IEEE Attendance and Affiliation Sheet Page 1
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1 IEEE Attendance and Affiliation Sheet Page 1 Abbott, John Corning Incorporated Corning Incorporated Abramson, David Texas Instruments Incorporated Texas Instruments Incorporated Agnes, Andrea STMicroelectronics STMicroelectronics Amason, Dale NXP Semiconductors NXP Semiconductors An, Hongming Microchip Technology, Inc. Microchip Technology, Inc Anslow, Peter Ciena Corporation Ciena Corporation BACA, RICHARD Microsoft Corporation Microsoft Corporation Baggett, Tim Microchip Technology, Inc. Microchip Technology, Inc Bains, Amrik Cisco Systems, Inc. Cisco Systems, Inc Balemarthy, Kasyapa OFS Baran, David ARRIS Group ARRIS Group Baum, Andrew Bel Stewart Connector Bel Stewart Connector Ben-Artsi, Liav Marvell Semiconductor, Inc. Marvell Semiconductor, Inc Beruto, Piergiorgio Canovatech S.r.l. Canova Tech Srl Best, Burrell Samtec, Inc. Samtec, Inc Bhatt, Vipul Finisar Corporation Inphi Corporation bo, gao Huawei Technologies Co. Ltd Huawei Technologies Co., Ltd Brandt, David Rockwell Automation Rockwell Automation Braun, Ralf-Peter Deutsche Telekom AG Deutsche Telekom AG Brooks, Paul Viavi solutions GmbH Viavi Solutions Brown, Alan M ADTRAN Inc. ADTRAN Inc Brown, Matthew MACOM MACOM Brownlee, Phillip TDK Corporation TDK Corporation Butter, Adrian GLOBALFOUNDIRES GLOBALFOUNDIRES Calvin, John Vital Technical Marketing, Wilder TecVTM, V-Prime, Wilder Technologies Carlson, Craig Cavium Cavium 1 1 Carlson, Steven High-Speed Design Inc. Robert Bosch GmbH Chabot, Craig University of New Hampshire InterOpUniversity of New Hampshire InterOp Chalupsky, David Intel Corporation Intel Corporation Chang, Xin Huawei Technologies Co. Ltd Huawei Technologies Co. Ltd Chang, Yongmao Inphi Corporation Inphi Corporation
2 IEEE Attendance and Affiliation Sheet Page 2 Chen, Chan Applied Optoelectronics, Inc. Applied Optoelectronics, Inc Choudhury, Golam OFS OFS Colella, Barry Source Photonics Source Photonics Dai, Eugene Cox Communications Inc. Cox Communications Inc D'Ambrosia, John Futurewei Technologies Futurewei (Subsidiary of Huawei) Darshan, Yair Microsemi Corporation Microsemi Corporation Dawe, Piers J G Mellanox Technologies Mellanox Technologies Dawson, Fred Chemours Canada Company Chemours Canada Company den Besten, Gerrit NXP Semiconductors DeSanti, Claudio Google Google DiBiaso, Eric TE Connectivity TE Connectivity Diminico, Christopher M C Communications, LLC Panduit Corp Donahue, Curtis University of New Hampshire InterOpUNH-IOL Du, Liang Google Google Dube, Kathryn UNH-IOL UNH-IOL Dudek, Michael Cavium Cavium Dupuis, Marc Web Industries Web Industries Effenberger, Frank Huawei Technologies Co. Ltd Huawei Technologies Co. Ltd Estes, David Spirent Communications Spirent Communications Ewen, John GLOBALFOUNDIRES GLOBALFOUNDIRES farjad, ramin Aquantia Aquantia Ferretti, Vincent Corning Incorporated Corning Incorporated Filip, Jan Maxim Integrated Products Maxim Integrated