Dr. Javier Santillan, San Carlos, CA

Transcription

1 X-ray diffraction as a tool for automated residual st ress analysis & a non-synchrotron based nanofocus x-ray computed tomography technique for materials characterization and metrology Dr. Javier Santillan, San Carlos, CA Rainer Stabenow, Ahrensburg (Germany) Mathias Klatt, Ahrensburg (Germany) Alfried Haase, Ahrensburg (Germany) Dr. Oliver Brunke, Wunstorf (Germany)

2 Contents 1. The purpose of non-destructive testing by X- ray in electronics 2. Principles of X-ray inspection and of Computed Tomography 3. Applications 4. Introduction to XRD in Stress Analysis 5. Summary 2

3 Contents 1. The purpose of non-destructive testing by X- ray in electronics 2. Principles of X-ray inspection and of Computed Tomography 3. Applications 4. Introduction to XRD in Stress Analysis 5. Summary 3

4 The purpose of NDT by X-ray in electronics 1. Production control without damaging products 2. Failure analysis before to or instead of using destructive methods (which might destroy the defect signature) 3. Monitoring the changes in devices during reliability test 4

5 Contents 1. The purpose of non-destructive testing by X- ray in electronics 2. Principles of X-ray inspection and of Computed Tomography 3. Applications 4. Introduction to XRD in Stress Analysis 5. Summary 5

6 Principles of X-ray Inspection System parts Change magnification via Z axis 6

7 Resolution Focal spot size F G 2 µm bars 2 µm bars 0.6 µm bars F 2.5 µm F 1.5 µm F < 0.8 µm The smallest visible pattern period G is a measure for the focal spot size F. 7

8 Resolution Detail detectability is not a reliable measure for the focal spot size 5 µm 500 nm 5 µm 500 nm F 2,5 µm F < 0,8 µm The so called detail detectability is remarkably smaller than the resolution / focal spot size. 8

9 Principles of X-ray Inspection Contrast or what is displayed in the X-ray image? Differences in material Differences in density Differences in thickness Sensitivity: Minimum intensity or thickness variation image intensifer chain > 2,0 % flat panel detector > 0,5 % 9

10 Principles of X-ray Inspection Geometrical magnification Weights out the limited resolution of radiographic films and detectors Geometric magnification: M=FDD/ FOD 10

11 Application Gold bond wires 0.7 mil 2D image nanofocus contrast enhancement The high absorption of gold gives excellent contrast of the wires. 11

12 Application Copper bond wires 2D image nanofocus Tilt view via detector tilt contrast enhancement Inspection may be performed in usual tilt view angle. 12

13 Application short circuit 2D image nanofocus contrast enhancement Short between two lead frames cased by etching error. 13

14 Application Flip Chips 30 µm 2D image nanofocus 500 nm contrast enhancement Defects in the micrometer range are displayed. 14

15 Volume-CT Principle of operation CT is based on a set of X-ray images taken while rotating the sample by

16 Volume-CT back projection real projection inversion filter line profile backprojection The backprojection reconstructs the density distribution. 16

17 Contents 1. The purpose of non-destructive testing by X- ray in electronics 2. Principles of X-ray inspection and of Computed Tomography 3. Applications 4. Introduction to XRD in Stress Analysis 5. Summary 17

18 Application Gold bond wires (LED) 2D image nanofocus contrast enhancement The small gap between land and ball bond indicates that the ball bond is slightly lifted. 18

19 Application Gold bond wire (LED) nanoct animated 3D visualisation pseudo colours Demonstration of CT resolution. 19

20 Application Ceramics ferrite nanoct visualisation in pseudo colours Overview: The conductor layers and vias are displayed 20

21 Application Ceramics ferrite nanoct tomographic slice Detection and localisation of a conductor damage. 21

22 Application Molding void 0.81mm nanoct tomographic slice Detection & localisation of moulding void. 22

23 Application Memory cube (3D-Plus) microct animation in pseudo colours 23

24 Application examples Memory cube (3D-Plus) 2D CT 2D microfocus image and microct visualisation in pseudo colours The glue layers overlapping in the 2D image are separated by CT and may be individually inspected and evaluated. 24

25 Application 2D image nanofocus Voiding in TSV Customer Sample contrast enhancement 55 tilt view of TSV. A via is not totally filled with copper. 25

26 Application Nano CT Customer Sample visualisation in pseudo colours Software simulate the cross section to voiding. 26

