Oerlikon ICP 790 User Instructions. For the Micro-Electronics Laboratory. University of Notre Dame. Department of Electrical Engineering

Transcription

1 Oerlikon ICP 790 User Instructions For the Micro-Electronics Laboratory At University of Notre Dame Department of Electrical Engineering

2 General Precautions Contacts For problems, clarifications of procedures, or general information pertaining to this machine, please contact one of the following personnel. Mark Richmond, Mike Thomas Keith Darr Grace Xing In case of emergency, Please contact the Notre Dame Security at If an alarm is sounding, click the Alarm Silence softkey at the bottom-right of the screen. This will stop the infernal beeping of the alarm. Check the Alarm text box on the screen to see if it is something obvious such as Above atmospheric pressure in chamber, meaning that you didn t hold down the camber lid when you started pumpdown. To clear the alarm, click Hold, this rechecks the alarm condition and removes it if it no longer exists. If the alarm persists or you don t understand the alarm message, contact a senior user, Prof. Xing, or lab staff. 2. For LN2 use, all users will be required to procure their own LN2. This includes ordering and connecting to the machine. For help with connecting please contact the lab staff or a senior user of this machine. 3. Each Recipe is required to have 2 Purge&Evac cycles. 4. Variable time recipes cannot be done in batch files. 5. All F-based etches need permission from Dr. Xing to prevent process contamination. 6. For training: (Contact information is above) a. Dr. Grace Xing for permission and training.. b. Dr. Xing will notify Mark Richmond. c. Mark Richmond with several times you are available for training over several days. d. Contact John Simon or other senior users for your first 3-5 uses of the machine for help and guidance using the machine. (See logbook). Standby Conditions 1. Ion gauge turned On. 2. Pumps should be on and pumping the vacuum chambers. 21 May 08 Page 2 of 109

3 Start procedure (Running a sample) Please see Figure #1 on page #8 for clarification. 1. Sign up on the ICP signup sheet noting down the materials to be etched and gases desired. * If you need to use a lower substrate temperature, you need to check whether plenty of LN 2 is available for your process since it is necessary to use LN 2 for cooling the substrate electrode. 2. Log into the log book and complete as much information as you can Log into the computer as needed. (General User: icfab and Pass: icfab) 3. Verify Standby conditions according to the list on Page #2. 4. Prepare samples and have them ready when you open the machine. 5. Turn off the ion gauge. a. On the ICP computer, go to Utilities and then Ion Gauge OFF. 6. On the ICP computer, go to Utilities, then LoadLock, and Vent to vent the LoadLock chamber. 7. After about a minute, Lock Vent Complete will appear in the info line, and then open the LoadLock lid. 8. Insert wafer or samples as appropriate (only 4 inch wafers are accepted). Load the small pieces of samples on a Si carrier wafer WITHOUT any glue. On wafers, watch your placement carefully. Double check your full wafer or the Si carrier wafer is in the pocket completely. 9. Close LoadLock lid, making sure it shuts completely. 10. On the ICP computer, go to Utilities, then LoadLock, then Pump. After Pumping Lock with mech pump is displayed in the info box, continue on with the procedure. 11. For Manual Mode operation, go to page #5 Step # Load your batch file by the following: a. Go to Process and then Batch. b. A Batch Editor window will pop up. c. In the batch editor, go to File then Load. d. Find and highlight your batch file and click OK. e. Click File and then Exit of the Batch Editor to close the Batch Editor. You will be returned to the System screen. 13. When ready to start your Batch, press Ready on the bottom of the screen. 14. The machine may take a while to reach temperature compliance. 15. When Ready mode is achieved, click Run to start your batch. 16. The machine then takes over and runs your batch file. (Including loading and unloading your samples.) 17. Processing should be monitored on the ICP computer. The batch file manages all wafer manipulations. You must log the bias values of the process into the log book. 18. When process is complete, a Process Complete window pops up with information on the process and the LoadLock is at atmosphere. 19. Lift up on the LoadLock Lid. 20. Unload Samples and when done be sure to reinstall the carrier wafer. 21. Close LoadLock lid. 21 May 08 Page 3 of 109

4 22. Click OK on the Process Complete window if needed. 23. Click Window and then Chamber diagram. 24. Click Utilities, LoadLock, and Pump to pump down the LoadLock. Turn on the ion gauge. a. On the ICP Computer, Go to Utilities and then Ion Gauge ON. 25. Verify the machine is in Standby conditions according to Page # Clean up the equipment, samples, and accessories you may have used. 27. Verify the log sheet is completely filled out and sign out. 21 May 08 Page 4 of 109

