Treatment Instructions for WEEE By: Ageus Solutions

Transcription

1 Motion Computing Page 1 of 15 Motion Computing LE100 June 18, 200 Brand Owner Identification Motion Computing, Inc RR 222, Building II Austin, Texas Identification Name Part Number Mass of Dimensions of Motion Computing LE100 LE kg with standard battery, 1.90 kg with extended life battery w: 240 mm x h: 296 mm x d: mm 200

2 Motion Computing Page 2 of 15 Motion Computing LE100 June 18, 200 Revision Date Revised By Description of Changes 1 May 29, 200 Brody Mitchell Started initial draft 2 May 31, 200 Stephen Clark Entered photos 3 June 5, 200 Brody Mitchell Entered photos and labeled subassemblies 4 June 6, 200 Stephen Clark Formatting 5 June 8, 200 Brody Mitchell Added Annex II, Materials, and top photos 6 June 13, 200 Andrea Chekmar Document Formatting June 18, 200 Mike Fry Document Review - Approved 200 2

3 Motion Computing Page 3 of 15 Motion Computing LE100 June 18, 200 Top Bottom 200 3

4 Motion Computing Page 4 of 15 Motion Computing LE100 June 18, 200 Exploded View Item Subassembly 1 Batteries: Lithium Ion Battery Pack 2 Accessories: Antenna Assembly 3 BIOS Board 4 Wireless Card 5 WWAN Card 6 Hard Drive Assembly DDR2 RAM 200 4

5 Motion Computing Page 5 of 15 Motion Computing LE100 June 18, 200 Exploded View Item Subassembly 2 Accessories: Antenna Assembly 8 Cabling 15 LCD Assembly 16 Wacom Digitizer 1 Mic Assemblies PCB's 200 5

6 Motion Computing Page 6 of 15 Motion Computing LE100 June 18, 200 Exploded View Item Subassembly 2 Accessories: Bluetooth Assembly 9 Fan Assembly 10 Speaker Assembly (2) 200 6

7 Motion Computing Page of 15 Motion Computing LE100 June 18, 200 Exploded View Item Subassembly 11 Motherboard 12 Docking PCB 13 CPU Thermal Module 200

8 Motion Computing Page 8 of 15 Motion Computing LE100 June 18, 200 Produc Sub Assemblies: Batteries (2 of 3) [Third Bat. (Lithium Ion Battery Pack) is located on rear of back housing, as Exploded View 1 will show] 1 Item Subassembly 1 Batteries: Slab 8 Cell Battery, and Bridge Battery 200 8

9 Motion Computing Page 9 of 15 Motion Computing LE100 June 18, 200 Sub Assemblies: Housing (Front) 200 9

10 Motion Computing Page 10 of 15 Motion Computing LE100 June 18, 200 Sub Assemblies: Housing (Rear)

11 Motion Computing Page 11 of 15 Motion Computing LE100 June 18, 200 Reportable Materials per Article 4 of Council Directive 5/442/EEC and with Annex II(2) of the WEEE Directive. Material Item Location Polychlorinated biphenyl (PCB) containing capacitors and all Polychlorinated terphenyl (PCT) containing electrical equipment Mercury containing components such as switches or backlighting lamps 15 LCD Assembly: Back Lighting Lamps Batteries & Accumulators 1 Batteries (3) Lithium Ion Battery Pack Slab 8 Cell Battery Bridge Battery Printed circuit boards of mobile phones generally, and of other devices if the surface of the printed circuit board is greater than 10 cm 2 Ink cartridges & Toner cartridges, liquid and pasty, as well as colour toner Plastic containing brominated flame retardants Asbestos waste and components which contain asbestos BIOS Board Wireless Card WWAN Card Hard Drive Assembly PCB DDR2 RAM Motherboard Docking PCB Mic Assembly PCBs (3) Cathode ray tubes Chlorofluorocarbons (CFC), Hydrochlorofluorocarbons (HCFC), Hydrofluorocarbons (HFC)or, Hydrocarbons (HC) Gas discharge lamps Liquid crystal displays (together with their casing where appropriate) of a surface greater than 100 cm 2 and all those back-lighted with gas discharge lamps External electric cables 15 LCD Assembly

