XEN1210 Magnetic Sensor

Similar documents
± 2g Tri-axis Accelerometer Specifications

PIN ASSIGNMENT PIN DESCRIPTION

MMC212xMG. Dual-axis Magnetic Sensor, With I 2 C Interface FEATURES. Signal Path X

DIGITAL COMPASS SOLUTION

Signal conditioning and filtering. Temperature Sensor. 1 SCK 3 MISO 4 MOSI 7 CSB Sensing element 2. Signal conditioning and filtering

TSYS01-FAMILY Digital Temperature Sensors

ORDERING INFORMATION. OPERATION Measuring Temperature A block diagram of the DS1621 is shown in Figure 1. DESCRIPTION ORDERING PACKAGE

TS2043 Preliminary CMOS IC

DS1626/DS1726 High-Precision 3-Wire Digital Thermometer and Thermostat

Digital Thermometers and Thermostats with SPI/3-Wire Interface

DS Wire Digital Thermometer and Thermostat

Preliminary Product Overview

Stereo Audio Volume Control

DS1306. Serial Alarm Real Time Clock (RTC)

User-configurable Resolution. 9 to 12 bits (0.5 C to C)

GSDM110 Three-Axis Digital Magnetometer

DS1631/DS1631A/DS1731 High-Precision Digital Thermometer and Thermostat

3-Axis Digital Compass IC HMC5883L

ams AG austriamicrosystems AG is now The technical content of this austriamicrosystems document is still valid. Contact information:

HL2430/2432/2434/2436

User-configurable Resolution. 9 to 12 bits (0.5 C to C)

3-Axis Magnetic Sensor QMC5883L

SPI Protocol of the TLE941xy family

HDPM01. Description. Features. Applications

Drawing code Package Tape Reel 8-Pin DIP DP008-F 8-Pin SOP(JEDEC) FJ008-A FJ008-D FJ008-D 8-Pin TSSOP FT008-A FT008-E FT008-E

PIN CONFIGURATION Fig. 2: Pin configuration of MS5561 Pin Name Pin Type Function SCLK 1 I Serial data clock GND 2 G Ground PV (1) 3 N Negative

Low Voltage, 10-Bit Digital Temperature Sensor in 8-Lead MSOP AD7314

3-Axis Digital Compass IC HMC5983

Fully Integrated Thermal Accelerometer MXC6225XU

±0.5 C Accurate, 16-Bit Digital SPI Temperature Sensor ADT7310

Application Note TSYS01

DS1302. Trickle Charge Timekeeping Chip FEATURES PIN ASSIGNMENT PIN DESCRIPTION

PAS 9732/AI ENGINEERING SPECIFICATION

MS BA Micro Barometric Module

XRD87L85 Low-Voltage CMOS 8-Bit High-Speed Analog-to-Digital Converter

A0021. Overview. Features. Ordering Information. HSS Touch Signature IC 6 Input - I 2 C. Part Number Format: A X Y Z

NPA. Amphenol Advanced Sensors. Surface-Mount Pressure Sensor Series. Features

Product Family Specification

ICS548A-03 LOW SKEW CLOCK INVERTER AND DIVIDER. Description. Features. Block Diagram DATASHEET

16AIO 16-Bit Analog Input/Output Board With 32 Input Channels, 4 Output Channels and 16-Bit Digital I/O Port

Pedometer 3 Click. PID: MIKROE 3259 Weight: 24 g

TMR1202. General Description. TMR Bipolar Switch. Features and Benefits. Applications

Digital Thermometer and Thermostat

DS1625. Digital Thermometer and Thermostat FEATURES PIN ASSIGNMENT

PMC-16AIO 16-Bit Analog Input/Output PMC Board With 32 Input Channels, 4 Output Channels and 16-Bit Digital I/O Port

