Advance Process Control SECS/HSMS A/D. Recipe Process step Data quality NOVELLUS PECVD
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1 III-V Abstract III-V 300mm GEM300 EEC Advance Process Control SECS/HSMS A/D Recipe Process step Data quality NOVELLUS PECVD For the equipments used on III-V wafers, usually modified from the old-fashion models for SI-wafers, it's impossible to be equipped with the new standards for 300mm FAB, such as GEM300 or EEC because of the low market value and small wafer sizes. Many problems in the field of data collection and data qualification are encountered on the attempts of Advanced Process Control (APC) to increase the yield and throughput. Some equipment didn't provide the basic communication like SECS/HSMS. Taking apart the controller, making branches of the control circuits and collecting signals from A/D is the only solution. However, data are not always available in the way. Many of the signals can't be got from branching, such as recipes or process steps. The said problems form the bottlenecks in the following data analysis. This article discusses about improving the qualities of the data by preprocess technologies to fill out the unavailable signals and the efficiency and accuracy of the following analysis. Novellus PECVD is the target in this article. Signals are get, preprocessed and verified, which making the basis for the consequent analysis of the engineering data. Keywords APC (Advanced Process Control) SECS Data Quality FSP (Function Script Program) 1
2 1 III-V 300mm GEM300 APC Advance Process Control [6] 300mm EEC Equipment Engineering Capabilities [5] III-V FAB APC SECS/HSMS [7] [8] SV Parameter Data Quality Recipe Process step Data Preprocessing III-V NOVELLUS PECVD - Concept One Data Collection Raw data Equipment Engineering Data Analysis Data Mining APC 2 300mm FAB SECS/HSMS APC APC Real Time Monitor System FDC Fault Detection and Classification Feed back / Feed forward Run-to-Run Control PdM Predictive Maintenance APC SECS/HSMS APC Sensor Sensor 2
3 Lot ID Recipe Step Raw data Pattern Wafer MES Recipe Lot ID 3.2 Data Cleaning Data Integration Data Transformation Data Reduction [2] (1). missing values outliers binning clustering human check regression APC / LCL/UCL (2). combine align SECS/HSMS 3
4 (3). smoothing aggregation generalization of the data normalization attribute construction APC A/D Log (4). data cube aggregation dimension reduction data compression numerosity reduction discretization and concept hierarchy generation APC Time Series DFT DWT SVD APCA PAA PLA [3] 3.3 step Time Series data control factor step DIW OFF N2 OFF NH4 OFF ON step step name step Recipe step 4
