PCB Inspection System. Omron's 3D-SJI For Efficient Manufacturing of High-quality Products STABLE INSPECTION VT-S730 VT-S730

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1 N E W PCB Inspection System Omron's 3D-SJI For Efficient Manufacturing of High-quality Products STABLE INSPECTION VERTICAL START UP

Omron's 3D-SJI* * Solder Joint Inspection For Efficient Manufacturing of High-quality Products Improvement Cycle for High-quality Product Manufacturing Diagnose Loss/ risk co ntrol c ost Lo co st re

2 Omron's 3D-SJI* * Solder Joint Inspection For Efficient Manufacturing of High-quality Products Improvement Cycle for High-quality Product Manufacturing Diagnose Loss/ risk co ntrol c ost Lo co st re tion co st ss Preven du Evaluation/Inspection cost ct io n ng m ss to -le Au at ic ic ra al og rt pr Ve m st ar tu p Quality Logic criteria s Color/ election in area se spection ttings ni Tuning to produc counter ti incons on istencie s Skilled manua setup l Tu The eﬃcient improvement cycle ensuring the output of high-quality products promotes the "minimization of quality costs". This can further intensify the environment for quality improvement initiatives. Evalua tion/ inspe cost re ction ductio n Conventional Diagnose Realize quality control to create high-quality products VT-S Series Quality Quantification by 3D-SJI(Solder Joint Inspection) Define Detect Ensure constrainfree design to meet the needs of the market for compact size and lightweigh Lead posture Solder shape Land position Initiatives for quality control based on the same criteria between mother and satellite factories Quality Management in compliance with international standards* * ISO/TS16949, IPC-A610 Class 3, etc

Technologies Supporting 3D-SJI Detect Patent Pending Color Highlight Process Control Unique Technology 3D

Management reflection surface such as a solder joint.

eﬀorts in process improvement with the post-reflow quality as the starting point are possible.

Land position Quality/production control screen Phase Shift Inspection Principle New Lead posture Suitable for

Defects characteristic to component posture (lifted, tilted, etc.) can be easily detected.

3994925 "Wettability error" with No lead lifting Analysis function Q-up Navi v-ts Process comparison v-ca

Assistant Terminal The vertical startup of inspection programs is possible thanks to the combination of the

Land extraction STEP1 v-ts Teaching Terminal v-db Generation of component body windows Threshold settings

be directly set from a bare board; which makes operator need of component color tuning, thanks to quantified

3 Technologies Supporting 3D-SJI Detect Patent Pending Color Highlight Process Control Unique Technology 3D Shape Reconstruction Def ine Omron's TM Uses an optimal principle enabling a stable inspection of the Quality Management reflection surface such as a solder joint.system Q-up Navi Land/ Solder shape component Quality control during theextraction PCB production process and eﬀorts in process improvement with the post-reflow quality as the starting point are possible. Pass rates and real fault rates can be checked in real time to swiftly manage quality issues. Land position Quality/production control screen Phase Shift Inspection Principle New Lead posture Suitable for inspecting diﬀusing surfaces such as component bodies and leads. Defects characteristic to component posture (lifted, tilted, etc.) can be easily detected. Supports 3D model display Omron's 3D-SJI can detect Patent No "Wettability error" with No lead lifting Analysis function Q-up Navi v-ts Process comparison v-ca Shows real faults and false alarms in Pareto chart Auto Generation of Inspection Programs v-ca Visual Check Assistant Terminal The vertical startup of inspection programs is possible thanks to the combination of the Color Highlight TM 3D shape reconstruction and phase-shift principle. Land extraction STEP1 v-ts Teaching Terminal v-db Generation of component body windows Threshold settings STEP3 STEP2 Automatically extracts land positions The use of data eliminates the Quality control criteria can be directly set from a bare board; which makes operator need of component color tuning, thanks to quantified solder shape data. need only check whether the individual generating component body windows. Solder Print Post-Mount Post-Reflow X-Ray window settings are correct or not. Inspection System Inspection System Inspection System Inspection System (CKD) * Requires post-reflow PCB and mount data. VT-S500 VT-X700 * v-db compatibility with the X700 is currently under development.

Technologies Supporting 3D-SJI Omron's Unique Technology Detect Patent Pending Color Highlight 3D Shape Reconstruction TM

Solder shape Land/ component extraction Land position Phase Shift Inspection Principle New Suitable for inspecting diﬀusing

vertical startup of inspection programs is possible thanks to the combination of the Color Highlight TM 3D shape

Land extraction STEP1 Automatically extracts land positions from a bare board; which makes operator need only check whether

4 Technologies Supporting 3D-SJI Omron's Unique Technology Detect Patent Pending Color Highlight 3D Shape Reconstruction TM Uses an optimal principle enabling a stable inspection of the reflection surface such as a solder joint. Solder shape Land/ component extraction Land position Phase Shift Inspection Principle New Suitable for inspecting diﬀusing surfaces such as component bodies and leads. Defects characteristic to component posture (lifted, tilted, etc.) can be easily detected. Lead posture Omron's 3D-SJI can detect "Wettability error" with No lead lifting Auto Generation of Inspection Programs The vertical startup of inspection programs is possible thanks to the combination of the Color Highlight TM 3D shape reconstruction and phase-shift principle. Land extraction STEP1 Automatically extracts land positions from a bare board; which makes operator need only check whether the individual window settings are correct or not. * Requires post-reflow PCB and mount data. Generation of component body windows Threshold settings STEP3 STEP2 The use of data eliminates the need of component color tuning, generating component body windows. Quality control criteria can be directly set thanks to quantified solder shape data.