DS1305EN. Serial Alarm Real-Time Clock

XRD8775 CMOS 8-Bit High Speed Analog-to-Digital Converter

PC104P-16AIO Bit Analog Input/Output PC104-Plus Board

Altimeter / Barometer Module SMD500 ultra low power, low voltage

SS246 CMOS High Sensitivity Micropower Hall Latch


US1881 CMOS Multi-purpose latch

PMC-12AIO. 12-Bit PMC Analog Input/Output Board

An SPI Temperature Sensor Interface with the Z8 Encore! SPI Bus

A0061. Overview. Features. Ordering Information. HSS Touch Signature IC 15 Input - I 2 C. Part Number Format: A X Y Z

Control Circuitry 2 M1. Micrel Inc Fortune Drive San Jose, CA USA tel +1 (408) fax + 1 (408)

CW2013. Low-Cost 1s Fuel Gauge IC with Low-SOC Alert. General Description. Features. Applications. Order Information

PC104P-16AO20 20-Channel 16-Bit High-Speed Analog Output PC104-Plus Board With 440,000 Samples per Second per Channel, and Simultaneous Clocking

S-29530A/29630A CMOS SERIAL E 2 PROM. Rev.1.2_00. Features. Packages

MS5561C Micro Altimeter

PC-CARD-DAS16/12 Specifications

Digital Thermometer and Thermostat

CARDINAL COMPONENTS. FREQUENCY A MHz. Specifications: Min Typ Max Unit

DS75 Digital Thermometer and Thermostat

DS1305. Serial Alarm Real Time Clock (RTC) FEATURES PIN ASSIGNMENT ORDERING INFORMATION

SENSYLINK Microelectronics Co., LTD. (CT1701) Single-Wire Digital Temperature Sensor

PC-CARD-DAS16/16 Specifications

BD027-14E Low-Voltage Nanopower Digital Switch for Medical Devices

CAT25C02/04/08/16/32 2K/4K/8K/16K/32K SPI Serial CMOS E 2 PROM FEATURES

Features. Applications

Atmos Engineering, Inc. External Specification PN PC104 Air Data Atmodule PN Revision 6.0

AT25PE40. 4-Mbit DataFlash-L Page Erase Serial Flash Memory ADVANCE DATASHEET. Features

Preliminary Data MOS IC. Type Ordering Code Package SDA Q67100-H5092 P-DIP-8-1

SCA620-EF1V1B SINGLE AXIS ACCELEROMETER WITH ANALOG INTERFACE

Surface Mount Micromachined Accelerometer

ASM330LHH. Automotive 6-axis inertial module: 3D accelerometer and 3D gyroscope. Data brief. Features. Applications. Description

2-Wire, 5-Bit DAC with Three Digital Outputs

DS WIRE INTERFACE 11 DECOUPLING CAP GND

HDI Series Amplified pressure sensors

DS1305 Serial Alarm Real Time Clock (RTC)

RM331x Series Kbit Ultra-Low Power Non-volatile Serial Memory SPI Bus

Digital "Mini" SiSonic TM Microphone Specification - Halogen Free. Knowles Acoustics 1151 Maplewood Drive Itasca, IL 60143

DS1306 Serial Alarm Real-Time Clock

HMR3200/HMR3300 APPLICATIONS. Features. General Description. Block Diagram. Compassing & Navigation. Attitude Reference. Satellite Antenna Positioning

PCI-12AIO 12-Bit Analog Input/Output PCI Board

PMC-12AI Channel, 12-Bit Analog Input PMC Board. With 1,500 KSPS Input Conversion Rate

1.3inch OLED User Manual

CARDINAL COMPONENTS. Specifications: Min Typ Max Unit

MPU-6000/MPU Axis Evaluation Board User Guide

+Denotes a lead(pb)-free/rohs-compliant package.