Products Franchuk, Brian Emerson Automation Solutions Emerson Automation Solutions Frosch, Richard Phihong USA Inc, Phihong USA Inc, fu, shiyong Huawei Technologies Co. Ltd Huawei Technologies Co. Ltd 1 1 Gardner, Mike Molex Incorporated Molex Incorporated Gauthier, Claude OmniPhy NXP Semiconductors Ghiasi, Ali Ghiasi Quantum LLC Ghiasi Quantum LLC, Huawei LTD Gilb, James General Atomics Aeronautical SystemGA-ASI, USD, Gilb Consulting Gong, Zhigang O-Net Communications Ltd. O-Net Communications Ltd
3 IEEE Attendance and Affiliation Sheet Page 3 Goor, Dave Philips Electronics Philips Electronics Gopalakrishnan, Karthik Inphi Corporation 1 1 Gottron, Jens Siemens AG Siemens AG Graber, Steffen Pepperl+Fuchs GmbH Pepperl+Fuchs GmbH Grau, Olaf Robert Bosch GmbH Robert Bosch GmbH Gustlin, Mark Xilinx Inc Xilinx Hajduczenia, Marek Charter Communications Charter Communications Harstead, Ed Nokia Nokia Healey, Adam Broadcom Inc. Broadcom Inc Heck, Howard Intel Corporation Intel Corporation Hegde, Rajmohan Broadcom Corporation Broadcom Ltd Hess, David CORD DATA CORD DATA Holden, Brian Kandou Bus Kandou Bus Horner, Rita Synopsys, Inc. Synopsys, Inc Horrmeyer, Bernd Phoenix Contact Phoenix Contact Houtsma, Vincent Nokia Nokia HUANG, Xi Huawei Technologies Co. Ltd Huawei Technologies Co. Ltd Huszak, Gergely Self Kone Ingham, Jonathan Foxconn Interconnect Technology Foxconn Interconnect Technology Isono, Hideki FUJITSU Fujitsu Optical Components Limited Issenhuth, Tom Issenhuth Consulting, LLC Huawei Technologies Co. Ltd Jackson, Kenneth Sumitomo Electric Device Innovation Sumitomo Electric Industries, LTD Johnson, John Broadcom Limited Broadcom Limited Jones, Chad Cisco Systems, Inc. Cisco Systems, Inc Jones, Peter Cisco Systems, Inc. Cisco Systems, Inc Kao, Chienping Intel Corporation Intel Kareti, Upen Cisco Systems, Inc. Cisco Systems, Inc Kimber, Eric Semtech Ltd Semtech Ltd King, Jonathan Finisar Corporation Finisar Corporation Klempa, Michael University of New Hampshire InterOpUniversity of New Hampshire InterOp Knittle, Curtis Cable Television Laboratories Inc. (CaCable Television Laboratories Inc. (Ca
4 IEEE Attendance and Affiliation Sheet Page 4 Kochuparambil, Elizabeth Cisco Systems, Inc. Cisco Systems, Inc Kolesar, Paul CommScope CommScope, Inc Kondo, Taiji MegaChips Corporation MegaChips Corporation Kramer, Glen Broadcom Corporation Broadcom Corporation Lambrecht, Frank Gigamon, Inc. Gigamon, Inc Laubach, Mark Broadcom Limited Broadcom Corporation Law, David Hewlett Packard Enterprise Hewlett Packard Enterprise Lawlis, James Ford Motor Company Ford Motor Company Le Cheminant, Greg Keysight Technologies Keysight Technologies Lee, Han Hyub ETRI ETRI Lemahieu, Joris ON Semiconductor ON Semiconductor 1 1 Lewis, David Lumentum Inc. Lumentum Inc Lewis, Jon Dell EMC Dell EMC Li, Weishi Huawei Technologies Co., Ltd Lim, Jane Cisco Systems, Inc. Cisco Systems, Inc lin, bin TE Connectivity Lingle, Robert OFS OFS Liu, Hai-Feng Intel Intel Corporation Liu, Karen