CMOS Static RAM 1 Meg (128K x 8-Bit) Revolutionary Pinout

Similar documents
IDT71V124SA/HSA. 3.3V CMOS Static RAM 1 Meg (128K x 8-Bit) Center Power & Ground Pinout

IDT71016S/NS. CMOS Static RAM 1 Meg (64K x 16-Bit)

3.3V CMOS Static RAM for Automotive Applications 4 Meg (256K x 16-Bit)

IDT7134SA/LA. HIGH-SPEED 4K x 8 DUAL-PORT STATIC SRAM

HIGH-SPEED 4K x 8 FourPort TM STATIC RAM

LP621024E-I Series 128K X 8 BIT CMOS SRAM. Document Title 128K X 8 BIT CMOS SRAM. Revision History. AMIC Technology, Corp.

AS6C K X 8 BIT LOW POWER CMOS SRAM

8K X 8 BIT LOW POWER CMOS SRAM

AS6C6264 8K X 8 BIT LOW POWER CMOS SRAM REVISION HISTORY. Feb

CMOS SyncFIFO 64 x 8, 256 x 8, 512 x 8, 1,024 x 8, 2,048 x 8 and 4,096 x 8 LEAD FINISH (SnPb) ARE IN EOL PROCESS - LAST TIME BUY EXPIRES JUNE 15, 2018

HIGH SPEED 128K (8K X 16 BIT) IDT70825S/L SEQUENTIAL ACCESS RANDOM ACCESS MEMORY (SARAM )

D0 - D8 INPUT REGISTER. RAM ARRAY 64 x 9, 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9, 8,192 x 9 OUTPUT REGISTER RESET LOGIC RCLK REN1

IDT7132SA/LA IDT7142SA/LA

VERY LOW POWER 1.8V 16K/8K/4K x 16 DUAL-PORT STATIC RAM

HIGH SPEED 4K X 8 DUAL-PORT STATIC RAM WITH SEMAPHORE

Rev. No. History Issue Date Remark

CMOS SyncFIFO 64 X 9, 256 x 9, 512 x 9, 1,024 X 9, 2,048 X 9, 4,096 x 9 and 8,192 x 9

4Mb Async. FAST SRAM Specification

64K x 16 1Mb Asynchronous SRAM

256K x 16 4Mb Asynchronous SRAM

LP62S16256G-I Series. Document Title 256K X 16 BIT LOW VOLTAGE CMOS SRAM. Revision History. Rev. No. History Issue Date Remark

512K x 8 4Mb Asynchronous SRAM

HIGH SPEED 1K X 8 DUAL-PORT STATIC SRAM

HIGH SPEED 2K X 8 DUAL-PORT STATIC RAM WITH INTERRUPTS

MOS INTEGRATED CIRCUIT

QUICKSWITCH PRODUCTS HIGH-SPEED CMOS 10-BIT BUS SWITCH WITH FLOW-THROUGH PINOUT

4Mb Async. FAST SRAM A-die Specification

QUICKSWITCH PRODUCTS HIGH-SPEED CMOS QUICKSWITCH DOUBLE-WIDTH BUS SWITCH

CMOS SRAM. K6T4008C1B Family. Document Title. Revision History. 512Kx8 bit Low Power CMOS Static RAM. Revision No. History. Remark. Draft Date 0.

AS7C34098A-8TIN 256K X 16 BIT HIGH SPEED CMOS SRAM

AT28C16. 16K (2K x 8) CMOS E 2 PROM. Features. Description. Pin Configurations

CMOS PARALLEL-TO-SERIAL FIFO 1,024 x 16

HIGH SPEED 1K X 8 DUAL-PORT STATIC SRAM

MOS INTEGRATED CIRCUIT

FAST CMOS OCTAL BUFFER/LINE DRIVER

QUICKSWITCH PRODUCTS HIGH-SPEED CMOS QUICKSWITCH DOUBLE-WIDTH BUS SWITCH

512Kx8 Monolithic SRAM, SMD

QUICKSWITCH PRODUCTS HIGH-SPEED CMOS QUADRUPLE BUS SWITCH WITH INDIVIDUAL ACTIVE LOW ENABLES

IDT54/74FCT541/A/C FAST CMOS OCTAL BUFFER/LINE DRIVER DESCRIPTION: FUNCTIONAL BLOCK DIAGRAM

IDT54/74FCT244/A/C FAST CMOS OCTAL BUFFER/LINE DRIVER DESCRIPTION: FUNCTIONAL BLOCK DIAGRAM FEATURES: OEA OEB DA1 OA1 DB1 OB1 DA2 OA2 OB2 DB2 DA3 OA3