DIGITAL HUMIDITY SENSOR HYT-131

TS1000T Ceramic Evaluation Board (CEB1000_1)

S-2900A. Rev CMOS 512-bit SERIAL E 2 PROM

DIGISENSOR CO., LTD Tel.: (848) Website :

Digital Thermometer and Thermostat in SOT23

Preliminary Data MOS IC. Type Ordering Code Package SDA Q67100-H5096 P-DIP-8-1

Features. Applications

16AIO Bit Analog Input/Output Board. With 16 Input Channels and 8 Output Channels

Clock and Fuses. Prof. Prabhat Ranjan Dhirubhai Ambani Institute of Information and Communication Technology, Gandhinagar

output current sink/source 2 ma PIC 16F690 (see datasheet) SPI resolution 12 bit position accuracy 0.2 deg

Transcription:

Features Single axis magnetic measurement One chip solution 15nT resolution Unmatched low offset (Sub-µT) and gain precision Wide magnetic field range (±63mT) No magnetic hysteresis Measurement rate up to 5kSPS Low voltage operation (2.5V to 3.3V) Single supply Serial SPI communication -40 C to 125 C Temperature Range Surface mount package (1.4x1.6x4mm) Package 3D solderable Available in tape and reel General Description XEN1210 is a magnetic field sensor based on the Hall effect. It uses Sensixs's Q-Hall technology, which with a resolution of 15nT and a magnetic field range of 63mT combines the best of Hall and AMR technology in one. In position and speed applications where conventional Hall and AMR technology suffer from a large natural offset (drift), its unmatched low offset and offset stability simplifies the design. In contrast to AMR compass sensors no set/reset sequence is required. The XEN1210 can be used for a wide range of magnetic sensing applications. Applications Compass Sensors Linear Magnetic Field Sensor Linear Position and Speed Measurement Rotary Position and Speed Measurement Current Sensing A maximum read-out frequency of 5kSPS can be obtained. The control is fully digital and readout and programming is performed via the SPI bus. For battery applications, power can be saved by taking single shot measurements. In power-off mode the current draw is limited to below 100nA. Except for SOIC8, the XEN1210 is available in SFN8 packages, which can be freely oriented on a PCB in 3 dimensions. By combining a number of XEN1210 sensors in (different) orientations rotary or linear position sensor systems can be designed. Figure 1: Functional block diagram. 1 of 14

Specifications Table 1: Specifications for the XEN1210. Specification Conditions Min Typ. Max Unit Power supply VDD 2.5 3.3 3.6 V IDD Sleep mode 50 na Idle mode 10 A Power-up mode (Always On) 4.7 ma Magnetic Specifications Field Range 1 Gain mismatch Gain TC Gain TC mismatch 2 ±63 0.5 400 25 mt % ppm/k ppm/k Offset Without calibration 1.5 µt Offset TC 15 nt/k Resolution (24 bits 3 ) 7.5 nt/lsb Noise 4 55 nt/ Hz Hysteresis 10 nt Maximum exposed field No effect Compass Application Heading Noise 5 Horizontal Field=17µT, full power 0.125 / Hz System speed CLK 6 0.8 1 2.5 7 MHz Sample speed 5Mhz CLK 5 khz Turn on time 5kHz programmed measurement time, device needs no additional turn on time. 200 s SPI Bus SPI Speed 400 khz Temperature Temperature Range -40 +125 C Magnetic Flux Density: Magnetic Field: 100 micro Tesla (µt) = 1 gauss (G) =1Oe (in air) 1 oersted (Oe) = 79.58 amperes/meter (A/m) 100 000 gamma = 1 Oe = 79.58 A/m 1 At 75% Hall Biasing. 2 Single batch data. 3 The LSB is used for encoding the data valid flag, therefore the maximum obtainable resolution is 15nT, this is however well below the practical noise floor, so if the data valid flag is not used, no bitwise masking is required. 4 Measured with 100% Hall biasing, best temperature performance is with 75% Hall biasing but leads to 25% more noise. 5 Refer to our compass application notes. 6 XEN1210 needs a stable clock frequency. 7 Higher clocks are possible but the noise performance of the XEN1210 will deteriorate with higher clocks. 2 of 14

