State of the art Routers Architecture (Juniper, Cisco, Huawei)

Transcription

1 Scenari Emergenti e Oppotunità nel mercato TLC State of the art Routers Architecture (Juniper, Cisco, Huawei) Relatore: Ing. Nicola Zambelli (K Labs Trainer and Professional Services Engineer) w w w. k l a b s. i t 1

2 Agenda Core Routers Evolution SDN/NFV Evolution Router Simulation K Labs Job opportunities K Labs Internship 2

3 TELCO Architecture 2G 3G 4G FTTC ONU FTTH OLT Internet Metro ACCESS xdsl Backbone Network Data Center PSTN 3

4 Worldwide Top Router Vendors 4

5 Core Router CMU: 1+1 backup mode MPU: 1+1 backup mode Fan modules: total of 17, 1+1 backup mode LPU: total of 12 SFU: 5+1 backup mode Air intake frame Power modules: 6+6 backup mode Power frame: total of 3, 12-way AC power Front view Rear view 5

6 Router design: Key Points Scalable System Platform Unblock Switching Energy-Saving High-speed Interconnection Large Capacity Powering/Heat Dissipation Highly Integrative Chip High-density Optical Module Dynamic CLOS Switching VSC Exchange Distributed Arbitration Dynamically Distributed Buffer Patented Heat Dissipation Design:Orthogonal Front-to-rear Air Channels Separated Air Channels on Service Slots and Switching Fabric Units Innovative Panel Heat Dissipation Design On-demand Powering/Dynamic Energy-saving 6

7 Switching Fabric Unit Switching Fabric Unit Switching Fabric Unit Switching Fabric Unit Switching Fabric Unit Switching Fabric Unit Slot Distribution Diagram example Control Management Control Management Controller 14 FAN 13 FAN 15 FAN 16 FAN 17 FAN 14 Controller Line Card Line Card Line Card Line Card FAN 11 FAN 9 FAN 12 FAN 10 Line Card Line Card Line Card Line Card Line Card FAN 7 FAN 5 FAN 8 FAN 6 Line Card Line Card 3 2 FAN 3 FAN 4 Line Card Air intake frame 1 FAN 1 FAN 2 PM1 PM2 PM3 PM4 PM5 PM6 PM7 PM8 PM9 PM10 PM11 PM12 front view Power frame Power frame Power frame rear view 7

8 High-Speed Interconnection Orthogonal Architecture with 0 Cable on Backplane High-speed Connector 4 keys High-Speed PCB Design Highly Precise, Strengthened Chassis Ensuring high performance of end-to-end high-speed links 8

9 Hardware Architecture FIC Backplane with cable LineCard Backplane without cable Fabric Line Card Traditional switching architecture Fully orthogonal architecture Fully orthogonal design of line cards and Switching Fabric Units On a core router, the cables from line cards to Switching Fabric Units are the most important factor affecting slot bandwidth. In the traditional architecture, the length and rate of backplane link are the important factors affecting device bandwidth and evolution capability. The orthogonal architecture, reducing the backplane cable length to 0 and improve system bandwidth and evolution capability. 9

10 High-Speed Orthogonal Connectors Magnitude(dB) Wafer-Wafer NEXT, Pitch: 1.4 S-S, 1.1 S-G, 1.1 G-G 1.4mm shift 1.3mm shift 1.2mm shift 1.1mm shift 1.0mm shift 0.9mm shift Frequency(GHz) Insertion loss Interference G G G G High-speed connector is the basis of core switch Next-generation core routers use a minimum of 10.3G links, which can be upgraded to 25G 10

11 Control Plane and Data Plane Separation 1/2 ASIC General Purpose CPU 20G 50G 240G 1T ASIC Chipset Evolution 11

12 Control Plane and Data Plane Separation 2/2 12

13 Distributed Forwarding Centralized arbitration Arbitration Line Card Line Card Fabric#1 Fabric #2 Fabric #K Line Card Line Card Line Card Line Card Line Card Line Card Arbitration Traditional architecture: centralized arbitration New Architecture: distributed arbitration Distributed arbitration improves scalability of the switching network 13

