Advanced CSP & Turnkey Solutions. Fumio Ohyama Tera Probe, Inc.

Transcription

1 Advanced CSP & Turnkey Solutions Fumio Ohyama Tera Probe, Inc.

2 Tera Probe - Corporate Overview 1. Company : Tera Probe, Inc. 2. Founded : August, Capital : Approx. USD118.2 million (as of March 2013) 4. Annual Sales Revenue : Approx. USD213 million (as of March 2013) 5. Trading Customers : Over 80 majors in Japan & Overseas 6. Business : Back-End Turn-key Service Wafer Level Package(WLP) & BUMP Test Business (WT, FT, BT, and others) Engineering services(wlp,bump.test) 7. Employees : 670 Group Total (as of March 2014)

3 Tera Probe Facility Sites WLP/BUMP Site WLP/BUMP Processing Ome Test Sites Hiroshima Office Headquarters Focusing on DRAM & Other Memory Kyushu Subsidiary in Taiwan Focusing on SOC, CIS, Analog and other devices

4 Backend Turn-key Service

5 What is WLP? IC Die Package WLP is a packaging technology processing on wafer and dicing in each pkg. level WLP is CSP (Chip Size Package) It is exact chip size with ultra thin and small On-wafer IC packaging WLP realizes 1/10 footprint compared to QFP. QFP BGA WLP

6 Tara Probe s Advanced WLP Structure Solder Ball Terminal - High precision - Void-free - Tough material for drop shock & Temp cycling Encapsulation (Epoxy base resin) - Lower stress - Good adhesion to Repassivation & Copper Copper Post Copper Redistribution Line - Thick electro plating copper Semiconductor Substrate (Si, SiGe, GaN, Other) Repassivation - Surface planarization - Protection against mechanical process stress Features Ultra thin type, ultra miniature, lightweight High reliability High electrical current density & Good heat dissipation Excellent protection Assembly with conventional SMT Suitable for embedding Flat WLP surface Copper-to-copper interconnection Safe protective construction

7 WLP Cross Section 3) Epoxy 4) Cu Redistribution 2) Cu Post 1) Solder Terminal 5) Insulation Layer (PI) 6) Silicon 2) Cu Post Substrate WLP Type Standard Type Thin Type 1) Solder Terminal Height [μm] (Max.) 2) Cu Post Diameter [μm] ) Epoxy Thickness [μm] 6) Silicon Substrate ) Cu Redistribution Line / Space [μm] (Min.) 10 / 10 5) PI Thickness [μm] ) Body Thickness (Silicon + Epoxy) [μm]

8 Sample Photo of WLP with Pad, Re-Wiring & Cu Post Pad Re-Wiring Cu Post

9 WLCSP Unit Forecast(by end equipment type)

10 Applications for WLP usage

11 Current Mounting technology of WLP products and direction How is WLP used in Smart phone inside?

12 Status of WLP usages in a major smart phone manufacturer

13 An Example of WLP usage in system board of Cell phone

14 Comparison of WLP usage (2011 vs. 2013)

15 WLP Comparison of Main Board Main Board -> Shrinking / LSI -> Increasing / WLP->Increasing More than 50%

16 WLP usage trend Usage trend in Chip size, Pin numbers Pin Count WLP usage area (FCBGA) 2011(FCBGA) 2011(FCBGA) PKG Size (mm ) WLP PKG Size & Pin # are increasing year by year Some WLPs have been replaced from FCBGA

17 A trend of WLP usage WLP usage in device trend(major smart phone maker) Antenna SW NAND Flash DRAM RF Power Amp RF Transceiver WLP Baseband P.M. for RF WLP Application Processor Wifi/BT/FM Co Processor WLP Gyroscope Accelerometer Power Management Audio Codec WLP Touch Screen Controller WLP Electric Compass WLP

18 Conclusion There are differences in cell phone type and by manufactures though. WLP usage is surely increasing about 30%-50% in major smart phone players. By year 2012, WLP usage trend is in certain chip size and pin numbers. However, from Year 2013, WLP has been used in larger chip size and pin numbers. This means WLP is expanding in more type of LSI.

19 WLP is expecting to be : Larger die & large pin counts WLP will be used in more type of LSI Fine process technology with Low-K devices High current and Power device application

20 WLP (Wafer Level Package)

21 Cu Pillar /Micro Bump for Flip Chip

22 ewlp(embedded Wafer Level Package)

23 Application for ewlp

24

25 WLP Simulation Model RDL Copper Post RDL UBM Solder Bump PCB Land PCB Wire Current direction 1A TeraWLP simulation model Solder Bump PCB Land PCB Wire Current direction 1A Other WLP simulation model Current direction

26 Summary

27 Summary It should be selected appropriate WLP!! Important thing is how to select a right WLP structure in order to fit in requirement of IC Chip specification

28 ATTENTION This material contains confidential information and it is hereby notified that any disclosure, copying, distribution, or the taking of any action in reliance on the contents of this material is strictly prohibited without a prior written consent of Tera Probe. Thank you very much for your understanding in advance.