Introduction The XEN1210 is a CMOS linear magnetic field sensor with a very low offset. It uses Sensixs's patented high performance spinning-current Hall-plate technology, a precision amplifier and a sigma delta AD converter, and offers full digital control and communication through a SPI serial bus. The device does not need calibration and in contrast to low-offset AMR sensors does not use a set/reset method. It has no hysteresis and is indestructible by high magnetic fields. It does not need any external components and is truly a one-chip solution. Speed and internal measurement time can be changed at will. The clock frequency in combination with the setting in the speed register determine the measurement time of the device from 0.2ms to 66ms. The device can be read out using the data valid signal as an interrupt for the Host CPU or at any desired readout speed. A data-valid flag is present in the data itself. Hall bias settings can be programmed to exchange power consumption and performance. The device addresses a large magnetic range without the need of gain settings. A 24-bit digital output is provided. There is no power-up reset so the device has to be initially programmed by the host CPU each time the supply is switched on. The device can be put in sleep mode, idle mode, in continuous measurement mode or in single shot mode. The main use of these modes is the preservation of power. The device is available in SOIC8 and SFN8 packages, which can be freely oriented on a PCB in 3 dimensions. By combining a number of XEN1210 sensors in different orientations, rotary or linear position sensor systems can be designed. 8 Figure 2: Typical connection scheme of two XEN1210 to a Host CPU. A 100nF decoupling capacitor can be used when the supplies are not clean. 8 Please refer to our compass and position application nodes for practical examples. 3 of 14

Digital Communication - SPI interface Communication with the XEN1210 occurs via the serial SPI interface. The SPI interface is externally controlled by four signals : chip select (CS), serial clock (SCK), serial data in (MOSI/SDI), and serial data out (MISO/SDO). SPI mode is 1, which means that SCK has a zero base value (CPOL=0) and data is read on SCK s falling edge, while data is changed on the rising edge (CPHA=1). Typically the speed of SCK is 100kHz. Read-out speeds up to 1Mhz are allowed as long as the T buf is satisfied. T buf is typically two times the CLK period. Figure 3: Timing of the SPI bus interface with chip select, clock, and data signals. The SPI interface has one serial shift register and two buffers: a receive-buffer in which the data is loaded from the shift register at the end of CS, and a transmit-buffer from which the data is loaded into the shift register at the beginning of CS. Writing the SPI register will shift in serial data from SDI and shift out serial data from SDO pin. Reading and writing is therefore always performed simultaneously. Transmission always goes in a multiple of 3 bytes with the MSB (bit D23) send first. The SPI interface is still operational when the device is in power-off mode. Figure 4: Functional block diagram SPI register. Data Output Format The XEN1210 provides a 3-byte result in two s complement code. Table 2 shows the digital encoding of the magnetic reading. Data is double buffered and can be read out any time. When new data becomes available through the internal ADC, the XEN1210 pulls up the data valid pin for one clock period and refreshes the 3 byte transmit buffer. The LSB (bit D0) of the buffer is also used as a data valid flag. When the transmit buffer is loaded into the SPI register at the start of a SPI transmission, the data valid flag is reset to 0. When new ADC data is loaded into the transmit buffer, the DV flag is set to 1. This helps to see if the last read data is new or if it has been read before. If data is not read before a new sample of the ADC is available it is lost. Since the system noise is usually higher than the LSB, it is not strictly necessary to bit-wise mask the data-valid flag, when calculating the magnetic field strength. 4 of 14