5 Manual Mode operation Figures #2 and #5 on pages #8 and #10 illustrates these instructions. 1. On the ICP computer, go to Service, Maintenance, and then Wafer Handling. 2. Lower left of the screen, click the Load soft key. 3. Wait while the system loads your samples into the process chamber. Wafer/tray load complete will come up in the info dialogue box when this is done. 4. Click Exit on the lower right of the screen. 5. Go to Service and Manual Mode. 6. This will bring up the manual mode screen for use. a. Set your gas flows as needed in the center of the screen. b. Click Gas ON at the top of the screen to start gas flowing. c. Allow time for gas to stabilize. d. Set pressure setpoint as desired. e. Click Pressure ON to start the throttle valve. f. Allow time for pressure to stabilize. g. Click Helium ON to start the Helium backpressure flow. h. Allow time for the Helium pressure to stabilize. i. Set RF Powers on RF1 and RF2 as desired. j. Click RF on the top of the screen to start RF. k. Allow to RF to stabilize as needed. l. Time the process as needed. When your process is complete, click All OFF in the upper right corner of the display. m. Exit Manual Mode by pressing <EXIT> on the upper right of the screen. 7. Go to Service menu, Maintenance menu, and then Wafer Handling option. 8. On the lower left of the screen, click the Unload soft key. 9. When the info dialogue box displays Wafer/Tray unload complete you may continue on. 10. Click Exit in the lower right of the display to exit from wafer Handling. 11. On the ICP Computer main screen, go to Utilities, LoadLock, and Vent to vent the LoadLock chamber. 12. Allow the LoadLock to come up to atmosphere. Lock Vent Complete will be displayed in the Info Dialogue line. 13. Return to Step #19 On Page #3. 21 May 08 Page 5 of 109

6 Making a recipe To be able to create a recipe, the ICP computer must be in Standby and not in Ready mode. Figure #3 on page #9 illustrates these procedures along with file name Training.prc on the ICP computer. 1. From the Standby mode, go to Process, then Chamber, and New. 2. The Process Editor will pop up. 3. The Initial step will be open. This will set the process baseline. a. Enter Name. b. Enter Description. In description list your NETID and current date. c. Pump should be left at Turbo. d. Enter Base Pressure to be your desired pressure. e. Enter Hold Time. The amount of time you want the system held for your recipe, 10 sec is most likely enough and is the default value. f. Data Logging should be left at No Log. g. Enter desired temp in Temperature Channels and Substrate field. h. Click OK when completed with step. 4. To add a step, highlight Initial and click Process on the lower left of the screen. Adding steps happen after the highlighted step. a. Enter step Description. b. Under Pump enter your desired Pressure and Pump (always Turbo) if needed. c. Under Gas Channels, enter desired flow rates of required gases. d. Under RF Generators, enter desired Set points for RF1 (RIE) and RF2 (ICP). e. AMN should be left at Auto. 5. You must add 2 x ( Purge and Evac ) steps before an End. a. Default settings should be used with the following times. b. Purge for 1 minute. c. Evac for 2 minutes. 6. In the End Step: a. Enter End in description. b. Defaults in the Final Pump, Pressure, and Hold Time should be fine for most processing. c. Click OK when finished. 7. When completed with steps, click Save in the lower right of the screen. 8. Name your process recipe and click OK. 9. Click Exit to exit Process Editor. 21 May 08 Page 6 of 109

7 Making a batch file To be able to create a batch, the ICP computer must be in Standby and not in Ready mode. This process is illustrated by figure #4 on page #9 and file named Training.bch on the ICP computer. 1. Click Process and then Batch to open the Batch Editor. 2. Click File and New. 3. Untitled.001 window pops up with 1 Pump LoadLock. 4. Click Edit, Chamber 1, and Move In. This loads the sample to the process chamber. 5. Process Files Chamber 1 window pops up. 6. Pick your recipe and click OK. This loads and runs your recipe. 7. Click Edit, LoadLock, and Move In. This transfers your wafer from the process chamber back to the LoadLock. 8. Click Edit, LoadLock, and Vent. This vents the LoadLock to atmosphere. 9. Click File and Save as. 10. Enter Filename and click OK to save your batch file. 11. Click File and then Exit of the Batch Editor to close the Batch Editor. 21 May 08 Page 7 of 109

8 Figure 1: System Diagram Figure 2: Wafer Handling Diagram 21 May 08 Page 8 of 109

9 Figure 3: Process Editor Figure 4: Batch Editor 21 May 08 Page 9 of 109

10 Figure 5: Manual Mode operation 21 May 08 Page 10 of 109