WinMate Communication Inc. 9F, No Hsing Teh Road, San-Chung, Taipei, Taiwan, R.O.C TEL: FAX: Thermal Test Report

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1 Thermal Test Report Issue by Product Model Product Description Engineering Department Report No:0808TT G-WIN Rugged Panel PC : R08I53S-VMM2 Intel 855GME Rugged 8.4" Panel PC New product G-WIN Rugged Panel PC PCB :Winmate / I Renew product PCB : BIOS: Test Reason Revision change PCB : BIOS: Component: 2008/08/01 Lindon Lin Peter Chou Issue date Approved Test Engineer 1

2 1.Document Introduction This document describes how we conduct the environment conditions and test procedure. It includes the test equipment we use,the test condition,and the test procedure we take. We also define our test criteria and the way to conclude the test result. (According to client s test specification, please see following sheets in detail.) Table of Testing Summary Results NO Test Item Condition Description Sect. / Page 1 Thermal Profile -Operating Test -Thermal Cycle: 30/40/55 ± 2 o 4 C -Every stage of 2 Hours / 5 Reference to IEC

3 2. Product Configuration 1. M/B :Winmate / I CPU:Intel_Celeron_M_1.0GHz_400MHz 3. RAM:Transcend / 512MB DDR / SAMSUNG K4H510838D-UCCC / 400MHz 4. CF:Transcend / 4GB / Industrial 5. DVD-ROM:No 6. Card+Reader with Floppy: No 7. LCD:8.4" Mitsubishi AA084XA03 8. Inverter:QF82V3.30S 9. T/S Control Board:Touch SCN-A5-FLT08.4-Z01-0H1-R 10. Adapter:LI SHIN / 0452B1280 / OUTPUT:12V / 6.67A 11. Heat sink :Yes (On CPU) / Yes ( On Intel 855GME Chipset) / Yes ( On Intel ICH4 Chipset) 12.CPU FAN :No 13. System Fan:No 14. Power Board:Topower 8~36V DC-DC 12V Output 15. EUT of stage:prototype Sample Version SBC Specifications : Processor Intel Celeron M 1GHz Processor BIOS Award 4Mbit Flash System Chipset Intel 855GME / ICH4 Chipset Memory Slot 1 x SO-DIMM, Max 1GB DDR 333 KB / Mouse 1x PS/2 Ethernet 2 x RJ-45 (10/100 Mbps, Optional GigaLAN) USB Ports 2 x USB 2.0 VGA 1 x VGA(DB-15) Serial Ports 1 x RS232/422/485 Expansion slot 1 x Mini PCI, 1 x CF 3

4 3. Product Configuration of Photo EUT of Photo Top View Bottom View Front View Back View Side View Side View 4

5 4. Thermal Profile Test A. Test Equipment: Test Site: Winmate LAB Programmable Temperature & Humidity Chamber TERCHY / MHC-120L / S/N: YOKOGAWA/µr20000 / SN:S5G B. LAB Environmental Conditions: Ambient Temperature :25 +/- 3 o C Relative Humidity :55 +/- 20% RH C. Test Method / Specification : Reference to IEC Thermal Cycle: 30 /40 /55 ±2 AC Power : 110/220 VAC, 60/50Hz Running Windows XP with Stress software BCM Diagnostics Pro Version 2.30 Quantity : Total 1 Set Testing Period: July 18, 2008 to July 19,2008 Figure 1:High temperature thermal cycle 5

6 D. Check Condition and Requirements: It is to check the thermal profile of the test unit,and also test unit can work under different environment temperature condition. The highest temperature /position, lowest temperature /position and the average temperature value will be display at the thermal profile record. The equipment in its high temperature mode, shall exposed to daily high-low temperature cycles between 30 o C 40 o C and 55 o C.The equipment shall withstand the required environmental conditions and shall meet, without any functional damage, all performance requirements after being exposed to 1 cycles of high temperatures, as illustrated in Figure1. E. Test Result: Examine the appearance of specimen(s) by visual check and perform functional check after this test. Connect the specimen with rated power then examine whether the display function of specimen could be work normally or not. Functional Check & Mechanical Structure : Normal Appearance check(visual check) :No visible damage (Add the CPU Thermal Pad & North of bridge Thermal Pad to Bottom Case) Temperature of Test Point: Temperature rise of part : CPU:Intel_Celeron_M_1.0GHz_400MHz Heat sink North of bridge chip Heat sink South of bridge chip Heat sink RAM: Transcend / 512MB DDR / 400MHz CF : Transcend / 4GB / Industrial Inverter (QF82V3.30S) PCB ELO Board / U Power Board (TOP-P080D) PCB Enclosure inside Ambient (Right) Enclosure inside Ambient (Left) Enclosure outside near middle Ambient Temperature Note: The table shows the examine of system health status. In comparison with the component spec, the examine result will be minor inconsistency. Although the temp is a bit overheating, it s still in tolerating ranges and working properly. 6

7 Temperature records for test points from Data Logger. 7

8 (1) Temperature Point of Number Description (2) Temperature Point of Number Description 4 5 Back 8

9 (3) Temperature Point of Number Description 11 (4) Temperature Point of Number Description 12 Ambient NOTE: 12-Ambient in Chamber 9

10 F. Test Judgment: Test Result as below: Check Item Appearance check (Visual check) Functional & Style Item No. Initial Final Performance check 8.4 G-WIN Rugged Panel PC : R08I53S-VMM2 No visible damage No visible damage Normal 10