Table 2: Decoding the two's complement code and data-valid flag. LSB s HEX code Field strength Remarks + 2 23-1 0x7FFFFF +63 mt + 255 0x0000FF +1.9 µt +3 0x000011 +21.5nT Data valid +2 0x000010 +15nT Data non valid. +1 0x000001 +7.5nT Data valid 0 0x000000 0 Data non valid. -1 0xFFFFFF -7.5nT Data valid -255 0xFFFF01-1.9 µt - 2 23 0x800000-63 mt Data Read Out When the XEN1210 is read out, care has to be taken that the SDI pin is high. The SDO pin of the host CPU connected to this SDI should be high or high impedance. In the latter case the internal pull-up of the XEN1210 SDI pin ensures a high state. This is necessary to avoid that the device s operation is changed by unintentionally programming it. Commands The XEN1210 can be controlled and the settings programmed by sending commands over the SPI bus. Commands are coded in a 3-byte format. The first byte (D23-D16) is the program byte, which defines the desired action. The two remaining bytes (D15-D8 and D7-D0) are the setting bytes, which control the speed and biasing of the device. Operation Commands The XEN1210 can be controlled with 4 operation commands: power-on, power-off, system-reset, and singleshot. With these commands only the program byte is used and the setting bytes are ignored. The primary purpose of the modes is system synchronization and power management. Table 3: Operation commands used with the XEN1210. Operation Command System-Reset Power-On Power-Off Single-Shot Program Byte 0x10 0x20 0x40 0x60 Reset The reset command is used during power-on to reset the state machine of the XEN1210 to its initial state, devices can be synchronized as a group or individual. Power-off The power-off command switches off the power to all circuits except for the SPI interface. Communication and programming is still possible during power-off. Power consumption in this mode is several micro-amps. For full system power saving mode CLK has to be pulled low as well. This also stops the SPI communication. Power consumption during power-off will be less than 100nA. 5 of 14

Power-on The power-on command applies power to all circuits. When sending power-on, the system also resets with a system reset command. In this mode measurements are taken continuously and can be read from the SPI bus. Single-shot The single-shot command calls the power-on command, performs a single measurement, and calls the poweroff command. It is very important NOT to send a new single-shot command before the previous command sequence has finished. This is indicated by the data-valid pulse on the DV pin. If the single-shot command is send before the previous command sequence has finished then the XEN1210 is reset, so the previous single shot sequence will not finish and no new data is provided. The time needed for a single-shot sequence depends on the timing settings of the XEN1210. The single-shot command only works when the device is powered off. In this mode, power can be saved by using the device only when data is required. Figure 5: The measurement time after a single shot command depends on the timing settings. Only during measurement power is consumed. Settings Commands There are 2 setting commands: one for the timing and bias register, and one for the test register. The setting commands will refresh the setting registers of the device. Table 4: Setting commands used with the XEN1210. Settings Command Program Byte Setting Bytes Timing and biasing 0x01 See Table 5. Test 0x02 See Table 7. Timing settings The timing settings control the speed of measurement. There are 7 settings, with each step doubling the number of clock cycles used in the internal ADC. The total conversion time is still dependent on the frequency of CLK. In Table 5, two situations have been calculated: one at 1MHz clock speed, and one at 5MHz clock speed. At 5Mhz the noise performance is slightly deteriorated. The bias settings for the Hall plate are on 75%. The noise and timing data are for continuous mode only. Timing Settings Table 5: Read out frequency and measurement time for the speed settings and 1MHz or 5MHz clock. Clock Cycles Time [ms] 1MHz Max SPS [Hz] Noise (σ) [µt] Time [ms] 5MHz Max SPS [Hz] Noise (σ) [µt] 0x1113 1024 1.0 976.6 2.3 0.20 4882.8 5.8 0x2113 2048 2.1 488.3 1.6 0.41 2441.4 4.1 0x3113 4096 4.1 244.1 1.2 0.82 1220.7 2.9 0x4113 8192 8.2 122.1 0.81 1.64 610.4 2.1 0x5113 16384 16.4 61.0 0.57 3.28 305.2 1.4 0x6113 32768 32.8 30.5 0.41 6.55 152.6 1 0x7113 65536 65.5 15.3 0.29 13.1 76.3 0.7 6 of 14