5 4 NOVELLUS PECVD 4.1 NOVELLUS PECVD Concept One Gas Flow Rate Pressure RF Power (Reflection Forward ) Temperature Gas Flow Rate AO_MFC_A1_SP MFC-A1 Setpoint AO_MFC_A2_SP MFC-A2 Ssetpoint AO_MFC_A3_SP MFC-A3 Setpoint AO_MFC_A4_SP MFC-A4 Setpoint AO_MFC_B1_SP MFC-B1 Setpoint AO_MFC_B2_SP MFC-B2 Setpoint AO_MFC_B3_SP MFC-B3 Setpoint AO_MFC_B4_SP MFC-B4 Setpoint AI_MFC_A1_FLW MFC-A1 Flow rate AI_MFC_A2_ FLW MFC-A2 Flow rate AI_MFC_A3_ FLW MFC-A3 Flow rate AI_MFC_A4_ FLW MFC-A4 Flow rate AI_MFC_B1_ FLW MFC-B1 Flow rate AI_MFC_B2_ FLW MFC-B2 Flow rate AI_MFC_B3_ FLW MFC-B3 Flow rate AI_MFC_B4_ FLW MFC-B4 Flow rate RF Power AI_RF_FWD Hi frequency RF Forwarad power AO_RF_SETPT Hi frequency RF setpoint AI_RF_RFL Hi frequency RF reflection power AO_LF_RF_SP Low frequency RF setpoint AI_LF_LOAD_PWR Low frequency RF reflection power AI_LF_FWD_PWR Low frequency RF forwarad power Pressure AI_4LIN_PRES Foreline pressure AI_LL_PRESS Loadlock pressure AI_CH_PRESS Chamber pressure Temperature AI_PLAT_TMP Plat temperature AO_TEMP_SPT Plat temperature setpoint 5
6 SPC Application User Interface Database Service Raw data Data Collection Module TCP/IP Concept One. SECS Terminal Panel RS-232 Terminal panel A/D RS-232 RS-232 port Data Collection [1][3] RS-232 A/D card PCB Terminal Panel bus RS-232 PC-104 A/D Card PC Based Controller. 6
7 4.2 off-line / /Recipe Lot ID Cassette Cassette FAB Lot ID Product ID Recipe Run Card Wafer OPI Operator Process Interface OPI.Operator Process Interface OPI 3 Cassette Port input Cassette ProductID LotID WaferNumber run RecipeName CoatingTime default value LotID 2004_0102_1234 7
8 Wafer Chamber Chamber Wafer Chamber Wafer Load Lock Shower Head Wafer Chamber Wafer Chamber 3 Lot Wafer Wafer Wafer Lot cassette Chamber load lock door cassette door. Wafer 3 Cassette Wafer ( ) N Wafer number C Load lock open times 2N C = 2N ( N 7) N 7 N > 7 OPI Lot ID Raw data Lot Wafer LotID Plate1_LotID ~ Plate7_LotID LotID ABC 3 wafer LotID DEF 2 wafer LotID Time Plate1_LotID Plate2_LotID Plate3_LotID Plate4_LotID Plate5_LotID Plate6_LotID Plate7_LotID 8
9 ~~~ ABC Null Null Null Null Null Null ~~~ ABC ABC Null Null Null Null Null ~~~ ABC ABC ABC Null Null Null Null ~~~ DEF ABC ABC ABC Null Null Null ~~~ DEF DEF ABC ABC ABC Null Null Raw data Recipe multi - lot single - lot / 7 Plate LotID 4.3 Trend Chart Wafer / FSP Function Script Program FSP APC Framework [9] RTMS Real Time Monitor System [4][9] RTMS SECS HSMS I/O A/D Card ADAM FSP RTMS RTMS Concept One Cassette Input Cassette FSP Vardefine ' * Varend Begin ' Label Start call GetADCardVal ' Call out Parameters_ForChannel ' call CheckVaildData ', database sleep
10 End goto Start sub GetADCardVal out AD_Module1 out AD_Module2 return sub CheckVaildData ' cassette (cassette=0), CMEJ Valid #CASSETTE_1 0 CMEJ Valid #CASSETTE_2 0 CMEJ Valid #CASSETTE_3 0 GoTo InValid Label Valid out Parameters_ForSQL Label InValid return (*.spc) <?xml version="1.0" standalone="no"?> <SPEC> <Parameters_ForChannel channelname="novellus.a.5.raw_data"> <AI_MFC_A1_FLW Unit="slm"/> <AI_MFC_A2_FLW Unit="slm"/> <AI_MFC_B1_FLW Unit="slm"/> <AI_MFC_B2_FLW Unit="slm"/> <AI_MFC_B3_FLW Unit="slm"/> <AI_MFC_B4_FLW Unit="slm"/> <AI_RF_FWD Unit="kw"/> <AO_RF_SETPT Unit="kw"/> <AI_RF_RFL Unit="kw"/> <AO_LF_RF_SP Unit="kw"/> <AI_LF_LOAD_PWR Unit="kw"/> <AI_LF_FWD_PWR Unit="kw"/> <AI_4LIN_PRES Unit="Torr"/> <AI_LL_PRESS Unit="V"/> <AI_CH_PRESS Unit="Torr"/> <AI_PLAT_TMP Unit="Degree-C"/> <AO_TEMP_SPT Unit="Degree-C"/> 10