12 Motion Computing Page 12 of 15 Motion Computing LE100 June 18, 200 Components containing radioactive substances, or materials that become radioactive as a result of the function of the product, such as ionizing radiation Electrolytic capacitors containing substances of concern (height > 25 mm, diameter > 25 mm or proportionately similar volume) Equipment containing gases that are ozone-depleting or have a global warming potential (GWP) about 15, such as those contained in foams and refrigeration circuits Ammonia-water solutions containing chromium VI (Hexavalent Chromium) in the case of absorption refrigerators Any other liquid, such as oils and acids in particular Components containing refractory ceramic fibers Photo-conducting drums containing cadmium or selenium

13 Motion Computing Page 13 of 15 Motion Computing LE100 June 18, 200 Materials of Interest to Recyclers Material Item Location Non-ferrous Alloys 1 CPU Thermal Module (Aluminum) Ferrous Alloys ABS Polyethylene Terephthalate (PETE or PET) High-Density Polyethylene (HDPE) Housing: Hardware (CRS), Docking Station Connector/Bracket (CRS) Hard Drive Holder (CRS) LCD Brackets L/R (CRS) or not at an appreciable level or not at an appreciable level or not at an appreciable level Polyvinyl Chloride (PVC) 8 Cabling Sheathing Low-Density Polyethylene (LDPE) or not at an appreciable level Polypropylene (PP) Polystyrene (PS) Other plastics, (e.g. acrylic; polycarbonate; nylon; fiberglass) or not at an appreciable level or not at an appreciable level BIOS Board Wireless Card WWAN Card Hard Drive Assembly DDR2 RAM Fan Assembly Housing (PC), Fan Blade (PC) Motherboard Docking PCB Mic Assembly PCBs (3) Housing (Front) Main chassis (PC + ABS)

14 Motion Computing Page 14 of 15 Motion Computing LE100 June 18, 200 Precious Metals Material Item Location Copper (Cu) Gold (Au) Palladium (Pd) Platinum (Pt) Silver (Ag) BIOS Board: IC Chip, Circuit Etch Wireless Card: IC Chip, Circuit Etch DDR2 RAM: IC Chip, Circuit Etch Cabling: Copper Wire Motherboard: IC Chip, Circuit Etch CPU Thermal Module: Thermal Module LCD Assembly: Upper Bezel Stand-off Mic Assembly PCBs (3): Circuit Etch BIOS Board: IC Chip Wireless Card: IC Chip DDR2 RAM: IC Chip Motherboard: IC Chip or not at an appreciable level or not at an appreciable level BIOS Board: IC Chip Wireless Card: IC Chip DDR2 RAM: IC Chip Motherboard: IC Chip

15 Motion Computing Page 15 of 15 Motion Computing LE100 June 18, 200 RoHS Restricted Materials * Material Item Location Cadmium (Cd) Hexavalent Chromium (Cr VI) Lead (Pb) * Mercury (Hg) * Polybrominated Biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) All units are shipped RoHS compliant and contain Lead (Pb) only when specifically exempted from Directive 2002/95/EC (RoHS) RoHS Exemption 4: Mercury in other lamps not specifically mentioned in this Annex. RoHS Exemption 5: Lead in glass of cathode ray tubes, electronic components and fluorescent tubes RoHS Exemption 6c: Lead as an alloying element in copper containing up to 4% lead by weight RoHS Exemption a: Lead in high melting temperature type solders (i.e. lead based solder alloys containing 85 % by weight or more lead) RoHS Exemption c: Lead in electronic ceramic parts (e.g. piezoelectronic devices)