16Mb(1M x 16 bit) Low Power SRAM

IDT7130SA/LA IDT7140SA/LA

CMOS SyncFIFO 64 X 9, 256 x 9, 512 x 9, 1024 X 9, 2048 X 9 and 4096 x 9

MOS INTEGRATED CIRCUIT

QUICKSWITCH PRODUCTS HIGH-SPEED CMOS QUICKSWITCH 32-BIT MULTIWIDTH BUS SWITCHES

128Kx8 CMOS MONOLITHIC EEPROM SMD

FAST CMOS OCTAL BUFFER/LINE DRIVER

QUICKSWITCH PRODUCTS 2.5V/3.3V 20-BIT HIGH BANDWIDTH BUS SWITCH

QUICKSWITCH PRODUCTS 2.5V / 3.3V 8:1 MUX / DEMUX HIGH BANDWIDTH BUS SWITCH

QUICKSWITCH PRODUCTS 2.5V / 3.3V 16-BIT HIGH BANDWIDTH BUS SWITCH

HIGH-SPEED 128K x 8 DUAL-PORT STATIC RAM

HIGH-SPEED 3.3V 1K X 8 DUAL-PORT STATIC RAM

FAST CMOS SYNCHRONOUS PRESETTABLE BINARY COUNTERS

LOW-VOLTAGE OCTAL BUS SWITCH

LY62W K X 16 BIT LOW POWER CMOS SRAM

LY61L102416A 1024K X 16 BIT HIGH SPEED CMOS SRAM

AT29C K (32K x 8) 5-volt Only CMOS Flash Memory. Features. Description. Pin Configurations

QUICKSWITCH PRODUCTS 2.5V / 3.3V 20-BIT DUAL PORT, HIGH BANDWIDTH BUS SWITCH

IS62WV12816DALL/DBLL IS65WV12816DALL/DBLL

3.3V CMOS OCTAL BIDIRECTIONAL TRANSCEIVER

3.3V CMOS 1-TO-5 CLOCK DRIVER

QUICKSWITCH PRODUCTS 2.5V / 3.3V 32-BIT HIGH BANDWIDTH BUS SWITCH

QUICKSWITCH PRODUCTS 2.5V / 3.3V 8-BIT HIGH BANDWIDTH BUS SWITCH

White Electronic Designs

CMOS SyncFIFO TM 256 x 18, 512 x 18, 1,024 x 18, 2,048 x 18, and 4,096 x 18 INPUT REGISTER WRITE CONTROL LOGIC

LOW-VOLTAGE 10-BIT BUS SWITCH

LOW-VOLTAGE 24-BIT BUS EXCHANGE SWITCH

AT28C K (32K x 8) Paged CMOS E 2 PROM. Features. Description. Pin Configurations

QUICKSWITCH PRODUCTS 2.5V / 3.3V 24-BIT HIGH BANDWIDTH BUS SWITCH

ACT S512K32 High Speed 16 Megabit SRAM Multichip Module

IDT74FST BIT 2:1 MUX/DEMUX SWITCH

2-Megabit (256K x 8) 5-volt Only CMOS Flash Memory AT29C020. Features. Description. Pin Configurations

AS6C TINL 16M Bits LOW POWER CMOS SRAM

EFA PAEA WCLKB WENB1 WENB2 FFA WRITE CONTROL LOGIC WRITE POINTER RESET LOGIC RSB

Rev. No. History Issue Date Remark

DatasheetArchive.com. Request For Quotation

LY62L409716A 4M X 16 BIT LOW POWER CMOS SRAM

Product Change Notification (PCN)

IDT70V18L. HIGH-SPEED 3.3V 64K x 9 DUAL-PORT STATIC RAM

LY62L102516A 1024K x 16 BIT LOW POWER CMOS SRAM

HIGH SPEED 64K (4K X 16 BIT) IDT70824S/L SEQUENTIAL ACCESS RANDOM ACCESS MEMORY (SARAM )

IDT74LVC245A 3.3V CMOS OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS AND 5 VOLT TOLERANT I/O

White Electronic Designs

LY62L K X 16 BIT LOW POWER CMOS SRAM

IDT74LVC541A 3.3V CMOS OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS AND 5 VOLT TOLERANT I/O

EDI8G322048C DESCRIPTION FEATURES PIN CONFIGURATION PIN NAMES

LY62L205016A 32M Bits ( 2Mx16 / 4Mx8 Switchable) LOW POWER CMOS SRAM

IDT74LVC244A 3.3V CMOS OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS, 5 VOLT TOLERANT I/O

