Electronics & Semiconductor Development. NX CAE A Modern Simulation Environment

Transcription

1 Electronics & Semiconductor Development NX CAE A Modern Simulation Environment Smarter decisions, better products.

2 Consumer and Industrial Electronics Already Have a Narrow Profit Window The Profit Window is narrow for Electronics and Computer manufacturers Time-to-Market tends to grow due to increased complexity Time-in-Market continues to shorten

3 Early Concept Analysis Virtual testing allows early concepts to be refined, reducing physical tests

4 Simulation Trends Earlier and faster iterations More complex phenomena Larger models, systems Increasing amounts of data

5 Simulation Challenges Today Complex Workflows YY- Stress PSD RMS=19.7 MPa Structural Analysis Geometry Analysis Data Dust Analysis Transient PCB Heat Transfer Analysis PCB Thermal Analysis Cooling Analysis Clearance Analysis ECAD Updates Life Analysis

6 Simulation Today Lack of a Cohesive Environment People Expert analysts Simulation Software Various pre/post tools Many solvers Simulation Processes Capture Re-use Simulation Data Work in progress Variants

7 Evolution of the Role of CAE Modern Simulation Environments CAE is evolving from being a set of black box tools for highly specialized individuals toward a group productivity environment that delivers strategic competitive advantages to the business by supporting simulation-driven design.

8 Modern CAE Environment Delivering Competitive Advantages People: Expert analysts Designers / Design Engineers Modern Simulation Environment Simulation Processes Capture Re-use Simulation Data Work in progress Variants

9 Modern CAE Environment Delivering Competitive Advantages Modern Simulation Environment People Expert analysts Designers / Design Engineers Training Support Smarter Decisions SPM Simulation Processes Capture Re-use SDM KBE Simulation Data Work in progress Variants

10 Elements of a Modern Simulation Environment Integrated Modeling and Solutions Multi-Discipline Simulation and Optimization System Level Modeling and Simulation Simulation Data and Process Management

11 Elements of a Modern Simulation Environment Aligned with Electronics Simulation Trends Earlier and faster iterations Integrated Modeling and Solutions More complex phenomena Multi-Discipline Simulation and Optimization Larger models, systems System Level Modeling and Simulation Increasing amounts of data Simulation Data and Process Management

12 NX CAE A Modern Simulation Environment Simulation Modeling Structural Thermal Flow Motion Multiphysics Optimization Data Management & Automation Simulation Driven Design

13 User Scalable Simulation Capabilities For all User Levels Expert Analyst Works with Non-NX geometry Modern, role-based interface Designer Embedded in NX CAD Simulation wizards Design Engineer Embedded in NX CAD Part / assembly validation Statics / modal / thermal Superior geometry editing Powerful FE modeling tools Linear, dynamics, non-linear, thermal, flow, motion, optimization, multiphysics Part validation Stress & vibration Motion analysis Clearance & interference NX Nastran + Multiple solver environments Guided process NX Nastran solver NX Nastran solver Problem Complexity

14 Global NX CAE Customers Electronics and Semiconductors Advantest Alpine Electronics ALPS Electric Amphenol Analogic Applied Materials ASML Bose Camera Dynamics Canon Reduced physical Casio Computer Cisco Systems Since Com introducing Dev NX, we Dalsa Semi The ability Datalogic to work in a Eastman prototypes Kodak Electro by 30% Scientific are Electrolux able to perform EMS Technologies highly integrated Enplas Semi repeated simulations Ericsson Foster Electric Freescale Semi Fuji Electric environment, Fujitsu where design during the design stage. concepts could be quickly Funai Improved Electric time Futaba to This Grupo has SEB helped us Haier Hitachi evaluated against all IBMmarket and Japan product Radio reduce Juki our development Kenwood requirements, Konica was Minolta critical to Kyocera quality lead times and lower LAM Research Leica Lexmark the success LG Electronics of this program. prototyping costs. Matsushita Methode Electronics Mitsubishi Electric Mitsumi Electric Multitest NEC Netel CommunicationShinji Nikon Yoda Nokia Oki Electric General Manager Greg Houghton Olympus Onkyo System-LSI Panasonic Design Support Parker SSD Drives Pentax Department Senior Engineer Philips Pioneer Radiacon y Microndas Ricoh Rohm Samsung Sanyo Seagate Seiko Sharp Shure Siemens AG Sony Telephonics Corp Thomson Toshiba Tyco Electronics Wincor Nixdorf Xerox Yokogawa Electric

15 Elements of a Modern Simulation Environment Integrated Modeling and Solutions Multi-Discipline Simulation and Optimization System Level Modeling and Simulation Simulation Data and Process Management

16 Integrated Modeling and Solutions Leverage geometry for faster CAE analysis modeling Fast, easy-to-use geometry tools Automatic clean up of CAD models Rapid, robust midsurfacing Quick creation of fluid domain Associative to design for rapid updates Open, multi-cae solver support (Nastran, ANSYS, Abaqus, LS-Dyna)

