PART NUMBER, VSWA2-63DR+:
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1 PART NUMBER, VSWA2-63DR+: AN Due to obsolescence of the dice used in Current part (Current Fab), a new set of dice in a nearly identical package (Future Fab/Replacement Fab) has been qualified and has replaced the current part. Performance of Part with Replacement Die set has been judged by Mini-Circuits Engineering as a close alternative to current part a MECHANICAL DIMENSIONS & PCB LAND PATTERN CURRENT FAB: FUTURE FAB: Case Style: DG1235 Case Style: DG (minor dimensional changes as below) MECHANICAL DRAWING & PCB LAND PATTERN Inches (mm) E & F J Q (2.16) (0.56) (0.89) Inches (mm) E & F J Q (2.70) (0.40) (0.79 Note: 1) Dimensions not shown are the same as in DG1235 2) Mini-Circuits experiment shows part can fit into existing PCB Land pattern AN Rev: A (01/29/16) M File: AN80010.doc Page 1 of 9
2 CONCLUSION: Following are summary of changes: FORM: No change. FIT: Mechanical Dimensions of Device and customer PCB Land Pattern as noted in previous page. FUNCTION: Following are the changes. Parameter CURRENT FAB REPLACEMENT PART Control Voltage: High VDD= + 4 to +5V 2.7V min & VDD max Supply Current 12µA Typ. 50uA Typ. 3.5V min to VDD max Typical performance differences, see paragraphs 2 to 4. Replacement part is qualified to the current part as a close alternative a. AN Rev: A (01/29/16) M File: AN80010.doc Page 2 of 9
3 2) PERFORMANCE COMPARISON, TYPICAL AT VDD=+5V at 25 C a MHz Future Fab Current Fab Parameter From To Average Average Insertion Loss RF-COM to RF Insertion Loss RF-COM to RF Isolation RF-COM to RF Isolation RF-COM to RF Isolation RF1 ro RF2 (RF1 ON) Isolation RF1 ro RF2 (RF2 ON) Return Loss RF COM (RF1 ON) Return Loss RF COM (RF2 ON) Return Loss RF1 ON Return Loss RF2 ON Return Loss RF1 OFF Return Loss RF2 OFF AN Rev: A (01/29/16) M File: AN80010.doc Page 3 of 9
4 3) PERFORMANCE COMPARISON, TYPICAL AT VDD=+3V at 25 C a MHz Future Fab Current Fab Parameter From To Average Average Insertion Loss RF-COM to RF Insertion Loss RF-COM to RF Isolation RF-COM to RF Isolation RF-COM to RF Isolation RF1 ro RF2 (RF1 ON) Isolation RF1 ro RF2 (RF2 ON) Return Loss RF COM (RF1 ON) Return Loss RF COM (RF2 ON) Return Loss RF1 ON Return Loss RF2 ON Return Loss RF1 OFF Return Loss RF2 OFF AN Rev: A (01/29/16) M File: AN80010.doc Page 4 of 9
5 4) PERFORMANCE COMPARISON CURVES a, CURRENT FAB vs. FUTURE FAB: VDD=+5V AN Rev: A (01/29/16) M File: AN80010.doc Page 5 of 9
6 AN Rev: A (01/29/16) M File: AN80010.doc Page 6 of 9
7 5) PERFORMANCE COMPARISON CURVES a, CURRENT FAB vs. FUTURE FAB: VDD=+3V AN Rev: A (01/29/16) M File: AN80010.doc Page 7 of 9
8 AN Rev: A (01/29/16) M File: AN80010.doc Page 8 of 9
9 2015 Mini-Circuits IMPORTANT NOTICE This document is provided as an accommodation to Mini-Circuits customers in connection with Mini-Circuits parts only. In that regard, this document is for informational and guideline purposes only. Mini-Circuits assumes no responsibility for errors or omissions in this document or for any information contained herein. Mini-Circuits may change this document or the Mini-Circuits parts referenced herein (collectively, the Materials ) from time to time, without notice. Mini-Circuits makes no commitment to update or correct any of the Materials, and Mini-Circuits shall have no responsibility whatsoever on account of any updates or corrections to the Materials or Mini-Circuits failure to do so. Mini-Circuits customers are solely responsible for the products, systems, and applications in which Mini-Circuits parts are incorporated or used. In that regard, customers are responsible for consulting with their own engineers and other appropriate professionals who are familiar with the specific products and systems into which Mini-Circuits parts are to be incorporated or used so that the proper selection, installation/integration, use and safeguards are made. Accordingly, Mini-Circuits assumes no liability therefore. In addition, your use of this document and the information contained herein is subject to Mini-Circuits standard terms of use, which are available at Mini-Circuits website at Mini-Circuits and the Mini-Circuits logo are registered trademarks of Scientific Components Corporation d/b/a Mini-Circuits. All other third-party trademarks are the property of their respective owners. A reference to any third-party trademark does not constitute or imply any endorsement, affiliation, sponsorship, or recommendation: (i) by Mini-Circuits of such third-party s products, services, processes, or other information; or (ii) by any such third-party of Mini-Circuits or its products, services, processes, or other information. AN Rev: A (01/29/16) M File: AN80010.doc Page 9 of 9
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