AIM Photonics Overview Roger Helkey Associate Director, West Coast Hub 1
Explosive Growth In Datacenter Traffic Global data center traffic to triple and reach a total of 7.7 zettabytes annually by 2017-25% CAGR. Global cloud traffic, fastest-growing component of data center traffic, to grow 4.4x 35% CAGR Cisco Global Cloud Index Analysis Oct 2013
Transmission Energy Savings with Photonics 10000 Compared to electronics, photonics can Increase bandwidth Reduce energy/bit scale up BANDWIDTH bandwidth (Gb/sec/ mm) 1000 100 10 photoni c electronic Photonics advantage is largest at the system level scale down ENERGY data movement energy 100 10 1 0.1 electroni c photonic
Data Centers: Hierarchical Networks Good for North-South Core (Spine) Aggregation (Leaf) Optical Circuit Switching Edge (TOR=Top-of-Rack) Reduce switching power 2x 1) Flatten the Network: Larger port count switches Electrical or Optical Cores Server Bad for East-West = 75% of data center traffic Traditional hierarchical networks grew out of campus/wan installations 2) Change the Network: Photonic switching Prof. C. Schow, UCSB
Photonic Integration Integrated photonics enables economical implementation of complex systems (e.g. Single-Chip Coherent Transceiver) Drastically lowers the cost of high-bandwidth transmission Doerr, Frontiers in Physics 2015
Growing US Photonics Industry Photonics manufacturing industry is in infancy High volume manufacturing will drive down cost Help US compete in global market Higher automation compete against labor cost
Integrated Photonics Manufacturing Institute GOAL: Create a national institute supporting the end to end integrated photonics manufacturing ecosystem in the U.S.
Integrated Photonics Manufacturing Institute Commercial Investment University Research Close the Gap Manufacturing Readiness Level 1 2 3 4 5 6 7 8 9 10 AIM Photonics Investments : $110M Federal / $500M Match Headquarters : Rochester, NY Lead : SUNY Poly Established : July 2015
Integrated Photonics Manufacturing Institute s Foundry SUNY 1.3M ft 2 facility (Albany NY) 300mm Si Photonics Wafer Leading edge 300/450mm toolset 135k ft 2 of class 1 capable cleanroom Processing capability span 65nm - 7nm Years of proven silicon photonics results multiple government & industry projects
Projects - UCSB Participation Electronic-Photonic Design Automation Design photonic integrated circuits without a Ph.D on staff High Radix Switch Improve power efficiency in the data center Analog links Increase fuel efficiency by replacing heavy aircraft cables Sensors Use microfluidics for trace chemical detection Explosives detection, Epitaxial Growth Reduce cost of lasers integrated with SUNY process
AIM Functional Testing for Automated Scaled Manufacturing Automated High-Throughput Testing for Manufacturing Phase 1: o Development of test structures with standard E/O interfaces (grating/edge coupler, electrical pad placement) o Coordinate correlation with inline testing for fab health (ICT) o Rapid post-wafer fab testing & qualification o Hardware/software integrated infrastructure definition, EPDA coordination, database development Phase 2: o E/O probing automation development (wafer/chip) o Test process definition for high throughput testing o Chip-scale and 2.5D/3D-integrated functional performance test Phase 3: o High-throughput E/O probing, prototyping, packaging o Full HW/SW interface definition for pilot line manufacturing test (wafer-chip-assembly) Hardware/software definition, integration, and automation of E/O E/O-packaged rapid testing prototype E/O-packaged assembly (Pre)Phase 1: MRL 1-3 Test structure definition, wafer-scale ICT Phase 1: MRL 2-4 Post-fab wafer-scale probing for E/O validation and parameterization Phase 2: MRL 2-7 Post-fab chip-scale E/O testing Prof. K. Bergman, Columbia Phase 3: MRL 7-10 Packaged assembly testing
Cost Sharing Among Users Multi-project wafers allow sharing fabrication costs Devices will be packaged, sent back to users
Technology Working Groups MCE s function like manufacturing & design platforms in a corporation KTMA s function like business units TWG s (Technology Working Groups) operating fabric of the COO / CTO functions the way to Engage and Influence TWG TWG TWG TWG TWG TWG TWG TWG
Institute Manufacturing Centers of Excellence Modular value chain Design Wafer fabrication Assembly Packaging and Massachusetts test integrated photonics Connecting the Physical World to Silicon electromagnetics / photonics / fluidics Design / PDK New York California 3D ChipStack 2.5D Interposer New York Colorado SiPh Wafer New York! Workforce Coordination Parametric s / Functionalit y Roadmap PCB Massachusetts
Institute Key Technology Manufacturing Areas Industry sets the pace exploring technology potentials, revolutionizing the data and sensing market Scientific/defense leverages industry development adding unique functionalities
Institute Members a growing # Government Industry Academic Tier 1 Tier 1 Tier 2 Tier 2 Tier 3 California State New York State Arizona State Trade Associations Committed Participants and Supporters Massachusetts State
AIM meeting at UCSB Feb. 2016