WinMate Communication Inc. 9F, No Hsing Teh Road, San-Chung, Taipei, Taiwan, R.O.C TEL: FAX: Thermal Test Report

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1 Thermal Test Report Issue by Product Model Product Description Engineering Department Report No:0807TT0273 Rugged BOX PC : I570EAC-201 I570EAC-201 Embedded Industrial Automation Controller New product Rugged BOX PC PCB :Winmate / I Renew product PCB : BIOS: Test Reason Revision change PCB : BIOS: Component: 2008/07/22 Lindon Lin Peter Chou Issue date Approved Test Engineer 1

2 1.Document Introduction This document describes how we conduct the environment conditions and test procedure. It includes the test equipment we use,the test condition,and the test procedure we take. We also define our test criteria and the way to conclude the test result. (According to client s test specification, please see following sheets in detail.) Table of Testing Summary Results NO Test Item Condition Description Sect. / Page 1 Thermal Profile -Operating Test -Thermal Cycle: 30/40/55 ± 2 o 4 C -Every stage of 2 Hours / 5 Reference to IEC

3 2. Product Configuration 1. M/B:Winmate / I CPU:Intel_Celeron_M_1.0GHz_400MHz 3. RAM:Transcend / 1GB DDR / SAMSUNG K4H510838D-UCCC / 400MHz 4. HDD:Seagate / ST940813AM / 40GB / IDE 5. DVD-ROM:No 6. Card+Reader with Floppy: No 7. LCD:No 8. MiniPCI to COM Port Module:PER-C40C-A10 9. Power Board:IRTDB Adapter:LI SHIN / 0226B24160 / OUTPUT:24V / 6.67A 11. Heat sink :Yes (On CPU) / Yes ( On Intel 855GME Chipset) / Yes ( On Intel ICH4 Chipset) 12. CPU FAN :No 13. System Fan:No 14. EUT of stage:prototype Sample Version SBC Specifications : Processor BIOS System Chipset Memory Slot Graphic Chipset KB / Mouse Ethernet USB Ports Serial Ports Intel Pentium M 1.4GHz / Celeron M 1.0GHz Processor Award 4Mbit Flash Intel 855GME / ICH4 Chipset 1 x DIMM, Max 1GB DDR 333 (1GB Default) Integrated in Intel 855GME 2 x PS/2 2 x RJ-45 GigaLAN 6 x USB ports, USB 2.0 compliant 3 x RS232,1 x RS-232/422/485 3

4 3. Product Configuration of Photo EUT of Photo Top View Bottom View Front View Back View Side View Side View 4

5 4. Thermal Profile Test A. Test Equipment: Test Site: Winmate LAB Programmable Temperature & Humidity Chamber Kson / THS-G4T-100 / S/N: 5887K YOKOGAWA / µr20000 / SN: S5F Display : ViewSonic / VX2235wm (SN:QA ) B. LAB Environmental Conditions: Ambient Temperature :25 +/- 3 o C Relative Humidity :55 +/- 20% RH C. Test Method / Specification : Reference to IEC Thermal Cycle: 30 /40 /55 ±2 AC Power : 110/220 VAC, 60/50Hz Running Windows XP with Stress software BCM Diagnostics Pro Version 2.30 Quantity : Total 1 Set Testing Period: July 9, 2008 to July 9,2008 Figure 1:High temperature thermal cycle 5

6 D. Check Condition and Requirements: It is to check the thermal profile of the test unit,and also test unit can work under different environment temperature condition. The highest temperature /position, lowest temperature /position and the average temperature value will be display at the thermal profile record. The equipment in its high temperature mode, shall exposed to daily high-low temperature cycles between 30 o C 40 o C and 55 o C.The equipment shall withstand the required environmental conditions and shall meet, without any functional damage, all performance requirements after being exposed to 1 cycles of high temperatures, as illustrated in Figure1. E. Test Result: Examine the appearance of specimen(s) by visual check and perform functional check after this test. Connect the specimen with rated power then examine whether the display function of specimen could be work normally or not. Functional Check & Mechanical Structure : Normal Appearance check(visual check) :No visible damage (Add the CPU Thermal Pad 37*35 mm to Top Case, North of bridge Thermal Pad 38*37 mm to Top Case, Power Board : IRTDB-110 Thermal Pad 60*58 mm to Top Case, HDD Thermal Pad 60*60 to Bottom Case) Temperature of Test Point: Temperature rise of part : CPU:Intel_Celeron_M_1.0GHz_400MHz Heat sink North of bridge chip Heat sink South of bridge chip Heat sink RAM:Transcend / 1GB DDR / 400MHz Seagate / ST940813AM / 40GB / IDE Power Board : IRTDB-110 Heat sink MiniPCI to COM Port Module / U Enclosure inside Ambient (Right) Enclosure inside Ambient (Left) Enclosure inside near up Enclosure outside near middle Ambient Temperature Note: The table shows the examine of system health status. In comparison with the component spec, the examine result will be minor inconsistency. Although the temp is a bit overheating, it s still in tolerating ranges and working properly. 6

7 Temperature records for test points from Data Logger. 7

8 (1) Temperature Point of Number Description Back (2) Temperature Point of Number Description 5 8

9 (3) Temperature Point of Number Description 10 (4) Temperature Point of Number Description 11 9

10 (5) Temperature Point of Number Description 12 Ambient NOTE: 12-Ambient in Chamber F. Test Judgment: Test Result as below: Check Item Appearance check (Visual check) Functional & Style Item No. Initial Final Performance check Rugged BOX PC : I570EAC-201 No visible damage No visible damage Normal 10