Kaiam Corp Kaiam Corporation Lukacs, Miklos Silicon Laboratories Silicon Laboratories Lusted, Kent Intel Corporation Intel Corporation Maguire, Valerie The Siemon Company The Siemon Company Maki, Jeffery Juniper Networks, Inc. Juniper Networks, Inc Malicoat, David Malicoat Networking Solutions Aquantia; SENKO Advanced Compon Marris, Arthur Cadence Design Systems, Inc. Cadence Design Systems, Inc MASUDA, TAKEO OITDA OITDA Matheus, Kirsten BMW Group BMW Group Matoglu, Erdem Amphenol Corporation Amphenol Corporation Mazzini, Marco Cisco Systems, Inc. Cisco Systems, Inc McCarthy, Mick Analog Devices Inc. Analog Devices Inc Mcclellan, Brett Marvell Semiconductor, Inc. Marvell Semiconductor, Inc
5 IEEE Attendance and Affiliation Sheet Page 5 Meachen, Jacob Semtech EMEA Semtech Ltd Medina, Marcel Spirent Communications Spirent Communications Mellitz, Richard Samtec, Inc. Samtec, Inc Miguelez, Phil Comcast Comcast Moritake, Toshiyuki Japan Aviation Electronics Ind., LTD. (Japan Aviation Electronics Ind., LTD Mueller, Harald Endress + Hauser Endress + Hauser Mueller, Thomas Rosenberger Rosenberger Murty, Ramana Broadcom Corporation 1 1 Neveux, Paul Superior Essex Superior Essex Nicholl, Gary Cisco Systems, Inc. Cisco Systems, Inc Nolan, John QLogic Corporation QLogic Corporation Noll, Kevin TiBiT Communications Tibit Communications Nowell, Mark Cisco Systems, Inc. Cisco Systems, Inc. 1 1 Ofelt, David Juniper Networks, Inc. Juniper Networks, Inc Ohni, Josef MD Elektronik GmbH MD Elektronik Pachon, Arturo TE Connectivity TE Connectivity Palkert, Thomas EIC Molex-Macom Pandey, Sujan NXP Semiconductors NXP Semiconductors Parsons, Earl CommScope, Inc. CommScope, Inc Parthasarathy, Vasu Broadcom Corporation Broadcom Corporation Patel, Harsh Molex LLC Molex LLC Pham, Phong US Conec, Ltd. US Conec, Ltd Piehler, David Dell Dell EMC Pimpinella, Rick Panduit Corp. Panduit Corp Powell, William Nokia Nokia Pozzebon, Dino Microsemi Corporation Microsemi Corporation Rabinovich, Rick Keysight Technologies Keysight Technologies Ran, Adee Intel Corporation Intel Corporation Regev, Alon Keysight Technologies Keysight Technologies Remein, Duane Futurewei Technologies Huawei Technologies Co. Ltd Renteria, Victor Bel Fuse Bel Fuse
6 IEEE Attendance and Affiliation Sheet Page 6 Rotolo, Salvatore STMicroelectronics STMicroelectronics Ryan, Tim UNH-IOL UNH-IOL Rysin, Alexander Mellanox Technologies Mellanox Technologies Sakai, Toshiaki Socionext socionext Sarlet, Gert Finisar Corporation Finisar Corporation 1 1 Sayre, Edward Samtec, Inc. Teraspeed, a division of Samtec Scantamburlo, Nicola Canova Tech Canova Tech Schmitt, Matthew Cable Television Laboratories Inc. (CaCable Television Laboratories Inc. (Ca 1 1 Sekel, Steve Keysight Technologies Keysight Technologies Shariff, Masood CommScope, Inc. CommScope, Inc Shigematsu, Masayuki Innovation Core SEI Innovation Core SEI Shrikhande, Kapil Innovium Inc. Innovium 1 1 Slavick, Jeff Broadcom Limited Broadcom Limited Smith, Daniel