14 Service User Class Port HQoS Flow queue User queue Class queue Port queue Voice, data, video (single user) Common user, VIP Voice, data, video (all users) Physical port Traditional QoS Per port bandwidth control: service traffic is differentiated based on classes of service but not users Unable to manage and schedule multiple services of H-QoS Hierarchical per-user-per-service scheduling, quality guarantee for VIP users and high-priority services High performance multiple users 14

15 High Density Line Cards 1/2 36*100GE QSFP28 36*40GE QSFP+ 48*10GE SPF+ + 2*40GE+2*100GE 10GE Flex Port 40GE Flex Port SFP-T: RJ45, GE electrical SFP: GE optical port connection QSFP+ connection 40GE copper cable: Low-cost connection within 5m 40GE AOC: Short-distance, lowcost connection 100m 500m, 10Km, 40km, 80km, 100km 100m, 150m, 300m, 400m, 1.4km, 10km, 40km 1m, 3m, 5m 10m 10GE AOC: Short-distance, lowcost connection 10GEcopper cable: Low-cost connection within 5m SFP+: 10GE optical port connection Fiber connection One 40GE splits into 4*10GE Copper cable connection AOC connection 3m, 10m, 20m 1m, 3m, 5m, 7m, 10m 100m,220m, 300m, 1.4km, 10km, 40km, 80km 300m,1.4km, 10km 1m, 3m, 5m 10m 15

16 High Density Line Cards 2/2 100GE Flex Port CFP 100G fiber connection CXP 100G fiber connection CFP2 100G fiber connection QSFP28 100G fiber connection 100m, 10km, 20km, 40km, 80km 100m 100m, 10km 100m, 500m 2km, 10km 100GE split into 2/3*40GE Cable connection 100m 10m 100GE split into 8/10/12*10GE 100GE split into 4*25GE 100m 100m, 500m 1m, 3m, 5m 16

17 Large Capacity Powering/Heat Dissipation Chip techniques upgrade every two years Power consumption of a single chip exceeds 100W Power consumption of optical module greatly increases A highly integrative chip has high power consumption. In 2012, the power consumption of a single chip exceeds 100 W. The optical module is migrating to 100GE, with increasing power consumption. Increasing power consumption of chip and optical module poses high requirements on core devices: System powering capability---20kw for the chassis System heat dissipation---heat dissipation per slot exceeds 1000W 17

18 On-demand Powering/Dynamic Energy-Saving LPU LPU LPU LPU LPU MPU MPU CMU CMU FAN Add PM modules and power supplies according to the number of cards and power consumption PM PM PM PM PM PM PM PM PM PM PM PM AC1 AC2 On-demand power configuration Restrict the number of initially configured power modules, controlling initial investment Power module control based on small granularities, expanded on demand Improve power efficiency, reduce conversion loss Accurate power configuration implements 80% power loading and increases power use efficiency to 96%. 18

19 Dynamically Distributed Buffer Distributed buffer can accommodate burst traffic Dynamic buffer improves buffer use efficiency Buffer on a single port Distributed buffer on ingress Ingress port Egress port Ingress port Egress port Last second Next second Ingress port Egress port Ingress port Egress port LPU1 LPU2 LPU1 Distributed buffer on ingress eases buffer loads on a single port LPU2 LPU1 LPU2 LPU1 Buffer is allocated on demand and dynamically adjusted Data flow Buffer LPU2 19

20 Air Channel Standard and Trend in Data Center Room Rear Front Front Front Rack Rack Rack AC HOT COLD HOT COLD Typical air channel in Data Center Room The cabinets are placed in the face-to-face, back-toback manner, separating the cold and hot air channels. After flowing into the cabinet and chassis through the bottom of the cabinets, cold air becomes the hot air, flows into the hot air channel, and flows back through the return air channel. Trend: front-to-rear, complying with standards ANSI TIA-92 NEBS GR-63-CORE If the chassis does not comply with standard, increase 10 to perform test in high temperature. Data center devices must provide the front-to-rear air channels. 20

