BYD Microelectronics Co.,Ltd. Finger-Sensing Pad Product DataSheet BTPS6740DN2UA

Transcription

1 BYD Microelectronics Co.,Ltd Finger-Sensing Pad Product DataSheet BTPS6740DN2UA DATASHEET TS-TPM-PD-0005A/0 Page 1of 9

2 General Description The BTPS6740DN2UA is an enhanced version of the Finger-Sensing Touchpad. It supports normal mouse operations, including Tap, Double Tap, Scroll, Tap & Drag and movement. The core technology of the pad module is a capacitive based controller IC. When a finger is moving on the pad surface, the IC will begin to monitor the finger activities and send that information back to the host system to the map screen cursor movements. To move cursor, the user can just lightly slide on the device surface above where Finger-Sensing Pad is mounted as shown in Figure1. TouchPad Features 1. Hardware and device driver Figure 1. Finger Sensing Pad Compatible with Windows 2000/XP mouse driver and Linux operating system PS/2 interface Provides smooth and reliable finger detection Low fatigue pointing action Low power consumption Relative XY coordination support Configurable device mounting orientation Light weight Supports normal mouse operations, including Tap, Double Tap, Scroll, Tap & Drag and movement Optimized parameters 2. Data Packet The BTPS6740DN2UA is compatible with standard PS/2-compatible mouse and Microsoft IntelliMouse (3button wheel mouse). By default, the device runs in PS/2-compatible mouse mode. The packet information is listed below as following: DATASHEET TS-TPM-PD-0005A/0 Page 2of 9

3 PS/2-compatible Mouse (3 bytes) BTPS6740DN2UA Byte Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Comment Byte1 Y X Y X X/Y overflows and signs, 1 M R L over over sign sign buttons Byte2 X7 X6 X5 X4 X3 X2 X1 X0 Delta X data byte Byte3 Y7 Y6 Y5 Y4 Y3 Y2 Y1 Y0 Delta Y data byte IntelliMouse-compatible 3-button Wheel Mouse Byte Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Comment Byte1 Y X Y X X/Y overflows and signs, 1 M R L over over sign sign buttons Byte2 X7 X6 X5 X4 X3 X2 X1 X0 Delta X data byte Byte3 Y7 Y6 Y5 Y4 Y3 Y2 Y1 Y0 Delta Y data byte Byte4 Z7 Z6 Z5 Z4 Z3 Z2 Z1 Z0 Z/wheel data byte BTPS6740DN2UA Specifications 1. Physical Specifications PCB Thickness 0.9±0.1mm Adhesive Thickness 0.13mm(3M468MP) Width 67.00±0.25mm Height 40.00±0.25mm Bezel Opening Width 64.60±0.25mm Bezel Opening Height 37.60±0.25mm Connector Thickness 1.96mm Weight 7g 2. Electrical Specifications Contents Description Min Typ Max Conditions Supply Voltage V Current Consumption 3.3 ma Input High Voltage V Input Low Voltage V Min.Output High Voltage 2.4 V Operating Temperature C Operating Humidity 5%~95%RH Storage Temperature C Module ESD 15 kv ESD (No error) 10kV, No Error 10kV IEC801-2Level4 DATASHEET TS-TPM-PD-0005A/0 Page 3of 9

4 ESD (No damage) 15kV, No Damage 15kV IEC801-2Level4 Static Load 9.8 N Shock Resistance 80g/11ms,Half-sine IEC Vibrations Hz, 0.015g 2 /Hz, -6dB/oct in 200Hz-500Hz IEC Tapping 1 million cycles 2.45N(250gf) Abrasion 1 million cycles 0.49N(50gf) Physical Dimensions 1. PCB LAYER Designs should be held within the physical dimensions shown in the figures below. All dimensions are in millimeters (mm). Figure 2. Sensor -- Top View Figure 3. Side View IC Component Area Ground Ring 33.5 Connector DATASHEET TS-TPM-PD-0005A/0 Page 4of 9

5 Module Orientation Figure 4. Component -- Bottom View In the following figures, the arrow indicates the direction of the user s finger movement. Figure 5. Sensor - Top View - Up Orientation Figure 6. Sensor - Top View - Down Orientation DATASHEET TS-TPM-PD-0005A/0 Page 5of 9

