New Sony DepthSense TM ToF Technology
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1 ADVANCED MATERIAL HANDLING WITH New Sony DepthSense TM ToF Technology Jenson Chang Product Marketing November 7,
2 3D SENSING APPLICATIONS Pick and Place Drones Collision Detection People Counting Palletizing/de-palletizing Warehouse Robot Metrology Senior/Patient Monitoring
3 3D SENSING TECHNIQUES STEREO VISION Extracts depth information by matching the same point in two images Can use a pattern projector to add texture Suffers from occlusion object seen by one camera but not the other
4 3D SENSING TECHNIQUES STRUCTURED LIGHT Projects a light pattern on the object. Uses the pattern distortion on the object to reconstruct the object shape Light source can be laser, IR or visible light Higher accuracy but requires calibration and resolution limited by light source
5 3D SENSING TECHNIQUES TIME OF FLIGHT Measures time it takes for the emitted light to be reflected back. Two techniques, one measure time directly, one measures phase difference of the emitted and received signal. Light source can be laser, IR or visible light Multipath - emitted light is reflected back from more than one path Less expensive and no calibration required
6 ACCURACY MARKET SEGMENT BY TECHNOLOGY 1cm+ People Monitoring / Obstacle Avoidance Navigation / Mobile Robot 1mm 1μm STRUCTURED LIGHT Inspection / Inspection / Metrology Metrology Automated Material Handling TIME-OF-FLIGHT 50cm 1m 5m 7m 10m DISTANCE
7 AUTOMATED MATERIALS HANDLING Challenges with structured light solutions in automated materials handling Sensitive to ambient light Challenges with certain packaging High precision systems are expensive In-field calibration required High CPU resources needed for depth processing Challenges with capturing depth data for packaging that are shiny, reflective or clear Sensitivity to sunlight from window or factory doors open/closing
8 CURRENT SOLUTIONS FOR MATERIAL HANDLING STEREO VISION STRUCTURED LIGHT TIME-OF-FLIGHT Working Distance Limited Scalable Scalable Depth Accuracy Low High Medium Resolution In-field Calibration Needed Size Full resolution Limited by light pattern Full resolution No Yes No Increase with working distance Increase with working distance Compact Cost Low High Medium
9 SONY IMX556 Acquire in 2015 Sony DepthSense IMX556PLR CMOS Sony has combined SoftKinetic s ToF technology with its own backside-illuminated technology to create the IMX556 Sony s backside-illuminated technology has better light collection efficiency in NIR compared to frontilluminated sensors Phase detection speed is improved, enabling higher modulation frequency Sensor Size Resolution Pixel Size Framerate 8mm diagonal (1/2 type) 640 (H) x 480 (V), VGA 10 um (h) x 10 um (V) full resolution
10 VALUE PROPOSITION HIGH RESOLUTION & HIGH SPEED 640 x 60 fps, higher resolution than most ToF cameras INCREASED PRECISION Standard deviation σ < 2.5mm at 1m distance BETTER PERFORMANCE WITHOUT PAYING MORE Lower cost compared to 3D cameras with similar performance Helios ToF 3D Camera Prototype 55mm x 55mm x 76mm
11 LUCID HELIOS TOF 3D CAMERA Features Working Range Accuracy Precision Lens Field of View Illumination Three operating modes 1. Less than 1.5m with 100MHz modulation frequency 2. Less than 3m with 50MHz modulation frequency 3. Less than 6m with 25MHz modulation frequency < 5mm from 0.3m to 1.5m in Mode 1 (preliminary) Sigma < 2.5mm at 1m in Mode 1 (preliminary) 65 x 46 (nominal) 4 x VCSEL laser 850nm Digital Interface 1 Gigabit Ethernet with M12 connector IEC GPIO Interface 8-pin M8 connector IEC I/O ports Dimension Lens Mount Operating Temperature Weight 1 input, 1 output, 2 bidirectional 55 x 55 x 76mm Integrated S-mount lens -10⁰ to 50⁰ C 280g Power Consumption TBD Conformity CE, RoHS, FCC, WEEE, Eye safety IEC :2014 Features Compliance Exposure Control Synchronization User Sets Output Formats OS Support GigE Vision 2.0, GenICam 3D Manual, Auto, External Trigger Signal via PTP 1 Default, 2 Custom 3D Point Cloud, Intensity and Confidence Windows and Linux Software Support Arena SDK, C++, C and C# PRELIMINARY DATA
12 GIGE VISION AND GENICAM 3D SUPPORT Pixel Format Coord3D_ABC Coord3D_A Coord3D_B Coord3D_C Confidence RGB8 Description Coordinate of the 3D image data with C being the depth data Coordinate of the 3D image data with coordinate A only Coordinate of the 3D image data with coordinate B only Coordinate of the 3D image data with coordinate C only Confidence of the pixel value False color for depth visualization (red=closest, blue=furthest) Arena SDK Camera control and image acquisition Data visualization such as point cloud, depth map, confidence map
13 QE (%) EMVA PRELIMINARY DATA IMX556 Spectral Response Curve Wavelength (nm) A+B Mode Saturation Capacity e e e- Temporal Dark Noise (Read Noise) A e e e- Dynamic Range db 63.9 db 64.0 db B
14 Depth Noise (mm) MODEL RESULTS PRELIMINARY DATA Simulated conditions: Constant 100k e- signal 80% modulation contrast 82 e- read noise 10 bit quantization Sensor Model Data vs. Helios Measured Data Total Signal (A+B), electrons Sensor Model Data Helios Measured Data
15 TEMPORAL PRECISION PRELIMINARY DATA Test Conditions 4 lasers, at 1W optical power each Room light off Exposure time = 1000 us for all tested distances except for 30 cm 11x11 pixels in image center Standard deviation over 100 images Results σ = 2.25 mm at 1 meter σ = 4.56 mm at 2 meter
16 SPATIAL PRECISION PRELIMINARY DATA Test Conditions Same conditions as previous Results σ = 2.34 mm at 1 meter σ = 4.36 mm at 2 meter
17 ACCURACY PRELIMINARY DATA Test Conditions Same conditions as previous Differences between measured and groundtruth distance Offset adjusted for 1 meter
18 COMPARED TO KINECT2 PRELIMINARY DATA
19 SAMPLE IMAGES PRELIMINARY DATA Depth map, top view Sample object: Muffins Point clouds, angled view
20 SAMPLE IMAGES PRELIMINARY DATA Depth map, top view Sample object: Boxes Point clouds, angled view
21 WHO IS LUCID LUCID Vision Labs is a new company that designs and manufactures innovative machine vision products that creatively leverage new technology to deliver exceptional value to our customers. Founded in January 2017 in Canada, first product shipped in March 2018 Headquartered in Canada, with regional sales and support offices in Germany, Japan and China Headquarter in Richmond, BC, Canada Engineering, sales, support, and manufacturing European office in Ilsfeld, Germany Sales and support
22 THANK YOU Be Inspired. Think Lucid. COME TO BOOTH 1C62 FOR LIVE DEMONSTRATION
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andor.com Scientific CMOS - Fast, sensitive, compact and light Features and Benefits Specifications Summary Ultra Sensitive Imaging Low Light Imaging
Interline CCD 5.5 e - read noise Andor scmos 1.2 e - read noise Low Light Imaging Ultra Sensitive Imaging Upgrading to Zyla scmos can radically improve the performance of your fluorescence microscope Features
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