IDT74CBTLV3257 LOW-VOLTAGE QUAD 2:1MUX/DEMUX BUS SWITCH

IDT74FCT299/A/C FAST CMOS 8-INPUT UNIVERSAL SHIFT REGISTER DESCRIPTION: FUNCTIONAL BLOCK DIAGRAM

White Electronic Designs

AT24C01A/02/04/08/16. 2-Wire Serial CMOS E 2 PROM. Features. Description. Pin Configurations. 1K (128 x 8) 2K (256 x 8) 4K (512 x 8) 8K (1024 x 8)

QUICKSWITCH PRODUCTS HIGH-SPEED CMOS 10-BIT BUS SWITCH

IDTQS3VH383 QUICKSWITCH PRODUCTS 2.5V/3.3V 8-BIT HIGH BANDWIDTH BUS EXCHANGE BUS SWITCH

HIGH SPEED 2K X 8 DUAL-PORT STATIC RAM WITH INTERRUPTS

My-MS. MM27C ,072 x 8 CMOS EPROM PRELIMINARY INFORMATION ISSI IS27C010 FEATURES DESCRIPTION FUNCTIONAL BLOCK DIAGRAM

FEBRUARY/2008, V 1.c Alliance Memory Inc. Page 1 of 13

LY62L K X 16 BIT LOW POWER CMOS SRAM

MB85R M Bit (128 K 8) Memory FRAM CMOS DS E DESCRIPTIONS FEATURES FUJITSU SEMICONDUCTOR DATA SHEET

IDTQS3257 QUICKSWITCH PRODUCTS HIGH-SPEED CMOS QUICKSWITCH QUAD 2:1 MUX/DEMUX DESCRIPTION: FUNCTIONAL BLOCK DIAGRAM FEATURES: APPLICATIONS:

Transcription:

CMOS Static RAM 1 Meg (K x -Bit) Revolutionary Pinout IDT714 Features K x advanced high-speed CMOS static RAM JEDEC revolutionary pinout (center power/gnd) for reduced noise Equal access and cycle times Commercial: //2 Industrial: /2 One Chip Select plus one Output Enable pin Bidirectional inputs and outputs directly TTL-compatible Low power coumption via chip deselect Available in a 32-pin 4 mil Plastic SOJ Description The IDT714 is a 1,4,576-bit high-speed static RAM organized as K x It is fabricated using high-performance, high-reliability CMOS technology This state-of-the-art technology, combined with innovative circuit design techniques, provides a cost-effective solution for high-speed memory needs The JEDEC centerpower/gnd pinout reduces noise generation and improves system performance The IDT714 has an output enable pin which operates as fast as 6, with address access times as fast as available All bidirectional inputs and outputs of the IDT714 are TTL-compatible and operation is from a single 5V supply Fully static asynchronous circuitry is used; no clocks or refreshes are required for operation The IDT714 is packaged in a 32-pin 4 mil Plastic SOJ Functional Block Diagram A DECODER 1,4,576-BIT MEMORY ARRAY A16 I/O -I/O7 I/O CONTROL, WE OE CONTROL LOGIC 3514 drw 1 213 Integrated Device Technology, Inc 1 APRIL 213 DSC-3514/11

