OLED DISPLAY MODULE. Product Specification. INTERNAL APPROVALS Product Mgr Mech. Eng Electr. Eng. Date: Aug Date: Aug.04.

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1 OLED DISPLAY MODULE Product Specification CUSTOMER STANDARD PRODUCT NUMBER CUSTOMER APPROVAL Date INTERNAL APPROVALS Product Mgr Mech. Eng Electr. Eng Bruno Recaldini Eric Date: Aug Date: Aug Date: Aug Approval for Specification only Approval for Specification and Sample FORM NO: 0199 Issue 2.0

2 TABLE OF CONTENTS 1 MAIN FEATURES MECHANICAL SPECIFICATION MECHANICAL CHARACTERISTICS MECHANICAL DRAWING ELECTRICAL SPECIFICATION ABSOLUTE MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS INTERFACE PIN ASSIGNMENT BLOCK DIAGRAM OPTICAL SPECIFICATION OPTICAL & ELECTRICAL CHARACTERISTICS FUNCTIONAL SPECIFICATION COMMANDS POWER UP/DOWN SEQUENCE RESET CIRCUIT ACTUAL APPLICATION EXAMPLE DISPLAY DIRECTION SETTING APPLICATION CIRCUIT PACKAGING AND LABELLING SPECIFICATION PACKAGING LABELLING & MARKING QUALITY ASSURANCE SPECIFICATION CONFORMITY DELIVERY ASSURANCE DEALING WITH CUSTOMER COMPLAINTS RELIABILITY SPECIFICATION CONTENTS OF RELIABILITY TESTS LIFE TIME FAILURE CHECK STANDARD HANDLING PRECAUTIONS B Page 2 / 27

3 REVISION RECORD Rev. Date Page Chapt. Comment ECR no. A Jan Production Release B Aug Added Power Consumption Added Frame Rate ECR_DE034 B Page 3 / 27

4 1 MAIN FEATURES ITEM Display Format Overall Dimensions(W*H*T) Active Area(W*H) Viewing Area(W*H) CONTENTS 132 x 64 Dots x x 1.8 mm x mm x mm Display Mode Passive Matrix (1.16 ) Display Colour Driving Method Driver IC Area Colour (Blue, Yellow, Orange, Green) 1 / 64 duty SSD1303T6 (TCP) Operating temperature -20 ~ +70 Storage temperature -30 ~ +80 B Page 4 / 27

5 2 MECHANICAL SPECIFICATION 2.1 MECHANICAL CHARACTERISTICS ITEM CHARACTERISTIC UNIT Display Format 132 x 64 Dots Overall Dimensions x x 1.8 mm Active Area x mm Viewing Area x mm Dot Size 0.18 x 0.18 mm Dot Pitch 0.20 x 0.20 mm Weight 2.4 g IC Controller/Driver SSD1303 ( TCP No. : SSD1303T6) B Page 5 / 27

6 2.2 MECHANICAL DRAWING B Page 6 / 27

7 3 ELECTRICAL SPECIFICATION 3.1 ABSOLUTE MAXIMUM RATINGS Item Symbol Min Max Unit Note Supply Voltage V DD V Driver Supply Voltage Vcc 0 15 V Note 1,2 Operating Temperature Top C - Storage Temperature Tst C - Static Electricity Be sure that you are grounded when handling displays. Note 1: All the above voltage are on the basis of GND=0V. Note 2: When this module is used beyond the above absolute maximum ratings, permanent breakage of the module may occur. Also, for normal operations, it s desirable to use this module under the conditions according to Section 3 Electrical Characteristics. If this module is used beyond these conditions, malfunctioning of the module can occur and the reliability of the module may deteriorate. 3.2 ELECTRICAL CHARACTERISTICS DC CHARACTERISTICS Characteristics Symbol Min Typ Max Unit Supply Logic V DD V Driver Supply Voltage V CC V High Level Input V IH 0.8xV DD - V DD V Low Level Input V IL 0-0.2xV DD V High Level Output V OH 0.9xV DD - V DD V Low Level Output V OL 0-0.1xV DD V Sleep mode current I SLEEP µa Power consumption P - Note (1) : 50% pixels ON Note (2) : 100% pixels ON 70 (1) 107 (2) mw B Page 7 / 27

