Levels of Packaging Optimized Component Capability

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Ethel Hutchinson
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1 Optimized Component Capability Follow the Wire... Data and Power from Box to Box... Chip to Chip Sense It... Connect It... Make It Happen

2 For every level of electronic packaging, there are special considerations in interconnection. Within the framework of industry s standard levels of packaging, TE Connectivity (TE) defines six levels of packaging for interconnections. Each level represents the connection between two levels of electronic packaging. Level 1 Connections between a basic circuit element and its leads. Level 2 Connections between component leads and a pc board. IC sockets are an example. Level 3 Connections between two circuit boards. Level 3 most often is board-to-board connections. Options include: One-piece card-edge connectors Two-piece connectors and stacking connectors RF board-to-board connectors Level 4 Connections between two subassemblies. When a device requires more than one subassembly within its housing, wires, cable assemblies, or headers are used to connect them. Cabling options abound: Ribbon cable Discrete wire bundles Flex cable Fiber optics Multiconductor cable Coaxial cable Level 5 Connections from a subassembly to the system s input/output (I/O) ports. Any device that communicates outside itself must provide ports for input and output. I/O connectors can connect to the subassembly by cable or by direct connection (such as a board-mount bulkhead connector). Level 5 connectors can include the internal mating half of the connectors shown in Level 6. Level 6 Connections between physically separated systems. These are connections between I/O ports of separate systems. It can include connections between a computer and its peripherals or connections between the computer and a network switch. Such connections are typically made with multiconductor cable, multipair cable, coaxial cable, or fiber optics. A special case is wireless connections. Here the connectors are antennas and the cabling medium is air. TE Components... TE Technology... TE Know-how... AMP AGASTAT CII HARTMAN KILOVAC MICRODOT NANONICS POLAMCO Raychem Rochester DEUTSCH SEACON Phoenix LL Rowe Phoenix Optix AFP SEACON Get your product to market faster with a smarter, better solution.

3 LEVEL 2 LEVEL 3 IC Sockets LEVEL 4 Memory Module Sockets MULTIGIG RT 2 and 2-R Fortis Zd AMP-LATCH Ribbon Cable and FPC and VITA 67 RF Modules MULTI-BEAM XLE Terminal Blocks LEVEL 5 Terminals and Splices Mezalok Mezzanine VITA 66 Optical Modules DEUTSCH HTC Power ARINC 600 Rack-And-Panel AMPLIMITE D-Subminiature Board- Mount and DEUTSCH Hermetic Nanominiature Board-Mount and Quadrax Board-Mount and DEUTSCH Alpen RF DEUTSCH Filter PAGE 3

LEVEL 5 Connections from a subassembly to the system s I/O ports Example: Cables connecting

basic circuit element and its leads Example: The wires connecting a semiconductor die to

for memory, processors, or other semiconductor packages.

systems Example: Network cables or cables connecting an embedded computer to peripherals

connectors or mezzanine connectors LEVEL 4 Connections between two subassemblies Example:

4 LEVEL 5 Connections from a subassembly to the system s I/O ports Example: Cables connecting daughterboard to I/O panel or a board-mounted I/O connector LEVEL 1 Connections between a basic circuit element and its leads Example: The wires connecting a semiconductor die to its lead frame LEVEL 2 Connections between component leads and a pc board Example: Sockets for memory, processors, or other semiconductor packages. This connection can also be direct solder LEVEL 6 Connections between physically separated systems Example: Network cables or cables connecting an embedded computer to peripherals LEVEL 3 Connections between two circuit boards Example: Motherboard/daughterboard connectors or mezzanine connectors LEVEL 4 Connections between two subassemblies Example: Power supply to motherboard connectors CROSS-LEVEL TE PRODUCTS Relays and Contactors Sensors Composite Enclosures Power Distribution Units PAGE 4

5 LEVEL 6 CeeLok FAS-X Circular and 369 Series DEUTSCH Rectangular and DEUTSCH and Expanded Beam and DEUTSCH Circular Optical and Nanominiature DUALOBE and LL Rowe Hull Penetrators MICRODOT Micro-D and AMPLIMITE D-Subminiature and SEACON Phoenix MIL-C and POLAMCO and Backshells RF and SEACON MINI-CON and Raychem Sealed and Custom Harnesses Raychem Wire and Cable Raychem Harnessing Components Embedded Antennas Conformal Antennas Rochester Umbilical and Tether Cables POLAMCO USB 3.0 PAGE 5

6 LET S CONNECT We make it easy to connect with our experts and are ready to provide all the support you need. Just call your local support number or visit to chat with a Product Information Specialist. Technical Support te.com/support-center North America North America (Toll) EMEA/South Africa EMEA (Toll) Asia Pacific Japan Australia New Zealand +64 (0) India (Toll-Free) LL Rowe Company +1 (781) llrowe@llrowe.com SEACON +1 (619) seacon@seaconworldwide.com SEACON Phoenix +1 (401) sales@seaconphoenixllc.com POLAMCO +44 (0) sales@polamco.com Follow the Wire... Data and Power from Box to Box... Chip to Chip Sense It... Connect It... Make It Happen te.com/aerospace 369, AMP, AMP-LATCH, AMPLIMITE, AGASTAT, CeeLok FAS-X, CII, DEUTSCH, DUALOBE, Fortis Zd, HARTMAN, HexaShield, KILOVAC, LL Rowe, MICRODOT, MULTI-BEAM, MULTIGIG RT, NANONICS, POLAMCO, Raychem, SEACON, TE, TE Connectivity and the TE connectivity (logo) are trademarks of the TE Connectivity Ltd. family of companies. Other products, logos, and company names mentioned herein may be trademarks of their respective owners. While TE Connectivity (TE) has made every reasonable effort to ensure the accuracy of the information herein, nothing herein constitutes any guarantee that such information is error-free, or any other representation, warranty or guarantee that the information is accurate, correct, reliable or current. The TE entity issuing this publication reserves the right to make any adjustments to the information contained herein at any time without notice. All implied warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantability or fitness for a particular purpose are expressly disclaimed. The dimensions herein are for reference purposes only and are subject to change without notice. Specifications are subject to change without notice. Consult TE for the latest dimensions and design specifications TE Connectivity Ltd. family of companies. All Rights Reserved /16

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