Single shot timing settings At single shot mode part of the time is reserved for the start-up and stabilizing of the system. The codes are factory programmed into a safe start up. This will however consume some power and demand some measurement delay time. Please contact Sensixs Design for other start up codes. Table 6 Start up code to use at single shot measurements. Timing Settings Command Timing Settings Safe start up 0x--13 Half safe - No start up - Hall bias settings. In Table 7 the recommended settings for the Hall biasing are shown. The biasing can be increased and decreased with 25% to 100% or to 50%. Please contact Sensixs Design if you want to optimally use these code. The settings control the Hall current and the scale of the magnetic reading will scale with the chosen biasing compared to the factory setting of 75%. As a result the maximum range and the magnetic noise will scale down with a higher bias setting. 100% biasing is only recommended for a temperature range below 60 degrees Celcius. Table 7 Bias setting commands. Bias Settings Command Biasing Settings 100% Hall Biasing 0x--33 75% Hall Biasing (preferred) 0x--13 50% Hall Biasing 0x--23 Test settings The test factor contains a number of factory set values and needs to be programmed on 0x3A00 Combined Commands Operation commands and setting commands can be combined, by adding the command codes. This is most useful for the single shot command, where a sample time can be programmed for each individual single shot. Table 8: Combined commands. Command Program Byte Setting Bytes Single-Shot and Timing 0x61 0x1113 Typical initialization and operation Power supply on initialization The XEN1210 does not reset when power is applied, and the device has to be fully programmed before use. Good programming practice is to first send a power-off command and then program both timing and test registers with the desired settings. 7 of 14

Table 9: Device initialization sequence. Command Program Byte Setting Bytes Power-Off 0x40 0x0000 Timing 0x01 0x1113 Test 0x02 0x3A00 Full Power Mode A full-power operation can be entered by sending the power-on command. Directly after sending the power-on command, all devices that are connected to the bus are synchronized and will start measuring continuously at the programmed speed. The XEN1210 data can now be read by either using the DV pin as an interrupt, or by just clocking out the SPI data. Duplicate data can be filtered by looking at the data valid flag in the LSB of the data word. Table 10: Device put into continuous measurement mode. Command Program Byte Setting Bytes Power-On 0x20 0x0000 Reprogramming during operation Because settings are implemented immediately, reprogramming during operation should be combined with a system synchronization command. This will prevent a change of settings while a measurement takes place, which can lead to incorrect magnetic readings. Synchronization and reprogramming can be combined in a single command. Table 11: Reprogramming the device during measurement. Command Program Byte Setting Bytes Power-On and Timing 0x21 0x1113 System-Reset and Timing 0x11 0x1113 Single-Shot Mode A single-shot operation with a measurement time of 1ms (with 1MHz clock) is shown in Table 12. The command powers on the device for 1 measurement and powers off immediately after. The device then keeps the data in memory until read by the host CPU. Table 12: Taking a single shot with a sample time of 1ms. Command Program Byte Setting Bytes Single-Shot and Timing 0x61 0x1113 8 of 14

Figure 6: Flow diagram for continuous operation (a) or single shot operation (b). 9 of 14

Connection schemes By using multiple XEN1210, in similar or different orientations, many magnetic measurement problems can be solved. The devices can be electrically connected in two ways: Parallel The devices can be used with SDI and SDO fully parallel and separate CS pins. They are selected individually. Daisy chain Several devices can be daisy chained by connecting SDO to the next SDI. As such, they function as one long shift register, so commands and data are sent and received in multiples of 3 bytes. Commands and data of the individual devices in the chain have to be positioned in the correct order. Figure 7: Devices connected in parallel mode use a separate chip select signal (left), and devices connected in daisy chain mode use a single chip select signal and loop the SDI-SDO shift registers (right). 10 of 14