Quantitative Inspection Solder and component shapes can be measured [OK] [NG] Quantitatively detects the

camera incorporated Enables detecting solders under the components, which is physically undetectable from

reflection image example Conventional system Land position recognition and correction are performed for each

5 Quantitative Inspection Solder and component shapes can be measured [OK] [NG] Quantitatively detects the shape difference Stable Inspection Reduces the secondary reflection* and shadow interference Oblique viewing camera incorporated Enables detecting solders under the components, which is physically undetectable from direct view * Light reflection on adjacent components or solders Direct view Oblique view Secondary reflection image example Conventional system Land position recognition and correction are performed for each individual image screen, enabling the detection of warped or expanded/contracted PCBs Correctable even by the unit of the screen

We have delivered over 3,500 units to customers in the world's automobile industry Providing global intensive

Region China Taiwan EUROPE CHINA ASIA/PACIFIC Japan(HQ) Korea JAPAN Asia/Pacific Region Singapore Thailand

America Region Brazil Argentina Omron Group engineers provide direct support via its extensive network

Hardware configuration Outer dimensions 1100(W) 1470(D) 1500(H)mm Weight Approx.

purchase, including information on warranty, limitations of liability, and precautions.

OMRON Corporation INDUSTRIAL AUTOMATION COMPANY INSPECTION SYSTEMS BUSINESS DIVISION SALES DEPARTMENT

Conference 7F 2-3-13 Kounan Minato-ku Tokyo 108-0075 JAPAN TEL +81-3-6718-3550 FAX:+81-3-6718-3553 OMRON

F20,TowerA,NEO Building,6011ShennanAvenue, Futian District, Shenzhen, Guangdong 518048, China TEL:

6 We have delivered over 3,500 units to customers in the world's automobile industry Providing global intensive service and support Europe Region UK Germany France Hungary Spain Romania Italy Portugal Netherlands China Region China Taiwan EUROPE CHINA ASIA/PACIFIC Japan(HQ) Korea JAPAN Asia/Pacific Region Singapore Thailand Malaysia Indonesia India Philippines Vietnam AMERICAS North/Central America Region US Canada Mexico South America Region Brazil Argentina Omron Group engineers provide direct support via its extensive network spanning more than 30 countries (excluding South America and some European countries). Hardware configuration Outer dimensions 1100(W) 1470(D) 1500(H)mm Weight Approx. 800kg 200 to 240 VAC (single phase), Power supply voltage fluctuation range ±10% Line 900±20mm Air supply pressure 0.3~0.6MPa Functional specifications Supported PCB size Thickness Clearance Height measurement range 50(W) 50(D)~510(W) 460(D)mm 0.4~4mm Above PCB: 40mm; Below PCB: 40mm 25mm This document provides information mainly for selecting suitable models. Please read the Instruction Sheet carefully for information that the user must understand and accept before purchase, including information on warranty, limitations of liability, and precautions. This product may cause interference if used in residential areas. OMRON Corporation INDUSTRIAL AUTOMATION COMPANY INSPECTION SYSTEMS BUSINESS DIVISION SALES DEPARTMENT Shinagawa Front Bldg. Conference 7F Kounan Minato-ku Tokyo JAPAN TEL FAX: OMRON INDUSTRIAL AUTOMATION (CHINA) CO., LTD. F20,TowerA,NEO Building,6011ShennanAvenue, Futian District, Shenzhen, Guangdong , China TEL: FAX: Omron AOI Business Europe, Omron Europe B.V. Zilverenberg 2, 5234 GM 's-hertogenbosch, The Netherlands TEL: +31 (0) FAX: +31 (0) OMRON ELECTRONICS LLC 2895 Greenspoint Parkway, Suite 200 Hoffman Estates, IL U.S.A TEL: FAX: OMRON ELECTRONICS KOREA CO.,LTD. 21F, KyoboTower B Wing, 465, Gangnam-daero, Seocho-gu, Seoul, Korea TEL: FAX: OMRON ASIA PACIFIC PTE LTD 438A Alexandra Road #05-05/08 (Lobby 2) Alexandra Technopark Singapore TEL: FAX: Authorized Distributor: Cat. No. Q325-E1-03 Note: Specifications subject to change without notice 0416(0914)(O)

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