MLSEP*** Series. Multilayer Polymer ESD Suppressor. Features. Application. Electrical Characteristics

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Features ESD protection for high speed data lines to IEC61000-4-2 ESD contact discharge typical 8KV, max 15KV IEC61000-4-2 ESD air discharge typical 15KV, max 25KV Protect four data lines Flow through design, easy for lay-out Multilayer structure Surface mount Extremely low capacitance Very low leakage current Fast response time Bi-directional ESD protection Lead free solder termination The best ESD protection for high frequency, low voltage applications Application High Definition Multi-Media Interface (HDMI) Digital Visual Interface (DVI) Display Port Interface Unified Display Interface (UDI) MDDI Ports Gigabit Ethernet USB2.0 and IEEE1394 interface Caution: This component is designed for signal line protection only, not intended to be used under bias, not for application with a power line. Electrical Characteristics Electrical Characteristics Parameter Symbol Conditions Min Typ Max Units Continuous operating voltage V DC --- --- --- 8 V Trigger voltage V T IEC61000-4-2 8KV contact discharge --- 300 --- V Clamping voltage V C IEC61000-4-2 8KV contact discharge --- 15 --- V Leakage current I L 8V V DC --- 0.10 10 na Capacitance C P VR = 0V, f = 1MHz --- 0.15 0.3 pf Operating Temperature --- --- -40 --- 90 Storage Temperature --- --- -55 --- 150 ESD pulse withstand Pulses IEC61000-4-2 8KV contact discharge 2000 --- --- --- Notes: 1, Trigger and clamping voltage measure per IEC 61000-4-2, 8KV contact discharge method Polymer ESD Suppressor 1 www.semiteltech.com

Typical PESD clamping for +8KV pulse per IEC61000-4-2 Design Recommendations for HDMI For HDMI Source Device For HDMI Sink Device Polymer ESD Suppressor 2 www.semiteltech.com

Design Recommendations for Display Port For Display Port Source Device For Display Port Sink Device Part Numbering Polymer ESD Suppressor 3 www.semiteltech.com

Circuit diagram Eye Pattern Test HDMI Port lane was protected with, tested for 2.25G bps HDMI Port without HDMI Port with Environmental Specifications Operation temperature: -40~90 Moisture Resistance, Steady state: MIL-STD-833, Method 1004.7, 85% RH,85,1000hrs Thermal Shock: MIL-STD-202, Method 107G,-55 to150,30 min cycle,10 cycles. Vibration: MIL-STD-202F, Method 201A, (10 to 55 to 10HZ, 1 min. cycle, 2hrs each in X-Y-Z) Chemical Resistance: ASTM D-543, 4hrs @40, 3 solutions (H 2 O, detergent solution, deluxer ) Solder leach resistance and terminal adhesion: Per EIA-576 test Polymer ESD Suppressor 4 www.semiteltech.com

Pin configuration Pin Identification 1, 2, 4, 5 Input lines 6, 7, 9,10 Output lines 3, 8 Ground Product Dimensions (mm) Length A Width B Height C Terminal width D Unit Min Max Min Max Min Max Min Max 2.45 2.55 0.90 1.1 0.33 0.43 0.25 0.45 mm Solder Pad Layouts A B C D Unit Min Max Min Max Min Max Min Max 0.20 0.30 0.55 0.65 0.35 0.45 0.45 0.55 mm E F G Unit Min Max Min Max Min Max 0.45 0.55 0.25 0.35 1.4 1.6 mm Polymer ESD Suppressor 5 www.semiteltech.com

Solder Reflow Recommendation Notes: Item Process Description Reach Temp. Time or Rate A Soak Start From ambient to soak temperature and soak start 150-180 2-4 / sec B Soak time Soak time --- 60s - 120s C Soak end Soak end 180-200 --- D Peak Temp. From soak temperature to Peak temperature 260 2-3 / sec E Time above Main heating time 230-260 40s - 60s F Cooling From main heating temperature to 100 100 Max. 4 / sec 1* Peak temperature can be high to 260, and the recommendation time is as below at 230 40s ~ 60s at 240 30s ~ 40s at 260 5s ~ 10s 2* Recommended reflow methods: IR, Vapor phase oven, hot air oven, wave solder. 3* Devices can be cleaned using standard industry methods and solvents. 4* Component can withstand 270 10 sec. 5* If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Package Information Tape & Reel: 3000pcs per reel. Contact Information SEMITEL Electronics Co., Ltd. Flat C, 9/F, Unison Industrial Centre, 27-31 AuPuiWan Street, Fotan, Shatin, Hong Kong Tel:00852-35273141 Fax:00852-35251735 EMAIL:info@semiteltech.com Rev. letter E Date 2008-7-22 Design Check Audit Approve Tony Michael Ken Ken Polymer ESD Suppressor 6 www.semiteltech.com