All non-rohs products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. NEW microsd DM Series Features Common to the entire Series. Extremely small size Small external dimensions and the above-the-board height make the connectors the smallest on the market.. Reverse card insertion protection Unique card slot design (patent pending) protects the connector from damage when the card is attempted to be inserted in reverse, allowing it to re-inserted correctly.. Effective ground and shield configuration 4-connection points of the metal cover to the printed circuit board assures secure connection of the ground circuit and provides EMI protection. 4. Rigid and strong construction Despite its small size, high-strengths materials used in the connectors produced a strong and rigid structure. 5. detection switch The card detection switch is Normally Open 6. RoHS compliant All components and materials comply with the requirements of the EU Directive 00/95/EC DMAT and DMB (Push - Push, with fall-out prevention Built-in card tray and the unique push insertion-push ejection mechanism (patent pending) prevent accidental card ejection or fall-out. Despite its small size the connectors will eject the card to a distance of 4.0 mm, allowing easy hold and removal of the card. Exposed termination leads Easy inspection and rework of the solder termination joints. DMC (Hinge, Push-Pull, manual, without Simple and reliable card insertion Hinged metal cover provides location and guides the card during the insertion / removal. Closing of the cover confirms the electrical and mechanical connection with a tactile click sensation. Reliable contact with the card contact pads Unique contact design and card slide action will clean the contact areas of the card. Accessible termination areas Contact solder terminations may be inspected and reworked. DMD (Push -Pull, manual, without Partial card insertion hold will not fall-out even when it is not fully inserted. Full insertion and electrical / mechanical connection is confirmed with a distinct tactile feel. Accessible termination areas An inner lead system that can be reworked is used in this design. Contact solder terminations may be inspected and reworked. Applications Mobile phone terminals, digital cameras, PDA's, miniature information terminals and any other portable device requiring use of small size high reliability microsd memory card connectors. etc. insertion-ejection Push-Push Hinge-manual insertion/ ejection Push-Pull manual insertion/ ejection Series Image Page DMAT DMB DMC DMD ~4 5~7 8~0 ~ 008.
All non-rohs DM products Series microsd have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. Specifications(DM Series) Ratings Current rating: 0.5A Voltage rating: 5V AC Operating temperature range: -5ç to +85ç (Note ) Storage temperature range : -40ç to +85ç (Note ) Operating humidity range: RH 95% max. (No condensation) Item Specification Conditions. Insulation resistance. Withstanding voltage. Contact resistance 000 Mø min. (Initial value) No flashover or insulation breakdown 00mø max. (Initial value) Measure at 500 V DC 500 V AC / minute ma 4. Vibration 5. Humidity 6. Temperature cycle 7. Durability No electrical discontinuity of 00 ns or longer Insulation resistance: 00 Mø min. Insulation resistance: 00 Mø min. Frequency: 0 to 55 Hz, single amplitude of 0.75 mm, directions for hours 96 hours at of 40 ± ç, and humidity of 90 to 95% -55ç 5 to 5ç 85ç 5 to 5ç Times: 0 min. 5 min. 0 min. 5 min. 5 cycles 0,000 cycles, 400 to 600 cycles per hour (DMAT, DMB) 5,000 cycles, 400 to 600 cycles per hour (DMC, DMD) 8. Resistance to soldering heat No deformation of components affecting performance. Note : Includes temperature rise caused by current flow. Note. The term "storage" refers to products stored for long period prior to mounting and use. Materials and Finishes DMAT, DMB Part Material Finish Insulator LCP Reflow : At the recommended temperature profile Manual soldering : 50ç for seconds Color: Black Remarks UL94V-0 Contacts Copper alloy Contact area: Gold plated Guide