17 The Traditional CAE Process Part Design Find & Import Data Repair & Edit Geometry Mesh Loads & BCs Analysis Modeling Solve Evaluate

18 NX CAE vs. Traditional CAE Traditional CAE Process Faster initial iteration Rapid update for later iterations

19 Integrated Geometry Access Integrated into both NX and Teamcenter Instant access to the correct model definition Eliminates risk of translating geometry Locate and re-use existing models Reduces time to start process of CAE modelling

20 Integrated Geometry Tools CAE performed on a geometry variant Intuitive and fast direct geometry editing with Synchronous Technology Create the geometry required for CAE quickly NX ease-of-use combined with user roles to tailor UI

21 Rapid creation of fluid geometry Surface wrap fluid domain Quickly creates meshable fluid domain geometry Wraps interior of complex assemblies Benefits: Greatly simplifies fluid domain creation in complex parts or assemblies From hours to seconds Associativity to design is unique to NX

22 Comprehensive Meshing Meshes the most challenging geometry Best-in-class tet mesher NX knowledge based approach to meshing and geometry simplification Robust automatic and manual mesh options for 1D, 2D and 3D meshes Efficient connection modeling

23 Rapid Iteration of CAE Models Adapt quickly to changes in geometry Geometry edits and mesh associativity to design geometry Reduce build time for subsequent model iterations Analysts able to perform geometry changes for what-if analysis

24 Simulation Modeling Examples Defeaturing imported geometry using Synchronous Technology Fast, accurate mid-surfacing Surface wrapping for fast, accurate fluid domain geometry Fluid domain creating and meshing

25 KEF Case Study Business challenges: Achieve ongoing innovation Establish new concepts quickly in order to claim intellectual property rights Extend sound technology while adhering to cost targets Keys to success: Linking mechanical models and FEA models Establishing data history and associativity Easily creating sophisticated surfaces The NX associated modeling and meshing capability represents an extremely powerful tool. Mark Dodd Head of Group Research Results: Easy and quick path to FEA models Rapid product development, which enables faster process to new patent applications Significantly reduced prototypes and associated costs Robust modeling of abstract ideas, resulting in greater innovation Two or three new loudspeaker ranges per year (the equivalent of new products annually)

26 Elements of a Modern Simulation Environment Integrated Modeling and Solutions Multi-Discipline Simulation and Optimization System Level Modeling and Simulation Simulation Data and Process Management

27 Many Types of Analyses YY- Stress PSD RMS=19.7 MPa Structural Analysis Geometry Analysis Data Dust Analysis Transient PCB Heat Transfer Analysis PCB Thermal Analysis Clearance Analysis Cooling Analysis ECAD Updates Life Analysis

28 Multi-Discipline Simulation and Optimization Broad range of physics simulation solutions in a single environment Structural, thermal, flow and motion Geometry and FE parameter optimization Streamlined multiphysics solutions Scalable performance on HPC

29 NX CAE Solutions for Electronics in One Environment Structural Thermal Management Mechatronics Optimization Stress / Strain Drop test Vibration Dynamic response Durability Thermal-Flow Steady-state Transient Convection Conjugate Heat Transfer Co-simulate motion with control systems Rigid & flexible bodies Package space Geometry Thermal / flow characteristics FE parameters Test correlation

30 Structural Analysis Understand structural performance of external and interior components Capabilities Linear & nonlinear Dynamics Durability Test correlation Applications Drop test Vibration Product life Manufacturing Composites

31 Structural Analysis Example: Drop of Thermal Camera Device Thermal imaging camera for detecting heat Load Drop from a height of 1 meter Assume lands on side with screen Evaluate Stress and deflections of internal boards

32 Structural Analysis Example: Drop of Thermal Camera Nonlinearities Elastic-plastic case material (polycarbonate) Contact between case and ground Large displacement Initial conditions Velocity at impact of 4427 mm/sec

33 Structural Analysis Example: Drop of Thermal Camera Stress at contact Von Mises Stress at.0017 sec Max Von Mises: Corner of camera screen 70 MPa at.0017 sec

34 Structural Analysis Example: FADEC Dynamic Performance Purpose Full Authority Digital Electronics Control (FADEC) is computer to control aircraft engine performance Subject to engine unbalance loads (harmonic) Engine unbalance load Load Definition Apply base excitation loads to brackets Loads represent motion of engine case in operation Obtain from engine model or test Evaluate Peak acceleration loads on PCB Stress in brackets

35 Structural Analysis Example: FADEC Dynamic Performance Contour Response at 90 Hz (5400 RPM) VM Stress at 90 Hz (psi) Z Acceleration (g)

