAL CHARACTERISTICS PER LINE @ 25 C Unless Otherwise Specified RATED STAND-OFF VOLTAGE V WM VOLTS MINIMUM BREAKDOWN VOLTAGE @ 1mA V (BR) VOLTS CLAMPING VOLTAGE (Fig. 2) @ I P = 1A V C VOLTS CLAMPING VOLTAGE (Fig. 2) @ I P = 5A V C VOLTS LEAKAGE CURRENT S5 5.0 6.0 12.0 15.0 5 @V WM I D µa @ 25 C Unless Otherwise Specified TYPICAL CAPACITANCE I/O to GND CAPACITANCE I/O to GND TYPICAL CAPACITANCE I/O to I/O CAPACITANCE I/O to I/O @0V, 1MHz C J(SD) pf @0V, 1MHz C J(SD) pf @0V, 1MHz C J(SD) pf @0V, 1MHz C J(SD) pf 3.5 5.0 2.5 4.0 05150.R17 6/18 Page 2
TYPICAL DEVICE CHARACTERISTICS 10,000 FIGURE 1 PEAK PULSE POWER VS PULSE TIME P PP - Peak Pulse Power - Watts 1,000 100 500W, 8/20µs Waveform 10 0.1 1 10 100 1,000 10,000 t d - Pulse Duration - µs I PP - Peak Pulse Current - % of I PP 120 100 80 60 40 20 t f FIGURE 2 PULSE WAVE FORM Peak Value I PP e -t t d = t/(i PP /2) TEST WAVEFORM PARAMETERS t f = 8µs t d = 20µs 0 0 5 10 15 20 25 30 t - Time - µs % Of Rated Power 100 80 60 40 20 FIGURE 3 POWER DERATING CURVE Peak Pulse Power 8/20µs Average Power 0 0 25 50 75 100 125 150 T A - Ambient Temperature - C 05150.R17 6/18 Page 3
TYPICAL DEVICE CHARACTERISTICS FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE 35 5 Volts per Division 25 15 5-5 ESD Test Pulse - 25 kilovolt, 1/30ns (Waveshape) FIGURE 5 TLP CURVE Amps Volts 05150.R17 6/18 Page 4
SPICE MODEL FIGURE 1 SPICE MODEL V CC I/O I/O I/O I/O ABD Lg 0.7nH LCABD - Low Capacitance Avalanche Breakdown Diode (TVS) : Low Capacitance Rectifier Diode Lg - Lead Inductance TABLE 1 - SPICE PARAMETERS PARAMETER UNIT ABD(TVS) BV V 6.0 200 IBV µa 1 0.01 C jo pf 230 3 I S A 1E-11 1E-13 Vj V 0.6 0.6 M - 0.33 0.33 N - 1 1 R S Ohms 0.014 0.31 TT s 1E-9 1E-9 EG ev 1.11 1.11 05150.R17 6/18 Page 5
PACKAGE INFORMATION DIM OUTLINE DIMENSIONS MILLIMETERS INCHES MIN MAX MIN MAX D E A 2.80 3.05 0.110 0.120 B 1.50 1.75 0.059 0.070 6 5 4 C 0.90 1.30 0.036 0.051 K 0-8 D 0.30 0.40 0.012 0.016 1 2 3 E 0.85 1.05 0.033 0.040 G 0.90 1.45 0.036 0.057 J 0.09 0.20 0.003 0.008 L B M J K 2.60 3.00 0.102 0.118 A L 0.0 0.15 0.0 0.006 M 0.30 0.60 0.012 0.024 NOTES 1. Controlling dimension: inches. 2. Dimensioning and tolerances per ANSI Y14.5M, 1985. 3. Dimensions are exclusive of mold flash and metal burrs. C G PAD LAYOUT DIMENSIONS MILLIMETERS INCHES DIM NOMINAL NOMINAL A 0.70 0.028 C B E B 1.90 0.074 C 0.95 0.037 D D 2.40 0.094 E 1.00 0.039 NOTES 1. Controlling dimension: inches. A 05150.R17 6/18 Page 6
TAPE AND REEL t D P0 P2 10 Pitches Cumulative Tolerance on Tape. ± 0.2 E Top Cover Tape K0 A0 Pin 1 F W B0 P User Direction of Feed REEL DIA. TAPE WIDTH SPECIFICATIONS A0 B0 K0 D E F W P0 P2 P tmax 178mm (7 ) 8mm 3.20 ± 0.10 3.20 ± 0.10 1.65 ± 0.10 1.50 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 8.00 ± 0.30 4.00 ± 0.10 2.00 ± 0.05 4.00 ± 0.10 0.25 NOTES 1. Dimensions are in millimeters. 2. Surface mount product is taped and reeled in accordance with EIA-481. 3. Suffix - T7 = 7 Reel - 3,000 pieces per 8mm tape. 4. Marking on Part - marking code (see page 2) and pin one defined by dot on package. Package outline, pad layout and tape specifications per document number 06013.R5 2/11 ORDERING INFORMATION BASE PART NUMBER LEADFREE SUFFIX TAPE SUFFIX QTY/REEL REEL SIZE TUBE QTY -P -T7 3,000 7 n/a This device is only available in a Lead-Free configuration. 05150.R17 6/18 Page 7
COMPANY INFORMATION COMPANY PROFILE In business more than 20 years, ProTek Devices is a privately held semiconductor company. The company offers a product line of overvoltage protection and overcurrent protection components. These include transient voltage suppressor array (TVS arrays) avalanche breakdown diode, steering diode TVS array and electronics SMD chip fuses. These components deliver circuit protection in electronic systems from numerous overvoltage and overcurrent events. They include lightning; electrostatic discharge (ESD); nuclear electromagnetic pulses (NEMP); inductive switching; and electromagnetic interference (EMI) / radio frequency interference (RFI). ProTek Devices also offers LED wafer die for ESD protection and related high frequency products. CONTACT US Corporate Headquarters 2929 South Fair Lane Tempe, Arizona 85282 USA By Telephone General: 602-431-8101 Sales: & Marketing: 602-414-5109 Customer Service: 602-414-5114 Product Technical Support: 602-414-5107 By Fax General: 602-431-2288 By E-mail: Asia Sales: asiasales@protekdevices.com Europe Sales: europesales@protekdevices.com U.S. Sales: ussales@protekdevices.com Distributor Sales: distysales@protekdevices.com Customer Service: service@protekdevices.com Technical Support: support@protekdevices.com ProTek Devices (Asia Pacific) Pte. Ltd. 8 Ubi Road 2, #06-19 Zervex Singapore - 408538 Tel: +65-67488312 Fax: +65-67488313 Web COPYRIGHT ProTek Devices 2002 - This literature is subject to all applicable copyright laws and is not for resale in any manner. SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice. DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice and that the final judgement concerning selection and specifications is the buyer s and that in furnishing engineering and technical assistance. ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ProTek assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability without limitation special, consequential or incidental damages. LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without written consent from the factory. 05150.R17 6/18 Page 8