8 3.3 INTERFACE PIN ASSIGNMENT No. Symbol I/O Function 1 N.C. - 2 VCC I/O 3 VCOMH I/O 4 IREF I 5 D7 I/O 6 D6 I/O 7 D5 I/O 8 D4 I/O 9 D3 I/O 10 D2 I/O 11 D1 I/O 12 D0 I/O 13 E/RD# I 14 R/W# I 15 D/C# I Reserved Pin (Supporting Pin). The supporting pins can reduce the influences from stresses on the function pins. Power Supply for Panel. This is the most positive voltage supply pin of the chip. It can be supplied externally or generated internally by using internal DC/DC voltage converter. Voltage Output High Level for COM Signal. This pin is the input pin for the voltage output high level for COM signal. A capacitor should be connected between this pin and VSS. Current Reference for Brightness Adjustment. This pin is segment current reference pin. A resistor should be connected between this pin and VSS. Set the current at 10uA. Host Data Input/Output Bus. These pins are 8-bit bi-directional data bus to be connected to the microprocessor s data bus. When serial mode is selected, D1 will be the serial data input SDIN and D0 will be the serial clock input SCLK. Read/Write Enable or Read. This pin is MCU interface input. When interface to a series microprocessor, this pin will be used as the Enable (E) signal. Read/Write operation is initiated when this pin is pulled high and the CS# is pulled low. When connecting to an 8080-microprecessor, this pin receives the Read (RD#) signal. Data read operation is initiated when this pin is pulled low and CS# is pulled low. Read/Write Select or Write. This pin is MCU interface input. When interface to a series microprocessor, this pin will be used as Read/Write (R/W#) selection input. Pull this pin to High for read mode and pull it to Low for write mode. When 8080 interface mode is selected, this pin will be the Write (WR#) input. Data write operation is initiated when this pin is pulled low and CS# ispulled low. Data/Command Control. This pin is Data/Command control pin. When the pin is pulled high, the input at D7~D0 is treated as display data. When the pin is pulled low, the input at D7~D0 will be transferred to the command register. For detail relationship to MCU interface signal, please refer to the Timing Characteristics Diagrams. B Page 8 / 27

9 16 RES# I 17 CS# I 18 N.C BS2 I 20 BS1 21 VDD I 22 N.C N.C N.C VBREF I/O 26 RESE I 27 FB I 28 VDDB I 29 GDR O 30 VSS I 31 N.C. - Power Reset for Controller and Driver. This pin is reset signal input. When the pin is low, initialization of the chip executed. Chip Select. This pin is the chip select input. The chip is enabled for MCU communication only when CS# is pulled low. Reserved Pin. The N.C. pins between function pins are reserved for compatible and flexible design. Communicating Protocol Select. These pins are MCU interface selection input. See the following table: 6800-parallel 8080-parallel Serial BS BS Power Supply for Logic Circuit. This is a voltage supply pin. It must be connected to external source. Reserved Pin. The N.C. pins between function pins are reserved for compatible and flexible design. Reserved Pin. The N.C. pins between function pins are reserved for compatible and flexible design. Reserved Pin. The N.C. pins between function pins are reserved for compatible and flexible design. Voltage Reference for DC/DC Converter Circuit. This pin is the internal voltage reference of booster circuit. A stabilization capacitor, typ. 1uF, should be connected to VSS. Input for Connected External NMOS. This pin connects to the source current pin of the external NMOS of the booster circuit. Feedback Input for DC/DC Converter Circuit. This pin is the feedback resistor input of the booster circuit. It is used to adjust the booster output voltage level (VCC). Power Supply for DC/DC Converter Circuit. This is the power supply pin for the internal buffer of the DC/DC voltage converter. It must be connected to VDD when the converter is used. It must be floated when the converter is not used. Output for Connected External NMOS. This output pin drives the gate of the external NMOS of the booster circuit. Ground of System. This is a ground pin. It also acts as a reference for the logic pins, the driving voltage and the analog circuit. It must be connected to external ground. Reserved Pin (Supporting Pin). The supporting pins can reduce the influences from stresses on the function pins. B Page 9 / 27

10 3.4 BLOCK DIAGRAM MCU Interface Selection: BS1 and BS2 Pins connected to MCU interface:d7~d0, E/RD#, R/W#, D/C#, RES# and CS# * VBREF, RESE, FB, VDDB, GDR and VSSB should be left float. C1, C3 : 4.7μF C2 : R1 : 10 μf 910kΩ, R1 = ( Voltage at IREF BGGND ) / IREF B Page 10 / 27