cover Stainless steel (DMAT) Copper alloy (DMB) Other components Stainless steel Piano wire Nickel plated DMC, DMD Part Material Finish Insulator LCP Color: Black Remarks UL94V-0 Contacts Copper alloy Contact area: Gold plated Guide cover Stainless steel Tin plated Ordering information DM AT SF PEJ 4 Series name: DM Connector type : AT Push-Push (, Top board mounting (Standard) B Push-Push (, Bottom board mounting (Reverse) C Hinge, Push-Pull (no, Top board mounting (Standard) D Push-Pull (no, Top board mounting (Standard) Number of contacts : 8 4 Termination type : SF Right-angle SMT(Standard) DSF Right-angle SMT(Reverse) ejection code : PEJ (Push insert/push eject) None : Manual card insertion/ejection
All non-rohs products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, DM Series microsd or contact your Hirose sales representative. DMAT Push-Push (, Top board mounting (Standard) #6(VSS) #7(DAT0) #8(DAT) #5(CLK) #4(VDD) #(CMD) #(CD/DAT) #(DAT).85 ( 7.5) (. ).68 Part number CL No. RoHS DMAT-SF-PEJ 609-00- YES 5.95 ( 5 ) 5.95 (6.75): pushed-in for ejection (7:55): fully inserted (.55): ejected Outline of the microsd card ( 5.5) LC ( ) ( 0.8).9±0.5 Recommended PCB mounting pattern 0MIN 9.5 MAX 8.65 4.05.MIN 9.9 7.9MIN 5.7MAX.7. 0.7 0.5MIN 0.7 7.7.55 P=. 8.9 MIN 8.MIN 0.5MIN. 4.4MAX 6 MIN 4.MAX 4.5 5. Note C L indicates the center line of the microsd card slot. detection switch Without the card Open inserted Closed 0.8 8. MAX.9 (A) (B) (A) (B).8 LC 9. (. ).7.5 C 0.5. No conductive traces. Example of applications DMAT-SF-PEJ Portable device
All non-rohs DM products Series microsd have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. Packaging Specifications Embossed carrier tape dimensions (,500 pieces per reel).75 Ø.5 P=4 0 Unreeling direction (. ) 8.4 ( 6.5) 4. Reel Dimensions Unreeling direction End section Mounting section Lead section (400mm min.).4 Ø80 Ø80 Blank section (60mm min.) Blank section (00mm min.) Embossed carrier tape Top cover tape 4
All non-rohs products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, DM Series microsd or contact your Hirose sales representative. Recommended temperature profile Temperature (ç) 50 00 50 00 50 50ç 0ç min. 00ç 90 to 0 seconds Preheating Time (Seconds) Peak:50ç MAX 50 seconds Soldering HRS test condition Solder method :Reflow, IR/hot air Environment :Room air Solder composition :Paste, 96.5%Sn/.0%Ag/0.5%Cu (Senju Metal Industry, Co., Ltd.'s Part Number:M705-GRN60-K-V) Test board :Glass epoxy 60mm 00mm.0mm thick Metal mask :0.mm thick The temperature profiles shown are based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume / thickness and board size / thickness. Consult your solder paste and equipment manufacturer for specific recommendations. Precautions. Do not immerse or clean the entire connector with cleaning solutions as this may affect proper operation of the ejection mechanism and electrical performance of the connector. Do not apply excessive force to the connector when handling or after installation on the PC board.. The connectors will reliably connect and operate with the correctly inserted microsd TM cards. Follow the correct insertion / ejection procedure for the specific connector in use. Attempts of incorrect insertion of the card may cause damage to the connector or the card. 4. The connector must be correctly mounted on the PC board before the card can be inserted. Do not insert the card in the un-mounted connector. 5. Mounting on the Flexible Printed Circuit (FPC) To assure correct performance it is recommended that a flat reinforcement plate 0. mm min. thick be used under the FPC. 6. Small visible residual manufacturing fluids or tooling marks do not affect connector's performance. 7. Repeated insertions and removal of the cards may leave some marks on the card itself. This will have no affect on the connector performance. Refer to applicable Operation Manual listed below for additional precautions. Series DMAT Series DMB Series DMC Series DMD Series Operation Manual Number ETAD-F045 ETAD-F04 ETAD-F05 ETAD-F05