IDT714 CMOS Static RAM 1 Meg (K x -bit) Revolutionary Pinout Commercial and Industrial Temperature Ranges Pin Configuration A A1 A2 A3 I/O I/O1 VCC GND I/O2 I/O3 WE A4 A5 A6 1 2 3 4 5 6 SO32-3 7 9 1 11 32 31 3 29 2 27 26 25 24 23 22 21 13 2 14 19 1 16 A7 17 SOJ Top View A16 A A14 A13 OE I/O7 I/O6 GND VCC I/O5 I/O4 A A11 A1 A9 A 3514 drw 2, Absolute Maximum Ratings (1) Symbol Rating Value Unit VTERM (2) Terminal Voltage with Respect to GND 1 Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device This is a stress rating only and functional operation of the device at these or any other conditio above those indicated in the operational sectio of this specification is not implied Exposure to absolute maximum rating conditio for extended periods may affect reliabilty 2 VTERM must not exceed Vcc + 5V Capacitance (TA = +25 C, f = 1MHz) -5 to +7 (2) V TA Operating Temperature to +7 o C TBIAS TSTG Temperature Under Bias Storage Temperature -55 to +5 o C -55 to +5 o C PT Power Dissipation 125 W IOUT DC Output Current 5 ma 3514 tbl 2 Truth Table (1,2) OE WE I/O Function L L H DATAOUT Read Data L X L DATAIN Write Data L H H High-Z Output Disabled H X X High-Z Deselected - Standby (ISB) VHC (3) X X High-Z Deselected - Standby (ISB1) 1 H = VIH, L = VIL, x = Don't care 2 VLC = 2V, VHC = VCC -2V 3 Other inputs VHC or VLC 3514 tbl 1 Symbol Parameter (1) Conditio Max Unit CIN Input Capacitance VIN = 3dV pf CI/O I/O Capacitance VOUT = 3dV pf 3514 tbl 3 NOTE: 1 This parameter is guaranteed by device characterization, but is not production tested Recommended Operating Temperature and Supply Voltage Grade Temperature GND VCC Commercial C to +7 C V 5V ± 1% Industrial 4 C to +5 C V 5V ± 1% 3514 tbl 4 Recommended DC Operating Conditio Symbol Parameter Min Typ Max Unit VCC Supply Voltage 45 5 55 V GND Ground V VIH Input High Voltage 22 VCC +5 V VIL Input Low Voltage -5 (1) V 3514 tbl 5 642 2

IDT 714 CMOS Static RAM 1 Meg (K x -bit) Revolutionary Pinout Commercial and Industrial Temperature Ranges DC Electrical Characteristics (VCC = 5V ± 1%, Commercial and Industrial Temperature Ranges) Symbol Parameter Test Conditio Min Max Unit ILI Input Leakage Current VCC = Max, VIN = GND to VCC 5 µa ILO Output Leakage Current VCC = Max, = VIH, VOUT = GND to VCC 5 µa VOL Output Low Voltage IOL = ma, VCC = Min 4 V VOH Output High Voltage IOH = 4mA, VCC = Min 24 V 3514 tbl 6 DC Electrical Characteristics (1) (VCC = 5V ± 1%, VLC = 2V, VHC = VCC 2V) 714S 714S 714S2 Symbol Parameter Com'l Com'l Ind Com'l Ind Unit ICC ISB Dynamic Operating Current 16 5 5 14 14 ma < VIL, Outputs Open, VCC = Max, f = fmax (2) Standby Power Supply Current (TTL Level) 4 4 4 4 4 ma > VIH, Outputs Open, VCC = Max, f = fmax (2) ISB1 Full Standby Power Supply Current (CMOS Level) > VHC, Outputs Open, VCC = Max, f = (2) VIN < VLC or VIN > VHC 1 1 1 1 1 ma 1 All values are maximum guaranteed values 2 fmax = 1/tRC (all address inputs are cycling at fmax); f = mea no address input lines are changing 3514 tbl 7 AC Test Conditio Input Pulse Levels Input Rise/Fall Times Input Timing Reference Levels Output Reference Levels AC Test Load GND to 3V 3 15V 15V See Figure 1 and 2 3514 tbl AC Test Loads 5V 5V 4Ω 4Ω DATA OUT DATA OUT 3pF 255Ω 3514 drw 3 5pF* 255Ω 3514 drw 4 Figure 1 AC Test Load *Including jig and scope capacitance Figure 2 AC Test Load (for tclz, tolz, tchz, tohz, tow, and twhz) 642 3

IDT714 CMOS Static RAM 1 Meg (K x -bit) Revolutionary Pinout Commercial and Industrial Temperature Ranges AC Electrical Characteristics (VCC = 5V ± 1%, Commercial and Industrial Temperature Ranges) 714S (2) 714S 714S2 Symbol Parameter Min Max Min Max Min Max Unit READ CYCLE trc Read Cycle Time 2 taa Address Access Time 2 ta Chip Select Access Time 2 tclz (1) Chip Select to Output in Low-Z 3 3 3 tchz (1) Chip Deselect to Output in High-Z 6 7 toe Output Enable to Output Valid 6 7 tolz (1) Output Enable to Output in Low-Z tohz (1) Output Disable to Output in High-Z 5 5 7 toh Output Hold from Address Change 4 4 4 tpu (1) Chip Select to Power-Up Time tpd (1) Chip Deselect to Power-Down Time 2 WRITE CYCLE twc Write Cycle Time 2 taw Address Valid to End of Write tcw Chip Select to End of Write tas Address Set-up Time twp Write Pulse Width twr Write Recovery Time tdw Data Valid to End-of-Write 6 9 tdh Data Hold Time tow (1) Output active from End-of-Write 3 3 4 twhz (1) Write Enable to Output in High-Z 5 5 NOTE: 1 This parameter guaranteed with the AC load (Figure 2) by device characterization, but is not production tested 2 There is no industrial temperature offering for the speed grade 3514 tbl 9 642 4