11 3.4.1 AC CHARACTERISTICS Series MPU Parallel Interface Timing Characteristics: Characteristics Symbol Min Max Unit Clock Cycle Time t cycle ns Address Setup Time t AS 0 - ns Address Hold Time t AH 0 - ns Write Data Setup Time t DSW 40 - ns Write Data Hold Time t DHW 15 - ns Read Data Hold Time t DHR 20 - ns Output Disable Time t OH - 70 ns Access Time t ACC ns Chip Select Low Pulse Width (Read) Chip Select Low Pulse Width (Write) PW CSL ns Chip Select High Pulse Width (Read) Chip Select High Pulse Width (Write) PW CSH ns Rise Time t R - 15 ns Fall Time t F - 15 ns * All the timing should be based on 30% and 70% of V DD -GND. B Page 11 / 27

12 Series MPU Parallel Interface Timing Characteristics: Characteristics Symbol Min Max Unit Clock Cycle Time t cycle ns Address Setup Time t AS 0 - ns Address Hold Time t AH 0 - ns Write Data Setup Time t DSW 40 - ns Write Data Hold Time t DHW 15 - ns Read Data Hold Time t DHR 20 - ns Output Disable Time t OH - 70 ns Access Time t ACC ns Chip Select Low Pulse Width (Read) Chip Select Low Pulse Width (Write) PW CSL ns Chip Select High Pulse Width (Read) Chip Select High Pulse Width (Write) PW CSH ns Rise Time t R - 15 ns Fall Time t F - 15 ns * All the timing should be based on 30% and 70% of V DD -GND. B Page 12 / 27

13 Serial Interface Timing Characteristics: Characteristics Symbol Min Max Unit Clock Cycle Time t cycle ns Address Setup Time t AS ns Address Hold Time t AH ns Chip Select Setup Time t CSS ns Chip Select Hold Time t CSH 60 - ns Write Data Setup Time t DSW ns Write Data Hold Time t DHW ns Clock Low Time t CLKL ns Clock High Time t CLKH 100 ns Rise Time t R - 15 ns Fall Time t F ns * All the timing should be based on 30% and 70% of V DD -GND. B Page 13 / 27

14 4 OPTICAL SPECIFICATION 4.1 OPTICAL CHARACTERISTICS Characteristics Symbol Condition Min Typ Max Unit Brightness L br With Polarizer cd/m 2 C.I.E.(Blue) C.I.E.(Yellow) C.I.E.(Green) C.I.E.(Orange) (X) Without Polarizer (Y) (X) Without Polarizer (Y) (X) Without Polarizer (Y) (X) Without Polarizer (Y) Frame Rate F/sec Dark Room Contrast CR Shown as below - >1: View Angle > degree Note 3: Optical measurement taken at 1/64 duty, 100Hz Frame Rate, 0xFF Contrast Setting. B Page 14 / 27

15 5 FUNCTIONAL SPECIFICATION 5.1 COMMANDS Please refer to the Technical Manual for the SSD POWER UP/DOWN SEQUENCE To protect panel and extend the panel life time, the driver IC power up/down routine should include a delay period between high voltage and low voltage power sources during turn on/off. It gives the panel enough time to complete the action of charge and discharge before/after the operation POWER UP SEQUENCE: 1. Power up V DD 2. Send Display off command V CC 3. Power up V CC 4. Delay 100ms V DD (When V DD is stable) 5. Send Display on command V SS /Ground POWER DOWN SEQUENCE: V DD ON V CC ON Display On Display off V CC off V DD off 1. Send Display off command 2. Power down V CC V CC 3. Delay 100ms (when V CC is reach 0 and panel is completely discharges) V DD 4. Power down V DD V SS /Ground 5.3 RESET CIRCUIT When RES# input is low, the chip is initialized with the following status: 1. Display is off x64 Display Mode 3. Normal segment and display data column and row address mapping (SEG0 mapped to column address 00H and COM0 mapped to row address 00H) 4. Shift register data clear in serial interface 5. Display start line is set at display RAN address 0 6. Column address counter is set at 0 7. Normal scan direction of the COM outputs 8. Contrast control register is set at 80H 9. Internal booster is selected B Page 15 / 27

16 5.4 ACTUAL APPLICATION EXAMPLE Command usage and explanation of an actual example < Initialization Setting > Set Display Clock Divide Ratio / Oscillator Frequency ( with XXXXXXXX ) Set Display Offset ( with **XXXXXX ) * XXXXXX = 64 Dummy Line from Common 0 Set Multiplex Ratio ( with **XXXXXX ) Set Area Colour Mode ( with 00XX0X0X ) => 0x00 ( Off ) Set Display Start Line ( 01XXXXXX ) Set Segment Re-map ( X ) Set COM Output Scan Direction ( with 000X0010 ) => 0x12 ( Alternative Mode ) Set Contrast Control Register ( with XXXXXXXX ) Set Entire Display On/Off ( X ) => 0xA4 ( Normal ) Set Normal/Inverse Display ( X ) => 0xA6 ( Normal ) Set Display On/Off ( X ) => 0xAF ( Turns On ) < Display Boundary Setting > Set Page Address ( 1011XXXX ) => 0xB0 Set Lower Column Address ( 0000XXXX ) Set Higher Column Address ( 0001XXXX ) If the noise is accidentally occurred at the displaying window during the operation, please reset the display in order to recover the display function. B Page 16 / 27