Lead Pin Configuration The XEN1210 is delivered in SOIC8 and a custom made package in called SFN8, which can be used to measure the X, Y and Z axis of the magnetic field. Vertical package SFN8 The vertical package is a special SMD mountable package, which is an adapted version of the QFN technology. Eight leads on one side are used for interconnection. The package dimensions are 4mm*1.6mm*1.4 mm. In comparison with standard QFN technology, the thickness of the package is increased to 1.4mm. This allows stable positioning of the package on its side. In this vertical position, soldering is performed with the solder to the side of the package instead of underneath. The package can be oriented in any direction on the PCB and is intended to measure the x-y-z axis for a 2 or 3D magnetic field sensor. 9 The magnetic sensitivity and position of the Hall-plate are shown in Figure 8. The pin numbering and their functional description can be found in Table 13. Figure 8: Footprint and magnetic sensitivity position. Table 13: XEN-1210 SFN8 pin configuration Pin Name Type Functionality 1 CLK Dig. In CLocK is the main clock and determines the speed of the module. Typical clock frequency is 1-5MHz. 2 CS Dig. In Chip Select selects the device when this input is low. A high level deselects the device and forces SDO into tri-state mode. 3 SCK Dig. In Serial shift ClocK determines the speed of the SDI/SDO shift register. 4 SDI/MOSI Dig. In Serial Data Input pin. Data shifted in is committed on the falling edge of SCK. 5 SDO/MISO Tri-state Serial Data Output pin. Data is shifted out on the positive edge of SCK. Out 6 DV Dig. Out The Data Valid pin is pulled down for one clock period when the internal shift register is refreshed with new data. It can be used as an interrupt signal for the host CPU. DV pins cannot be shared. 7 GND Power Analog and Digital Ground 8 VDD Power Analog and Digital Power Supply (2.5V - 3.3V) 9 Further instructions for placement and soldering can be found in our technical notes. Pre-soldered 3D units with LCC-20 footprint are also available. 11 of 14

XEN1210-SOIC8 The device is sensitive to magnetic fields applied perpendicular to the top of the package. Table 14: XEN-1210-SOIC8 pinning Pin Name Type Functionality 1 CS Dig. In Chip Select selects the device when this input is low. A high level deselects the device and forces SDO into tri-state mode. 2 SCK Dig. In Serial shift ClocK determines the speed of the SDI/SDO shift register. 3 SDO/MISO Tri-state Serial Data Output pin. Data is shifted out on the positive edge of SCK. Out 4 GND Power Analog and Digital Ground 5 VDD Power Analog and Digital Power Supply (2.5V - 3.3V) 6 DV Dig. Out The Data Valid pin is pulled down when the internal shift register is refreshed with new data. It can be used as an interrupt signal for the µp. 7 SDI/MOSI Dig. In Serial Data Input pin. Data shifted in is committed on the falling edge of SCK 8 CLK Dig. In CLocK is the main clock frequency and determines the speed of the module. Typical clock frequency is 1-5MHz. 12 of 14

Ordering information Table 15: Ordering number. Ordering number XEN1210-SFN8XY XEN1210-SFN8Z XEN1210-SOIC8 Product Single sensor XY direction Single sensor Z direction Single Sensor SOIC8 13 of 14

General Information Product Status The XEN1210 is in production in SFN8 and SOIC8. The SFN8 is delivered in reel, with a vertical and horizontal position of the package. The SOIC8 is delivered in tubes. ASIC dies, other chip packages, are available on request. The magnetic technology used in the XEN1210 is also available as IP. At higher volumes, application specific products are offered. Customers are encouraged to check for further product developments. Please contact Sensixs Design b.v. for further details. Right to make changes Sensixs Design reserves the right to make changes to improve reliability, function or design of the devices. Sensixs Design assumes no responsibility or liability for the use of this product. Application Information Applications that are described herein are for illustrative purposes only. Sensixs Design makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Life critical applications These products are not qualified for use in life support applications, aeronautical applications or devices or systems where malfunction of these products can reasonably be expected to result in personal injury Sensixs Design b.v. Distributieweg 16 2645 EJ Delfgauw The Netherlands Phone +31 (0)15-3010018 Web: Copyright 2016 by Sensixs Design b.v., The Netherlands All rights reserved. No part of this document may be copied or reproduced in any form or by any means without the prior written agreement of the copyright owner. Sensixs Design does not assume any liability for any consequence of its use. 14 of 14