IDT 714 CMOS Static RAM 1 Meg (K x -bit) Revolutionary Pinout Commercial and Industrial Temperature Ranges Timing Waveform of Read Cycle No 1 (1) taa trc OE toe tolz DATAOUT (3) ta tclz HIGH IMPEDANCE tchz tohz DATAOUT VALID VCC SUPPLY CURRENT ICC ISB tpu tpd 3514 drw 5 Timing Waveform of Read Cycle No 2 (1,2,4) trc taa DATAOUT toh PREVIOUS DATAOUT VALID toh DATAOUT VALID 3514 drw 6 1 WE is HIGH for Read Cycle 2 Device is continuously selected, is LOW 3 Address must be valid prior to or coincident with the later of traition LOW; otherwise taa is the limiting parameter 4 OE is LOW 5 Traition is measured ±2mV from steady state 642 5

IDT714 CMOS Static RAM 1 Meg (K x -bit) Revolutionary Pinout Commercial and Industrial Temperature Ranges Timing Waveform of Write Cycle No 1 (WE Controlled Timing) (1,2,4) twc taw WE tas twhz (2) twp twr tow tchz DATAOUT (3) HIGH IMPEDANCE tdw tdh (3) DATAIN DATAIN VALID 3514 drw 7 Timing Waveform of Write Cycle No 2 ( Controlled Timing) (1,4) twc taw WE tas tcw twr tdw tdh DATAIN DATAIN VALID 3514 drw 1 A write occurs during the overlap of a LOW and a LOW WE 2 OE is continuously HIGH During a WE controlled write cycle with OE LOW, twp must be greater than or equal to twhz + tdw to allow the I/O drivers to turn off and data to be placed on the bus for the required tdw If OE is HIGH during a WE controlled write cycle, this requirement does not apply and the minimum write pulse is the specified twp 3 During this period, I/O pi are in the output state, and input signals must not be applied 4 If the LOW traition occurs simultaneously with or after the WE LOW traition, the outputs remain in a high impedance state must be active during the tcw write period 5 Traition is measured ±2mV from steady state 642 6

IDT 714 CMOS Static RAM 1 Meg (K x -bit) Revolutionary Pinout Commercial and Industrial Temperature Ranges Ordering Information 714 Device Type S Power XX Speed X Package X X Process/ Temperature Range X Blank Tube or Tray Tape and Reel Blank I Commercial (C to +7C) Industrial ( 4C to +5C) G Green Y 4-mil SOJ (SO32-3) * 2 Speed in nanoseconds 3514 drw 9 * No industrial temp on speed 642 7

IDT714 CMOS Static RAM 1 Meg (K x -bit) Revolutionary Pinout Commercial and Industrial Temperature Ranges Datasheet Document History /5/99: Updated to new format Pg 3 Removed military entries on DC table Pg 4 Removed Note 1 and renumbered footnotes Pg 6 Revised footnotes on Write Cycle No 1 diagram /13/99: Pg Added Datasheet Document History 9/3/99: Pg 1, 3, 4, 7 Added,, and 2 industrial temperature speed grade offerings 2/1/: Pg 3 Revise ISB for Industrial Temperature offerings to meet commerical specificatio 3/14/: Pg 3 Revised ISB to accomidate speed functionality 4/1/: Pg4 Tightened taw, tcw, twp and tdw within the AC Electrical Characteristics /9/: Not recommended for new desig 2/1/1: Removed "Not recommended for new desig" 1/23/: Pg7 Removed "IDT" from the orderable part number 4/2/13: Pg1 Removed speed from the Industrial temp offering Removed IDT in reference to fabrication Pg3 Removed the industrial speed grade information from the DC Electrical Chars table 7 Pg4 Added footnote 2 to AC Electrical Chars table 9 to indicate that there is no industrial speed Pg7 Added Tape & Reel and Green designators to the ordering information Added a footnote to the ordering information to indicate that there is no industrial speed offering CORPORATE HEADQUARTERS for SALES: 624 Silver Creek Valley Road -345-7 or San Jose, CA 9513 4-24-2 fax: 4-24-2775 wwwidtcom for Tech Support: sramhelp@idtcom 4-24-4532 The IDT logo is a registered trademark of Integrated Device Technology, Inc 642