6 3. Connector Information Figure 7. Module Connector J1-Reference Drawing Figure 8. Dimensions of 12-pin 0.5mm pitch FFC/FPC Cable 4. J1 Pin Assignments and Definitions In this model a 12-pin connector with 0.5mm-pin pitch is applied. The following table lists the pin assignment information. Please refer to the mechanical drawing page for detail connector drawing. Connector Information (showed as Figure 7) Table 1: BTPS6740DN2UA Module Pin Pin Number Pin Name Description Pin Number Pin Name Description 1 NC No connection 7 GND Ground 2 RBT Right button 8 GND Ground 3 LBT Left button 9 CLK PS/2 clock 4 NC No connection 10 DAT PS/2 data 5 NC No connection 11 VDD +5V power 6 NC No connection 12 VDD +5V power DATASHEET TS-TPM-PD-0005A/0 Page 6of 9

7 Packaging Max. capacity: 375 pieces module per carton Max. weight: (3.5) kg per carton Outside dimension of carton: X=420(L) mm* Y=242(W) mm* Z=290 (H) mm 75x5 pieces Z Y X Product Marking & Order Information The Product marking for the Finger-Sensing Pad Series is composed of two sections. The first section of the marking specifies the model name. The second part contains the information on the touch type, PCB size, connector Pin assignment, Mylar color, the external button numbers, connector pad orientation and version number. Table 2: Finger-Sensing Pad model name and marking template BYD TOUCHPAD X0 X1 X2 X3 X4 X5 X6 B T P S 6740 D N 2 U A BTP: BYD TouchPad Module Name X0, X1: define finger-sensing type and PCB size X2: defines connector Pin assignment. Please refer to Table1 for details X3, X4: define Mylar color and the external button numbers. X5: defines connector pad orientation. Please refer to Figure 5 and Figure 6 for details X6: defines version number DATASHEET TS-TPM-PD-0005A/0 Page 7of 9

8 ENVIRONMENTAL SPECIFICATION BTPS6740DN2UA 1. Low Temperature Functional Test -40 C, Relative Humidity, >=2hrs 2. High Temperature Functional Test +60 C, 65±10%RH, >= 2 hrs 3. Low Temperature Storage Test -40 C, 65±10%RH, 96 hours (the sample shall be left in standard conditions for at least 2 hours before measurements are made). 4. High Temperature Storage Test +70 C, Relative Humidity, 96 hours (the sample shall be left in standard conditions for at least 2 hours before measurements are made). 5. High Temperature and High Humidity Functional Test +60 C, 95%RH, 96hours (water drops shall be removed before measurements are made). 6. High Temperature and High Humidity Storage Test +60 C, 95%RH, 96 hours (the sample shall be left in standard conditions for at least 2 hours before measurements are made). 7. Temperature Cycling Test -40 C/ +70 C, 100 cycles, 6 hrs/cycle (-40 C: 2hrs, from -40 C to +70 C :1 hr, +70 C: 2 hrs, from +70 C to -40 C : 1 hr/cycle ) (The sample shall be left in standard conditions for at least 2 hours before measurements are made). 8. ESD Test Refer to IEC 801-2( ): Up to 10 kv No errors (use proper ESD mounting) Up to 15 kv No damage (use proper ESD mounting) Failure criteria: Error: temporary degradation or loss of function which requires operator intervention or system reset. Damage: degradation or loss of function which is not recoverable due to damage of equipment or some of its components. DATASHEET TS-TPM-PD-0005A/0 Page 8of 9

9 9. Shocks 80g /11ms, Half-Sine pulse, +/-X +/-Y +/-Z (6 directions), 3 shocks/direction. 10. Vibrations Hz, 0.015g 2 /Hz, -6dB/oct in 200Hz -500 Hz, Random wave, X Y Z(3 axes), 2hrs/axis IEC Tapping 2.45N(250gf), 1million times. An artificial rubber finger is used, tapping the same spot at rate of taps/minute. The artificial finger for tapping test should have the following characteristics: Material: Rubber of 45deg Shore D hardness Finger height: H = 10 mm min. Finger diameter: D = 9 ± 1 mm Contact diameter: C = 8 ±1 mm 12. Abrasion 0.49N(50gf), 1million cycles. An artificial finger is used, moving diagonally back and forth on the pad at a rate of cycles/minute. The information of artificial finger is described in "tapping" section. Certificates Certificate List Certificate Serial Number Logo CE B-E FCC DATASHEET TS-TPM-PD-0005A/0 Page 9of 9