11 <CS_DOOR_CLOSE/> <LL_DOOR_CLOSE/> <CASSETTE_2/> <Plate1_LotID/> <Plate2_LotID/> <Plate3_LotID/> <Plate4_LotID/> <Plate5_LotID/> <Plate6_LotID/> <Plate7_LotID/> <RecipeName/> <ProductID/> <WaferNumber/> <CoatTime/> <ProcessState/> </Parameters_ForChannel> <Parameters_ForSQL channelname="rtms.system.database "> <AI_MFC_A1_FLW Unit="slm"/> <AI_MFC_A2_FLW Unit="slm"/> <AI_MFC_B1_FLW Unit="slm"/> <AI_MFC_B2_FLW Unit="slm"/> <AI_MFC_B3_FLW Unit="slm"/> <AI_MFC_B4_FLW Unit="slm"/> <AI_RF_FWD Unit="kw"/> <AO_RF_SETPT Unit="kw"/> <AI_RF_RFL Unit="kw"/> <AO_LF_RF_SP Unit="kw"/> <AI_LF_LOAD_PWR Unit="kw"/> <AI_LF_FWD_PWR Unit="kw"/> <AI_4LIN_PRES Unit="Torr"/> <AI_LL_PRESS Unit="V"/> <AI_CH_PRESS Unit="Torr"/> <AI_PLAT_TMP Unit="Degree-C"/> <AO_TEMP_SPT Unit="Degree-C"/> <Plate1_LotID/> <Plate2_LotID/> <Plate3_LotID/> <Plate4_LotID/> <Plate5_LotID/> 11
12 <Plate6_LotID/> <Plate7_LotID/> <RecipeName/> <ProductID/> <WaferNumber/> <CoatTime/> <ProcessState/> </Parameters_ForSQL> </SPEC> FSP [1] (1). GetADCardVal AD_Module1 AD_Module2 A/D (2). spc Parameters_ForChannel grouping output RTMS raw data XML (3). CheckVaildData Cassette input input "Parameters_ForSQL" output spac spc spac (4). 1 (1) 4.4 Raw data / Linear y=c 1 x+c 2 (1) Log y=c 1 log c2 x+c 3 (2) Ln y=c 1 lnx+c 2 (3) Exp y=c 1 e x +c 2 (4) Power y=c 1 x c2 +c 3 (5) 12
13 Y x 1 x 2 x 3 x 4 X. MFC Linear (1) -10V +10V y=x <Channel ID="0" RangeType="9" TagName="AO_MFC_A1_SP "> 'I/O 0 </Channel> <Transform Type="LINEAR" X1="-10.0" X2="10.0" C1="1.0" C2="0.0" C3="0.0"></Transform> Plate <Channel ID="1" RangeType="9" TagName="AI_PLAT_TMP"> <Transform Type="LINEAR" X1="-10.0" X2="3.0" C1="150" C2="-150" C3="0.0"></Transform> <Transform Type="LOG" X1="3.0" X2="10.0" C1="4.5" C2="2" C3="1.0"></Transform> </Channel> -10V +3V y=150x log y= y=4.5log 2 +1 Transform Tag 4.5 step step step 13
14 (1) (2) (3) (4) (5) (6).PECVD Concept One Step1:Flush Chamber Step2:Pre-Coating Step3:Coating Step4:Clean-1 1 Step5:Clean-2 2 Step6:Flush Chamber step Step1 Step2 300 C FSP 'AI_PLAT_TMP' parameter tag=300 tag 'Process Step'="Coating" raw data Step 4.6 Coating Chamber Pressure Chamber Load lock chamber Chamber FSP 2~3 Off-line SPC 14
15 Chamber Pressure load lock door.load lock door 5 Regression SPC Statistics Process Control 6 III-V NOVELLUS 7 [1] " " [2] Jiawei Han, Micheline Kamber " Data Mining: Concepts and Techniques " Morgan Kaufmann Publishers; 1st edition August 2000 [3] Eamonn Keogh, Shruti Kasetty "On the Need for Time Series Data Mining Benchmarks: A Survey and Empirical Demonstration" SIGKDD 02, July , Edmonton, 15
16 Alberta, Canada [4] " " [5] SEMI, E-Manufacturing Guidelines and Standards, SEMI International Standards Day, Hsinchu, Taiwan, December, 2003 [6] SEMI, Provisional Specification for CIM Framework Advanced Process Control Component, SEMI E , 2000 [7] SEMI, SEMI equipment communications standard 1 message transfer, Global Information & Control Committee, SEMI E4-0699, 1999 [8] SEMI, SEMI Equipment communications standard 2 message content, Semi E5-0600, 1999 [9] 16
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