Seagate Technology LLC Seagate Technology LLC 1 1 Sommers, Scott Molex Incorporated Molex Incorporated Sostawa, Bernd Microchip Technology Germany II Gm Souvignier, Tom Broadcom Corporation Broadcom Corporation Sparrowhawk, Bryan Leviton Manufacturing Co. Leviton Manufacturing Co Stassar, Peter Huawei Technologies Co. Ltd Huawei Technologies Co. Ltd Stewart, Heath Analog Devices Inc. Analog Devices Inc Stone, Robert Broadcom Corporation Broadcom Corporation Stover, David Analog Devices Inc. Analog Devices Inc Sun, Junqing Credo Semiconductor Credo Semiconductor Swanson, Steven Corning Incorporated Corning Incorporated TAKAHARA, TOMOO FUJITSU LABORATORIES LIMITED FUJITSU LABORATORIES LIMITED Tamura, Kohichi Oclaro Japan Inc. Oclaro Japan Inc TAZEBAY, MEHMET Broadcom Corporation Broadcom Corporation Thompson, Geoffrey GraCaSI S.A. INDEPENDENT Tooyserkani, Pirooz Cisco Systems, Inc. Cisco Systems, Inc Tracy, Nathan TE Connectivity TE Connectivity Tremblay, David Hewlett Packard Enterprise Hewlett Packard Enterprise 1 1 2
7 IEEE Attendance and Affiliation Sheet Page 7 Trowbridge, Stephen Nokia Nokia Tu, Mike Broadcom Corporation Broadcom Corporation Twombly, Jeff Credo Semiconductor Credo Semiconductor Ulrichs, Ed Source Photonics Source Photonics Umnov, Alexander Corning Incorporated Corning Incorporated Vanderlaan, Paul Berk-Tek LLC Berk-Tek LLC Vernickel, Ricky LEONI LEONI Vitali, Marco Sicoya Sicoya Voss, Robert Panduit Corp. Panduit Corp Walker, Dylan Cisco Systems, Inc. Cisco Systems, Inc Walter, Edward AT&T AT&T wang, haifei Huawei Technologies Co. Ltd Huawei Technologies Co., Ltd Wang, Min Waymo Wang, Xinyuan Huawei Technologies Co. Ltd Huawei Technologies Co. Ltd Wechsler, Christoph Audi AG Audi AG Welch, Brian Luxtera Luxtera white, martin Cavium Cavium 1 1 Wienckowski, Natalie General Motors Company General Motors Company Williams, Tom Acacia Communications Acacia Communications 1 1 Willis, Paul UNH-IOL UNH-IOL Withey, James Fluke Corporation Fluke Corporation Wu, Peter Marvell Semiconductor, Inc. Marvell Semiconductor, Inc Wucher, Markus Endress + Hauser Flowtec AG Endress + Hauser XU, LI Huawei Technologies Co. Ltd HUAWEI Xu, Yu Huawei Technologies Co. Ltd Huawei Technologies Co. Ltd Yamamoto, Shuto Nippon Telegraph and Telephone Co Nippon Telegraph and Telephone Co Young, Adrian Leviton Manufacturing Co. Leviton Manufacturing Co Young, James CommScope, Inc. CommScope Yseboodt, Lennart Signify Philips Electronics Zambell, Andrew Amphenol Corporation Amphenol-FCI Zerna, Conrad Fraunhofer IIS Fraunhofer IIS
8 IEEE Attendance and Affiliation Sheet Page 8 Zhang, Geoffrey Xilinx Xilinx 1 1 Zhou, Richard (Yujia) Charter Communications Charter Communications Zhuang, Yan Huawei Technologies Co. Ltd Huawei Technologies Co. Ltd Zielinski, Martin Emerson Electric Co. Emerson Process Management Zimmerman, George CME Consulting ADI, APL Group, Aquantia, BMW, Com Zivny, Pavel Tektronix, Inc. Tektronix, Inc
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