36 Structural Analysis Example: FADEC Dynamic Performance VM Stress in Bracket Acceleration on PCB

37 Thermal Management Predict thermal performance of components and the entire system Capabilities Seamless, 2- way coupling of thermal and flow solutions Bi-directional interface to EDA design systems Applications Electronic systems cooling Fan operating conditions Heat sink modeling Fan catalog Spacecraft thermal performance

38 Electronic Systems Cooling Example: Spatially Varying Thermal Conductivity PCB Assembly Compute Conductivity Review Discretization Obtain Temperature Results Export ESC Model

39 Thermal Management Examples:

40 Thermal Analysis Examples Electronic systems cooling example

41 Mechatronics Simulate interaction between mechanical systems and controls Capabilities Multi-body dynamics Applications Printer mechanisms Rigid & flexible bodies Interference checking Robots Cameras Sunroofs Disk drives

42 Motion Analysis Examples Co-simulation of sunroof motion with a control system Co-simulation of sunroof motion with a collision control system

43 Optimization Actively drive design using simulation Capabilities Geometry optimization Thermal / flow characteristics Applications Increase airflow Optimize component placement FE parameter optimization Improve structural performance Correlate to test results

44 Optimization Examples Optimize chip position on board based on temperature

45 NASA Jet Propulsion Laboratory (JPL) Case Study Business challenge: Tighter schedules Large daily temperature swings during the life of the mission NX was able to evaluate the thermal control system s performance under conditions that JPL could not simulate with physical testing. Keys to Success: Single software platform (NX) from design through manufacturing Multi-discipline simulation with NX CAE Results: Faster design-analysis redesign iterations More confidence in the hardware modeling, the design implementation, and mission simulations

46 Elements of a Modern Simulation Environment Integrated Modeling and Solutions Multi-Discipline Simulation and Optimization System Level Modeling and Simulation Simulation Data and Process Management

47 NX CAE System Level Modeling and Simulation Distributed CAE Assembly Model Analogous to CAD assembly Individual FE component models Assembly model instances FE components Supports very large models

48 NX CAE Test-Model Correlation Quantitatively and qualitatively compare simulation with physical test Correlate analysis with physical test Correlate analysis with analysis Ensure accuracy of reduced DOF models Pre-test planning to optimize sensor locations Optimize analysis model to better reflect reality

49 Elements of a Modern Simulation Environment Integrated Modeling and Solutions Multi-Discipline Simulation and Optimization System Level Modeling and Simulation Simulation Data and Process Management

50 Simulation Data and Process Management Intelligent integration between design & simulation processes

51 Teamcenter for Simulation External Reviews Show as Best Solution Rated 5 vendors (Altair, Ansys, Dassault/Simulia, MSC, Siemens PLM) Siemens PLM scored highest overall Siemens PLM scored highest in each of the four categories

52 The CAE Bottleneck Late Feedback to Designer Designer Designer Designer Analyst Designer Designer Designer Analyst Late Feedback to Designer

53 Simulation Data and Process Management Automate simulation processes for analysts and designers Automation tools that can drive complex analysis Common architecture allowing plug-ins Managed environment to distribute process automation to enterprise Guide designers through basic simulation tasks

54 Simulation Knowledge Capture Through Automated NX Simulation Processes Created by CAE Analysts Designer Designer Designer Simulation knowledge transfer via automated NX process Analyst Designer Designer More robust designs passed to simulation for detailed analysis Designer Analyst

55 Design Automation Associates Case Study Business challenge: Time-consuming, iterative analyses required for engineered-to-order products Business challenge: Integrated NX modeling and analysis functionality NX Open embedded application programming interface "The NX toolset is world-class functionality." John Lambert President, CEO Results: 40-hour iterative analysis process drops to 15 minutes Automated processes can be run by nonanalysts; NX users need little additional training Less hand calculation reduces error

56 Automation Examples Automated structural analysis of a circuit board

57 NX CAE A Modern Simulation Environment Integrated Modeling and Solutions Multi-Discipline Simulation and Optimization System Level Modeling and Simulation Simulation Data and Process Management

58 Why Siemens? A Heritage of Leading CAE Solutions NX CAE NX Nastran Teamcenter Simulation Process Management Nastran

59 Why Siemens? Major Investments in CAE for Product Development The integration of product development, simulation and validation is now at the top of our agenda. Anton Huber, CEO Siemens Industry Automation We are investing heavily in CAE for multi-disciplinary analysis throughout the product definition cycle. Chuck Grindstaff, CEO

60 Siemens acquires LMS International Providing a closed-loop, systems-driven product development solution Based on system simulation and test Enabling mission-critical applications and best practices Embracing open strategies Supported by world-class engineering services Providing unprecedented value to customers

61 System Validation & Optimization Collaboration between Imagine.Lab and NX CAE Architecture & Sizing Imagine.Lab Detailed Design Validation & Optimization NX CAD/CAE System Integration & Validation Imagine.Lab

62 A Modern Simulation Environment for Electronics & Semiconductor Development Smarter decisions, better products