21 Hardware and operating system evolution 2004 before future Single-Chassis 1.28Tbps Back-to-back 2.56Tbps CCC-2 10Tbps Single core to multi-cores Cluster 200Tbps CPU CPU CPU CPU CPU CPU CPU CPU CPU CPU CPU CPU CPU Single Core DualCores QuaCores MoreCores 21

22 Virtual System(VS) Data VS 1 VS 2 VS 3 Video Voice VS technology can make the handling capacity of a single physical router powerful fully utilized and simplify network, simplify management, strengthen the safety and reliability 22

23 Software Defined Networking (SDN) 23

24 Network Processor for SDN Scenario 24

25 Network Function Virtualization (NFV) 25

26 K Labs Company Presentation w w w. k l a b s. i t 26

27 K Labs K Labs is a company specialized in Technical Trainings for Telco and ICT market ISO 9001:2008 Certified 27

28 Business Mission Our aim is to deliver vendor-independent, high-quality training courses that provide delegates with real-life experience on software and hardware in addition to imparting theoretical knowledge. As such, our courses include plenty of practical hands-on time. 28

29 Technologies DATA CENTER LTE CLOUD COMPUTING MOBILE NETWORKS IP NETWORKING MULTIMEDIA ICT SECURITY PERFORMANCE TESTING CARRIER GREEN IT FIXED ACCESS SOFTWARE 29

30 Customers and Partnership K Labs delivers training services to a lot of big players or companies involved in the Telecommunication and ICT Market. K Labs signed training partnership with the most important Manufacturers in the ICT Global Market. United Nations Logistic Base 30

31 Added Value Educational Lab (Multivendor) Virtual Lab (Software simulations) Test Instruments 31

32 K Labs is looking for talents Do you enjoy the challenge of learning the newest technologies on the ICT market? Do you have a pioneering spirit and enjoy being seen a subject matter expert? K Labs want to invest in bright and dynamic Engineers that would like to join our team of enthusiastic and highly qualified: Trainer and Professional Engineer For more information on Interships and Job positions: Tel , job@klabs.it 32

33 Requirements for the applicants 2 nd or 3 rd year of Telecommunications, Computer Science or Electronics preferred Passion for technology and telecommunications Good communication skills Good knowledge of English Flexibility and Adaptability to change Optimism, Proactivity The candidates will be interviewed before being admitted to the internship 33

34 K Labs Internship an opportunity to jump into the ICT world w w w. k l a b s. i t 34

35 K Labs Internship proposal Software Defined Networking Internet of Things Mobile 5G 35

36 Internship 1: Software Defined Networking Field: Software Defined Networking Description: Preliminary study and development of a test evironment able to check multivendor devices interworling controlled by SDN. Test Environment Design, SDN Function Evaluation, Test Execution, Reporting. Team work in cooperatin with K Labs engineers. Application Deadline: Available Year-round 36

37 Internship 2: Internet of Things Field: Internet of Things Description: Preliminary study and development of a test evironment able to check multivendor IoT devices interworling. Test Environment Design, IoT Function Evaluation, Test Execution, Reporting Team work in cooperatin with K Labs engineers. Application Deadline: Available Year-round 37

38 Internship 3: 5G Field: 5G Description: Preliminary study and content development of an e-learning training course focused on 5 Generation Mobile Network and Services. 5G Standard evaluation, Learning Objects Design, cooperaton with Multimedia Developer for e-learning course implementation. Team work in cooperatin with K Labs engineers. Application Deadline: Available Year-round 38

39 Other Internship topics Suggestions? You can suggest us also different topics, in order to design together your Labs 39

40 Contatti Per maggiori informazioni: Tel