27 Application Nano CT Customer Sample visualisation in pseudo colours 3D visualisation of BGA balls, upper and bottom balls can be separately inspected. 27

28 Application Nano CT Sample provided by visualisation in pseudo colours Zoom in view of BGA balls, upper and bottom balls can be separately inspected. 28

29 Application Open balls Nano CT Customer Sample tomographic slice Tomographic slice simulates the cross section of the sample, open BGA balls can be detected visually. 29

30 CT for Metrology 1. CAD Data 2. CT Volume data 3. Surface 4. Comparison Miniture chess rook Laser Stereolithography, Laserzentrum Hannover 2.09 mm 30

31 CT for Metrology 1. CAD Data 2. CT Volume data 3. Surface 4. Comparison Miniture chess rook Laser Stereolithography, Laserzentrum Hannover 2.09 mm 31

32 CT for Metrology 1. CAD Data 2. CT Volume data 3. Surface 4. Comparison Miniture chess rook Laser Stereolithography, Laserzentrum Hannover 2.09 mm 32

33 CT for Metrology 1. CAD Data 2. CT Volume data 3. Surface 4. Comparison Miniture chess rook Laser Stereolithography, Laserzentrum Hannover 2.09 mm 33

34 Reference Objects Back tracing to national material standards through calibration Arrangement of spheres as shown above (ruby-balls on CF-stick) 34

35 Cylinder head 3 cylinder engine Automatic wallthickness measurement pseudo colors wall thickness is displayed in colours 36

36 Cylinder head 3 cylinder engine Automatic wallthickness measurement pseudo colors wall thickness is displayed in colours 37

37 Cylinder head 3 cylinder engine measurements on volume data pseudo colors Fit of primitives measurment of distance, angle, radius, etc 38

38 Cylinder head 3 cylinder engine measurements on STL Data Tracing of exhaust channels Determination of cross sections along trace 39

39 Aluminum casting measurements by fitting primitives primitives may be fit to selected point or autoextraced via CAD based measuring strategy 40

40 Aluminum casting measurements by fitting primitives primitives may be fit to selected point or autoextraced via CAD based measuring strategy 41

41 Contents 1. The purpose of non-destructive testing by X- ray in electronics 2. Principles of X-ray inspection and of Computed Tomography 3. Applications 4. Introduction to XRD in Stress Analysis 5. Summary 42

42 X-RAY METHODS X-ray tube XRD Detector Diffraction Sample Sample Detector Absorption 43

43 X-RAY DIFFRACTION Polychromatic X-ray Diffraction LAUE Method Monochromatic X-ray Diffraction Method Braggs Law: nλ = 2d sin θ BRAGG s Law: nλ = 2d sin θ 44

44 XRD RESIDUAL STRESS ANALYSIS How to turn stress into measurable signals A B C A B C A B C A B C 2-Theta / 45

45 GENERATION OF RESIDUAL STRESS Often you get more than you wish Photo by Courtesy of KSA Shot Peening Centre Aachen Photo by Courtesy of MTU Aero Engines Munich Shot Peening induces residual stress and hardening in the surface of an Ariane 5 component High-speed milling of a blisk rotor at MTU AENA, e.g. for GE s CF-6-50 and GEnx compressor blisks 46

46 CHARON XRD STRESS ANALYZER HEAVY DUTY 47

47 GENERATION OF RESIDUAL STRESS Stress root causes Thin films Machining, peening Welding, case hardening Cladding, heat treating, quenching Forming, casting, extruding Location depths of defects Crack initiation Wear fatigue fracture distortion Buckling, creep Depth /mm 48

48 EVALUATION OF RESIDUAL STRESS Result: Compressive Stress of -714 MPa 49

49 FAST LINEAR DETECTOR Met eor 1D 50

50 CHARON XRD STRESS ANALYZER XXL 51

51 Summary X-ray inspection by using nanofocus tubes is capable to detect features or defects sub-micron range nanoct, i.e. CT based on nanofocus images yield submicron resolution in three dimensions, depending on the size of the sample. nanofocus X-ray inspection and nanoct partially can substitute or complement destructive methods nanofocus X-ray inspection and nanoct can be utilised to monitor the damage processes during reliability test. Metrology is an emerging application for CT The crucial measuring process in CT metrology is the acquisition of X-ray images on a defined scale. XRD systems with more degrees of freedom are enabling high-speed in situ analysis 52

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53 Contact GE Phoenix X-ray 1200 Industrial Road, Suite 1A San Carlos, CA