Treatment Instructions for WEEE

Transcription

1 Motion Computing Page 1 of 20 TI C TABLET PC. Brand Owner Identification Motion Computing, Inc RR 222, Building II Austin, Texas Product Identification Product Name Part Number Mass of Product Dimensions of Product C Tablet PC C 3.3 lbs, measured with a 40 WHr Battery x 10.0 x 0.9 (or 26mm x 26mm x 24.3mm) 2007

2 Motion Computing Page 2 of 20 TI C TABLET PC Revision Date Revised By Description of Changes 1 Sept. 14, 2007 Brody Mitchell Started Initial Draft 2 Sept. 17, 2007 Brody Mitchell Entered Photos and labeled Exploded views. 3 Sept 18, 2007 Stephen Clark Entered Annex II and Materials info. 4 Sept 2, 2007 Brody Mitchell Updated Annex II and Materials info. Sept 27, 2007 Mike Fry Review - Approved

3 Motion Computing Page 3 of 20 TI C TABLET PC Photos of Product Front Photos of Product Back

4 Motion Computing Page 4 of 20 TI C TABLET PC Photos of Product Main Exploded view of Upper Casing Item Subassembly 1 Camera Module 2 Bar Code Reader Switch 3 Bar Code Reader 4 Bridge Battery Thermal Module 6 WLAN Adaptor 7 Real Time Clock Battery 8 HDD PATA 9 RAM

5 Motion Computing Page of 20 TI C TABLET PC Photos of Product Exploded View (Main Board in Upper Casing) Item Subassembly 10 Inverter Board 11 Main Board 12 DC Input Board 13 Digitizer 22 Cabling 2007

6 Motion Computing Page 6 of 20 TI C TABLET PC Photos of Product Exploded View (LCD display in Upper Casing) Item Subassembly 14 Front Button 1 Docking 16 Blootooth Module 17 LCD Assembly

7 Motion Computing Page 7 of 20 TI C TABLET PC Photos of Product Exploded View (Lower Casing) Item Subassembly 18 Fan Assembly 19 Speaker Assembly 20 Fingerprint Reader Board 21 Housing 22 Main Battery

8 Motion Computing Page 8 of 20 TI C TABLET PC Photos of Product Sub Assemblies: 1. Camera Module 2. Bar Code Reader 3. Bar Code Switch 4. Bridge Battery

9 Motion Computing Page 9 of 20 TI C TABLET PC Photos of Product Sub Assemblies:. Thermal Module 6. WLAN Adaptor 7. Real Time Clock Battery 8. HDD PATA

10 Motion Computing Page 10 of 20 TI C TABLET PC Photos of Product Sub Assemblies: 9. RAM 10. Inverter Board 11. Main Board

11 Motion Computing Page 11 of 20 TI C TABLET PC Photos of Product Sub Assemblies: 12. DC Input Board 13. Digitizer 14. Front Button

12 Motion Computing Page 12 of 20 TI C TABLET PC Photos of Product Sub Assemblies: 1. Docking 16. Bluetooth Module 17. LCD Assembly

13 Motion Computing Page 13 of 20 TI C TABLET PC Photos of Product Sub Assemblies: 18. Fan Assembly 19. Speaker Assembly 20. Fingerprint Reader Board 21. Housing

14 Motion Computing Page 14 of 20 TI C TABLET PC Photos of Product Sub Assemblies: 22. Main Battery

15 Motion Computing Page 1 of 20 TI C TABLET PC Reportable Materials per Article 4 of Council Directive 7/442/EEC and with Annex II(2) of the WEEE Directive. Material Item Location Polychlorinated biphenyl () containing capacitors and all Polychlorinated terphenyl (PCT) containing electrical equipment Mercury containing components such as switches or backlighting lamps Batteries & Accumulators Printed circuit boards of mobile phones generally, and of other devices if the surface of the printed circuit board is greater than 10 cm 2 Ink cartridges & Toner cartridges, liquid and pasty, as well as colour toner Plastic containing brominated flame retardants Asbestos waste and components which contain asbestos 17 LCD Assembly Back Light Lamp Bridge Battery Real Time Clock Battery Main Battery Bar Code Switch WLAN Adaptor RAM HDD PATA Main Board DC Input Board Front Button Docking Bluetooth Module LCD Assembly Fingerprint Reader Board Cathode ray tubes

