It also offers a RAM backed file system that will disappear on loss of power. NOT APPLICABLE. Memory Information and Procedures

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1 Agilent Technologies, Inc Stevens Creek Blvd. Santa Clara, CA telephone alternate facsimile Memory Information and Procedures Product: 34972A Data Acquisition Control Mainframe and Modules (34901A, 34902A, 34903A, 34904A, 34905A, 34906A, and 34907A) Date: January 17, 2013 Volatile Memory Memory Type: Processor SDRAM Memory Memory Size: 128MByte Memory Function: Main dynamic RAM memory for processor. Contains working copies of Operating System, Instrument software, and measurement data. It also offers a RAM backed file system that will disappear on loss of power. Volatile (Y/N): Yes Turn off instrument power. NOT APPLICABLE Does this process: Sanitize memory Clear memory Erases memory (best effort) Process to physically remove memory: Processor PCB Assy Contains user data. This memory is not battery backed or connected to standby power. Non-Volatile Memory Memory Type: Parallel NAND Flash Memory Memory Size: 128MByte Memory Function: Contains Microsoft Windows CE Embedded Operating System, Instrument Firmware, Crash recovery image, connectivity data, serial number, and user instrument states. This also serves as the boot flash so here is no separate BIOS memory chip on the board. Volatile (Y/N): No SCPI command SYSTem:SECurity:IMMediate is used to sanitize(i) the user portion of this memory. The Model number, Serial Number, and the Instrument firmware are retained. The connectivity data and

2 user instrument state are sanitized. After reboot the connectivity data will be restored to the factory defaults. Following is a description of the process performed by the EraseFlash() method: This method performs a block-by-block erase as per chip manufacturer s data sheets. (Note, splash screen, fixed FPGA data, OS images, model number and serial numbers are not erased. These contain no user data and are not user accessible.) ** 1. Open the storage volume using OpenStore. ** 2. Dismount the first file system, store name Agilent Flash, using DismountStore. ** 3. Erase flash file system and selected sections of secure storage. This is done block by block. On the P500 system, there is a second file system that will not be erased. It will contain no user data but firmware binaries for easy update rather than distributing a whole new nk.bin image. ** 4. Format the store, using FormatStore. ** 5. Create the desired number of partitions on the store, using CreatePartition. ** 6. If the AutoFormat registry value is not set, format the partition using FormatPartition. For more information on the Storage Manager registry settings, see Storage Manager Registry Settings. The operations/functions referenced above are utilized from the Windows Embedded CE Storage Manager: Does this process: X Sanitize memory Clear memory Erases memory (best effort) Process to physically remove memory: Memory chips are soldered to PCA. Memory Type: Serial SPI Flash Memory Memory Size: 4MByte Memory Function: The 4MByte serial flash memory part is connected to the SH600 s SMI port. This memory includes the bootloader components (Xloader, U-boot, and P-boot) that configure the SH600 at boot time and load the operating firmware from the NAND flash memory. User Modifiable (Y/N): No Volatile (Y/N): No This part does not contain user data. NOT APPLICABLE since device is one-time preprogrammed during manufacturing or service

3 Does this process: X Sanitize memory Clear memory Erases memory (best effort) Process to physically remove memory: Memory chips are soldered to PCA. Memory Type: Battery-backed SRAM Memory Size: 4 128K x 8 and 1 32 x 8 Memory Function: Store instrument readings and instrument state Volatile (Y/N): Yes Not cleared when power is turned off. Instrument readings are overwritten by measuring some insignificant value (e.g. zero) at high reading rate. It takes approximately 8 seconds to clear the memory. Erase saved states with MEMory:STATe:DELete <0-5>. Circuit Designator: SPD The memory is written over with new data. Agilent P/N: 34970A Use the MEMory:STATe:VALid? query to determine if saved states are valid. Does this process: Sanitize memory XClear memory Erases memory (best effort) Process to physically remove memory: Processor PCB Assy Contains user data. Repeat the two tables above for each memory type. Select one of the following: Sanitization process is documented above Sanitization process could be available with engineering resources Sanitization process is not possible (i.e. sanitize the product by destruction

4 Clearing and Sanitization Matrix Media Clear Sanitize Magnetic Tape Type I a b m Type II a b m Type III a b m Magnetic Disk Bernoullis a c b m Floppy a c b m Non-Removable Rigid Disk c a d m Removable Rigid Disk a c a d m Optical Disk Read Many, Write Many c m Read Only m n Write Once, Read Many (Worm) m n Memory Dynamic Random Access Memory (DRAM) c h c h m Electronically Alterable PROM (EAPROM) i j m Electronically Erasable PROM (EEPROM) i g m Erasable Programmable ROM (EPROM) k c l m l then c Flash EPROM (FEPROM) i c i m c then i Programmable ROM (PROM) c m Magnetic Bubble Memory c a c m Magnetic Core Memory c a e m Magnetic Plated Wire c c f m c and f Magnetic Resistive Memory c m NonVolatile RAM (NOVRAM) c h c h m Read Only Memory (ROM) Synchronous DRAM (SDRAM) c h c h m Static Random Access Memory (SRAM) c h c f h m c and f Equipment Monitor h q Impact Printer h h p p then h Laser Printer h h o o then h m

5 a. Degauss with Type I, II, or III degausser. b. Degauss with same Type (I, II, or III) degausser. c. Overwrite all addressable locations with a single character. d. THIS METHOD NOT APPROVED FOR SANITIZING MEDIA THAT CONTAINS TOP SECRET INFORMATION. 1. Before any sanitization product is acquired, careful analysis to the overall costs associated with overwrite/sanitization should be made. Depending on the contractor s environment, the size of the drive and the differences in the individual products time to perform the sanitization, destruction of the media might be the preferred (i.e., economical) sanitization method. 2. Overwrite all addressable locations with a character, then its complement. Verify complement character was written successfully to all addressable locations, then overwrite all addressable locations with random characters; or verify third overwrite of random characters. Overwrite utility must write/read to growth defect list/sectors or disk must be mapped before initial classified use and remapped before sanitization. Difference in the comparison lists must be discussed with the DSS Industrial Security Representative (IS Rep) and/or Information System Security Professional (ISSP) before declassification. Note: Overwrite utilities must be authorized by DSS before use. e. Overwrite all addressable locations with a character, its complement, then a random character. f. Each overwrite must resident in memory for a period longer than the classified data resided. g. Overwrite all locations with a random pattern, then with binary zeros, and finally with binary ones. h. Remove all power to include battery power. i. Perform a full chip erase as per manufacturer s data sheets. j. Perform i above, then c above, a total of three times. k. Perform an ultraviolet erase according to manufacturer s recommendation. l. Perform k above, but increase time by a factor of three. m. Destruction see 1.) and 2.) below. n. Destruction required only if classified information is contained. o. Run 1 page (font test acceptable) when print cycle not completed (e.g. paper jam or power failure). Dispose of output as unclassified if visual examination does not reveal any classified information. p. Ribbons must be destroyed. Platens must be cleaned. q. Inspect and/or test screen surface for evidence of burn-in information. If present, screen must be destroyed. 1.) All methods of destruction must be authorized by DSS before use. Types of destruction are Disintegrate, incinerate, pulverize, or melt. NOTE: As of 22 April, 2002 shredding of IA products is not authorized.