17 5.5 DISPLAY DIRECTION SETTING NORMAL DISPLAY MODE < Relative Instruction Setting > Set Display offset 0xD3 with 0x00 Set Multiplex Ratio 0xA8 with 0x3F Set Display Start Line 0x40 Set Segment Re-map 0xA0 ( Normal Mode ) Set COM Output Scan Direction 0xC8 ( Remapped Mode ) Set Lower Column Address 0x00 Set Higher Column Address 0x10 B Page 17 / 27

18 5.5.2 INVERTED DISPLAY MODE * The pattern shown in active area is the same as that in normal display mode but setting the COM Output Scan Direction as remapped mode. < Relative Instruction Setting > Set Display Offset 0xD3 with 0x00 Set Multiplex Ratio 0xA8 with 0x3F Set Display Start Line 0x40 Set Segment Re-map 0xA1 ( Remapped Mode ) Set COM Output Scan Direction 0xC0 ( Normal Mode ) Set Lower Column Address 0x00 Set Higher Column Address 0x10 B Page 18 / 27

19 5.6 APPLICATION CIRCUIT DC/DC Converter:AIC1896 * AIC1896CE could be connected to MCU or VDD for alternative solution. VCC = 1.23 x ( R1 + R2 ) / R Components List Item Name Value Remark Driver IC SSD1303 Solomon DC/DC Converter AIC1896 Step-up Inductor L1 22µH 2A Schottky Diode D1 1A, 20V R1 1.2MΩ 1%, 1/4W Resistor Capacitor R2 120kΩ 1%, 1/4W R3 910kΩ 1% C1 10µF 6.3V, Low ESR C2 10µF 16V, Low ESR C3 1µF 16V, Low ESR C4 15nF 16V, Low ESR C µF 6.3V, Low ESR C6 4.7µF 6.3V, Low ESR C7,C8 4.7µF 16V, Low ESR B Page 19 / 27

20 6 PACKAGING AND LABELLING SPECIFICATION 6.1 PACKAGING Material Item Part code Dimensions Unit weight (mm) (kg) Quantity 1 Module 33.4*21.7* Tray ***** *** Inner box ***** *** Carton ***** *** Inner box bag ***** *** *** *** 6 Total weight 8.5 Kg ± 5% Specification and quantity Modules x tray Quantity per row 8 x Quantity per column 5 = 40 Modules per box Quantity per tray 40 x Quantity of trays 15 = 600 Total no. of modules Quantity per box 600 x Quantity of boxes 4 = LABELLING & MARKING DENSITRON TW YY MM B Page 20 / 27

21 7 QUALITY ASSURANCE SPECIFICATION 7.1 CONFORMITY The performance, function and reliability of the shipped products conform to the Product Specification. 7.2 DELIVERY ASSURANCE Delivery inspection standards MIL-STD-105E, general inspection level II, single sampling level; The quality assurance levels are shown below: Rank Item Inspected Defect type AQL Remark Major defect Minor defect Display Display Non display Flicker Missing Line or Pixel Wrong Display Cross Talk * Black and white spot Polarizer scratch Bubbles ** Dirt, Greasy Dirt Colour uniformity Foreign Material Dent 0.65% 1.0% Total 1.0% Fit/Function defect Appearance defect * In display which manifests itself has the other shadowing, ghosting or streaking. ** Distance between any 2 defects should over 10mm. B Page 21 / 27

22 7.2.2 Zone definition A Active B Outside Active Visual inspection Test and measurement were conducted under the following conditions: Temperature: 23±5 Humidity: 55±15%RH Distance between the Panel & Eyes of the Inspector: 30cm B Page 22 / 27

23 Standard of appearance inspection Units: mm No Item Criteria 1 Black spot, white spot, dust Round type: as per following drawing = (X+Y)/2 Acceptable quantity Size Zone A Zone B <0.1 Any number Y 0.1< <0.2 3 Any number 0.2< < X 0.25< 0 Line type: as per following drawing Acceptable quantity W Length Width Zone A Zone B - - W 0.02 Any number L <W 0.03 L <W Any number L <W As round type Total acceptable quantity: 3 2 Polarizer scratch 3 Polarizer bubble Scratch on protective film is permitted Scratch on polarizer: same as No. 1 = (X+Y)/2 Acceptable quantity Size Zone A Zone B <0.1 Any number Y 0.1< <0.2 3 Any number 0.2< < X 0.25< 0 Total acceptable quantity: 3 X 1/6 Panel Length Y 1 Z T 4 Panel Chipping B Page 23 / 27