16 Motion Computing Page 16 of 20 TI C TABLET PC Chlorofluorocarbons (CFC), Hydrochlorofluorocarbons (HCFC), Hydrofluorocarbons (HFC)or, Hydrocarbons (HC) Gas discharge lamps Liquid crystal displays (together with their casing where appropriate) of a surface greater than 100 cm 2 and all those back-lighted with gas discharge lamps External electric cables Components containing radioactive substances, or materials that become radioactive as a result of the function of the product, such as ionizing radiation Electrolytic capacitors containing substances of concern (height > 2 mm, diameter > 2 mm or proportionately similar volume) Equipment containing gases that are ozone-depleting or have a global warming potential (GWP) about 1, such as those contained in foams and refrigeration circuits Ammonia-water solutions containing chromium VI (Hexavalent Chromium) in the case of absorption refrigerators Any other liquid, such as oils and acids in particular Components containing refractory ceramic fibers Photo-conducting drums containing cadmium or selenium 17 LCD Assembly LCD 21 Housing

17 Motion Computing Page 17 of 20 TI C TABLET PC Materials of Interest to Recyclers Material Item Location Non-ferrous Alloys 21 Thermal Module (Al) Housing Heat Shield (Al) Brackets (Al) Main Board Frame (Al) Ferrous Alloys 21 Housing Docking Station Support Bracket/Connector (CRS) Hardware (CRS) ABS 18 Fan Assembly Fan Blades Polyethylene Terephthalate (PETE or PET) or not at an appreciable level High-Density Polyethylene (HDPE) or not at an appreciable level Polyvinyl Chloride (PVC) 22 Cabling Cable Sheathing Low-Density Polyethylene (LDPE) or not at an appreciable level Polypropylene (PP) Polystyrene (PS) Other plastics, (e.g. acrylic; polycarbonate; nylon; fiberglass) or not at an appreciable level or not at an appreciable level Bar Code Switch (Fiberglass) WLAN Adaptor (Fiberglass) HDD PATA (Fiberglass) RAM (Fiberglass) Main Board (Fiberglass) DC Input Board (Fiberglass)

18 Motion Computing Page 18 of 20 TI C TABLET PC Front Button (Fiberglass) Docking (Fiberglass) Bluetooth Module (Fiberglass) LCD Assembly (Fiberglass) Fingerprint Reader Board (Fiberglass) Housing Upper and Lower (Mylar) Main Battery Battery Cover (Mylar)

19 Motion Computing Page 19 of 20 TI C TABLET PC Precious Metals Material Item Location Copper (Cu) 3 Gold (Au) Palladium (Pd) Platinum (Pt) Silver (Ag) Bar Code Switch (Circuit Etch) Thermal Module WLAN Adaptor (Circuit Etch) HDD PATA (Circuit Etch) RAM (Circuit Etch) Main Board (Circuit Etch) DC Input Board (Circuit Etch) Front Button (Circuit Etch) Docking (Circuit Etch) Bluetooth Module (Circuit Etch) LCD Assembly (Circuit Etch) Fan Assembly Copper Windings Fingerprint Reader Board (Circuit Etch) Housing Copper Foil Cabling Copper Wire or not at an appreciable level or not at an appreciable level 22 Housing Copper Foil or not at an appreciable level

20 Motion Computing Page 20 of 20 TI C TABLET PC RoHS Restricted Materials * Material Item Location Cadmium (Cd) Hexavalent Chromium (Cr VI) Lead (Pb) * Mercury (Hg) * Polybrominated Biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) All units are shipped RoHS compliant and contain Lead (Pb) or Mercury (Hg) only when specifically exempted from Directive 2002/9/EC (RoHS) RoHS Exemption 4: Mercury in other lamps not specifically mentioned in this Annex. RoHS Exemption : Lead in glass of cathode ray tubes, electronic components and fluorescent tubes RoHS Exemption 6c: Lead as an alloying element in copper containing up to 4% lead by weight RoHS Exemption 7a: Lead in high melting temperature type solders (i.e. lead based solder alloys containing 8 % by weight or more lead) RoHS Exemption 7c: Lead in electronic ceramic parts (e.g. piezoelectronic devices)