43E7488 from the IBM System 8203-E4A Server Package Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales at Chipworks. 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: 613.829.0414 Fax: 613.829.0515 www.chipworks.com
Package Analysis Table of Contents 1.1 List of Figures 1.2 List of Tables 1.3 Company Profile 1.4 Introduction 1.5 Device Summary 1.6 Package and Die Summary 2 Device Identification 2.1 Server Motherboard and Heatsink 2.2 Package and Die 3 IBM POWER6 Package and Die Cross-Sectional Analysis 3.1 Package Structure 3.2 Package Lid (IHS) 3.3 Package Substrate Metal Layers and Vias 3.4 Solder Bumps 4 Materials Analysis 4.1 SEM-EDS Analysis of Package Materials 5 References 6 Statement of Measurement Uncertainty and Scope Variation About Chipworks
Overview 1-1 1.1 List of Figures 2 Device Identification 2.1.1 8203-E4A Server Front View 2.1.2 8203-E4A Server Back View 2.1.3 8203-E4A Server Motherboard Top View 2.1.4 Heatsink on Motherboard View A 2.1.5 Heatsink on Motherboard View B 2.1.6 Motherboard Solder Bumps 2.1.7 Heatsink Bottom View 2.1.8 Heatsink End A View 2.1.9 Heatsink End B View 2.1.10 Heatsink Side View 2.1.11 Heatsink Top View 2.2.1 Package Top View 2.2.2 Package Edge View 2.2.3 Package X-Ray 2.2.4 Package X-Ray Detail 2.2.5 Partial Die Photograph 2.2.6 Die Solder Bump Pads 3 IBM POWER6 Package and Die Cross-Sectional Analysis 3.1.1 Package Cross Section Overview 3.1.2 Motherboard Solder Balls 3.1.3 Package Edge 3.1.4 Die Edge Cross Section Right-Hand Edge 3.1.5 Die Edge Cross Section Left-Hand Edge 3.1.6 SEM TIM 1 Cross Section Right-Hand Die Edge 3.1.7 SEM TIM 1 Cross Section Left-Hand Die Edge 3.1.8 SEM TIM 1 Cross Section Mid Right-Hand Die 3.1.9 SEM TIM 1 Cross Section Center Die 3.1.10 SEM TIM 1 Cross Section Mid Left-Hand Die 3.1.11 SEM TIM 1 Detail 3.1.12 Underfill Cross Section Right-Hand Edge 3.1.13 Underfill Cross Section Left-Hand Edge 3.1.14 Die Seal Left-Hand Edge 3.2.1 Package IHS Die Island Thickness Left 3.2.2 Package IHS Die Island Thickness Right 3.2.3 Package IHS Edge 3.2.4 IHS Attach Detail 3.2.5 Package IHS Plating Thickness 3.3.1 Organic PS General Structure Optical 3.3.2 Organic PS Metal 9-14 3.3.3 Through Hole Via and Metals 7 and 8 3.3.4 Top of Through Hole Via SEM
Overview 1-2 3.3.5 Organic PS Metals 1-6 3.3.6 Minimum Observed Metal 10 3.3.7 Stacked Vias 3.4.1 Solder Bump 3.4.2 Solder Bump SEM 3.4.3 Solder Bump LHS 3.4.4 Solder Bump Middle 3.4.5 Solder Bump RHS 3.4.6 Die UBM SEM 3.4.7 Die UBM Detail SEM 3.4.8 Solder Bump Organic PS Sn Land Detail SEM 4 Materials Analysis 4.1.1 IHS (Lid) Plating 4.1.2 IHS (Lid) Body 4.1.3 IHS Attach 4.1.4 TIM 1 Al Particles 4.1.5 TIM 1 Between Al Particles 4.1.6 Die Coat 4.1.7 Solder Bump UBM TiW 4.1.8 Solder Bump UBM Cr 4.1.9 Solder Bump UBM Cu 4.1.10 Solder Bump UBM Ni 4.1.11 Body of Solder Bump A 4.1.12 Body of Solder Bump B 4.1.13 Organic PS Metal 14 Sn Land 4.1.14 Organic PS Metal Interconnect 4.1.15 Die Underfill 4.1.16 Organic PS Solder Mask 4.1.17 Organic PS Buildup Layer Dielectric 4.1.18 Organic PS Fiberglass Core 4.1.19 PS to PCB Solder Ball 1.2 List of Tables 1.5.1 Device Summary 1.6.1 Package Summary 1.6.2 Observed Package Metal Dimensions 1.6.3 Package Vertical Dimensions and Materials (Top to Bottom)
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