24 Any crack is not allowable. 5 Panel Crack B Page 24 / 27

25 7.3 DEALING WITH CUSTOMER COMPLAINTS Non-conforming analysis Purchaser should supply Densitron with detailed data of non-conforming sample. After accepting it, Densitron should complete the analysis in two weeks from receiving the sample. If the analysis cannot be completed on time, Densitron must inform the purchaser Handling of non-conforming displays If any non-conforming displays are found during customer acceptance inspection which Densitron is clearly responsible for, return them to Densitron. Both Densitron and customer should analyse the reason and discuss the handling of nonconforming displays when the reason is not clear. Equally, both sides should discuss and come to agreement for issues pertaining to modification of Densitron quality assurance standard. B Page 25 / 27

26 8 RELIABILITY SPECIFICATION 8.1 CONTENTS OF RELIABILITY TESTS Test Item Test Condition Evaluation and assessment High Temperature Operation Low Temperature Operation High Temperature Storage Low Temperature Storage High Temperature & High Humidity Storage Thermal Shock 70 C±2, 240 hours -20 C±2, 240 hours 80 C±2, 240 hours -30 C±2, 240 hours 60 C±2, 90%RH, 240 hours 10 cycle of -30 C 30 min, R.T. 5 min, 80 C 30 min * The brightness should be greater than 50% of the initial brightness. * The samples used for the above tests do not include polarizer. * No moisture condensation is observed during tests. No abnormalities in function and appearance No abnormalities in function and appearance No abnormalities in function and appearance No abnormalities in function and appearance No abnormalities in function and appearance No abnormalities in function and appearance 8.2 LIFE TIME Item 1 Description Function, performance, appearance, etc. shall be free from remarkable deterioration more than 10,000 hours under ordinary operating and storage conditions of room temperature (25±10 C), normal humidity (45±20% RH), and in area not exposed to direct sunlight. 2 End of lifetime is specified as 50% of initial brightness. 3 The storage period is warrantable of more than 20,000hr from the date of invoice under normal room conditions as stated below. Temperature: 23 ± 5 C. Humidity: 55 ± 15 %RH. In case of the seal of cartoon not opened 8.3 FAILURE CHECK STANDARD After the completion of the described reliability test, the samples wewe left at room temperature for 2 hrs prior to conducting the failure teat at 23±5 C;55±15% RH. B Page 26 / 27

27 9 HANDLING PRECAUTIONS Safety If the panel breaks, be careful not to get the organic substance in your mouth or in your eyes. If the organic substance touches your skin or clothes, wash it off immediately using soap and plenty of water. Mounting and Design Place a transparent plate (e.g. acrylic, polycarbonate or glass) on the display surface to protect the display from external pressure. Leave a small gap between the transparent plate and the display surface. Design the system so that no input signal is given unless the power supply voltage is applied. Caution during OLED cleaning Lightly wipe the display surface with a soft cloth soaked with Isopropyl alcohol, Ethyl alcohol or Trichlorotriflorothane. Do not wipe the display surface with dry or hard materials that will damage the polariser surface. Do not use aromatic solvents (toluene and xylene), or ketonic solvents (ketone and acetone). Caution against static charge As the display uses C-MOS LSI drivers, connect any unused input terminal to V DD or V SS. Do not input any signals before power is turned on. Also, ground your body, work/assembly table and assembly equipment to protect against static electricity. Packaging Displays use OLED elements, and must be treated as such. Avoid strong shock and drop from a height. To prevent displays from degradation, do not operate or store them exposed directly to sunshine or high temperature/humidity. Caution during operation It is indispensable to drive the display within the specified voltage limit since excessive voltage shortens its life. Other Precautions When a display module is operated for a long of time with fixed pattern may remain as an after image or slight contrast deviation may occur. Nonetheless, if the operation is interrupted and left unused for a while, normal state can be restored. Also, there will be no problem in the reliability of the module. Storage Store the display in a dark place where the temperature is 25 C ± 10 C and the humidity below 50%RH. Store the display in a clean environment, free from dust, organic solvents and corrosive gases. Do not crash, shake or jolt the display (including accessories). B Page 27 / 27