Job Deck and Schedule File Instructions

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1 Job Deck and Schedule File Instructions The instructions which determine how your pattern is applied to a wafer or other writing substrate, is determined by two files; the Job Deck file (.jdf) and the Schedule file (.sdf). The following pages in this document describe some example.jdf and.sdf files. For more complete explanations, please see Specifications for Express Jobdeck File Format.pdf and Specifications for Express Schedule File Format.pdf. Example Job Deck file hsq.jdf JOB/W 'HSQ',3 ; piece cassette PATH DEVIN ARRAY ( ,5,10000 )/( 20000,5,10000 ) ASSIGN P(1) -> ((*,*),SHOT1) AEND ARRAY ( ,5,10000 )/( 22000,5,10000 ) ASSIGN P(2) -> ((*,*),SHOT1) AEND PEND ; Layer Definition LAYER 1 P( 1 ) 'rm.v30' SPPRM 4.0,,,,1.0,1 P( 2 ) 'iso_dense2.v30' SPPRM 4.0,,,,1.0,1 STDCUR 0.1;100pA SHOT1: MODULAT ((0,-10),(1,0),(2,10),(3,20),(4,50),(5,100)) END 10/6/2014, Revision 2 page 1/7

2 The.jdf file above will now be explained, line by line. 1. ; This is a dummy line. ; Means that the line is a comment. 2. JOB/W 'HSQ',3 ; piece cassette JOB declares the beginning of the jobdeck file. /W specifies that writing will occur on a wafer or the piece cassette. Omit this if writing with mask cassette. 'HSQ' is just a label and does not have to match the jdf filename although often it does. The first character in the label must be a capital letter. The rest of the characters in the label can either be a number, a capital letter, or special characters ( such as _,%*- ) but cannot exceed 31 characters. 3 designates the size of the sample cavity in the cassette, in this case it means a 3 diameter, and controls the size of the circle displayed in array check. Use 2 for the piece cassette, or 4, 6, or 8, if using the 4, 6, or 8 wafer cassette. Use 5 or 6 if using the 5 mask or 6 mask cassette. 3. PATH DEVIN DEVIN is the PATH that defines what calibration routines to run before and periodically during pattern writing. The PATH is defined in the file /usr/users/eb0/ebtest/eb/prm/calib.men In this calib.men file are contained the following statements (there are more than these, these are just a subset for an example & brevity): DEVIN: INITIAL CURRNT,HEIMAP,INITBE,PDEFBE,SUBDEFBE CYCLIC CURRNT,DRIFT CYCLE 20M QUALF: INITIAL INITBE,PDEFBE,SUBDEFBE CYCLIC CURRNT CYCLE 20M RAGHU2: INITIAL HEIMAP CYCLIC CURRNT CYCLE 20M So for the particular PATH called DEVIN, the INITIAL command means that the the calibration routines CURRNT,HEIMAP,INITBE,PDEFBE,SUBDEFBE will be run before writing the pattern. The CYCLIC command means that the 10/6/2014, Revision 2 page 2/7

3 calibration routines CURRNT and DRIFT will be run every 20 minutes, as defined by the CYCLE 20M command, during pattern writing. For most jobs, it is recommend that INITBE,PDEFBE,SUBDEFBE be run on INITIAL and CURRENT be run on CYCLIC every 20M. This is how the PATH QUALF is defined above. 4. ARRAY ( ,5,10000 )/( 20000,5,10000 ) The ARRAY command allows a pattern to be placed as an array. The ARRAY command has the format ARRAY ( x, m, p ) / ( y, n, q ) where x = X-coordinate (in microns) of array start point with reference to the coordinate system having its origin at the substrate center m = Number of array points along the X direction (towards the right) p = Pitch (in microns) between adjacent array points along the X direction (towards the right) y = Y-coordinate of array start point with reference to the coordinate system having its origin at the substrate center n = Number of array points along the Y direction (towards the bottom) q = Pitch (in microns) between adjacent array points along the Y direction (towards the bottom) 5. ASSIGN P(1) -> ((*,*),SHOT1) This commands assigns P(1) which is pattern one to all x,y locations (*,*) in the array (defined by the previous line). SHOT1 defines shot modulation to be applied to the different data types in P(1). 6. AEND End of the ARRAY command. 7. PEND End of the PATH command. 8. LAYER 1 Specifies the beginning of Layer 1. The nominal base dose is later associated with each Layer in the.sdf file. Shot rank modulation percentage is referenced to base dose. 9. P( 1 ) 'rm.v30' Defines pattern one, P(1), to be rm.v30. 10/6/2014, Revision 2 page 3/7

4 10. SPPRM 4.0,,,,1.0,1 The SPPRM command specifies shot-partition parameters for each writing chip pattern. The SPPRM command has the format: SPPRM m1, m2, w, p, sc, ss m1 = defines one side (in microns) of the square area to be written by the sub deflector. default and maximum is 4. m2 = this parameter is left blank as it is the square of m1 w = this parameter is left blank as it has no application for the JBX-9300FS p = this parameter is left blank as it has no application for the JBX-9300FS sc = specifies the magnification or reduction ratio of scaling for pattern writing ss = Specifies the shift amount for the sub deflector scanning area when shot-shift writing is performed. when ss = 1, no shift occurs. when ss = 2, the initial sub fields are written with half the dose, then the sub fields are shifted by half the scan width and is exposed with half the dose. 11. STDCUR 0.1;100pA STDCUR defines the beam current to be used in units of na. 0.1 stands for 0.1nA or 100pA. ;100pA is a comment. 12. SHOT1: MODULAT ((0,-10),(1,0),(2,10),(3,20),(4,50),(5,100)) This command defines the shot modulation for the applicable pattern as used in the ARRAY command. (0,-10) means that data type = 0, receives the base dose -10%. For example, if the base dose is 800uC/cm 2, then data type = 0 would receive a total dose of 720uC/cm 2. (1,0) means that data type = 1, receives the base dose +0%. For example, if the base dose is 800uC/cm 2, then data type = 1 would receive just the base dose. (5,100) means that data type = 5, receives the base dose +100%. For example, if the base dose is 800uC/cm 2, then data type = 1 would receive 1600uC/cm END This command ends the job deck file. 10/6/2014, Revision 2 page 4/7

5 Layout of the hsq.jdf file P(1) P(2) 10/6/2014, Revision 2 page 5/7

6 Example Schedule file hsq.sdf MAGAZIN 'HSQ' #1 %3C JDF 'hsq',1 ACC 100 CALPRM '100kv_100pa_jeol' DEFMODE 2 ;2_stage deflection RESIST 800 SHOT A,2 OFFSET (0,2000) END 1 The.sdf file above will now be explained, line by line. 1. MAGAZIN 'HSQ' This command defines the beginning of the schedule file. It is convenient to keep the name of the.jdf, JOB,.sdf, and MAGAZIN to all be the same. 2. #1 This command specifies the beginning of a cassette block and the substrates to be used for pattern writing. 3. %3C 3 specifies that either a 3 wafer cassette or the piece cassette is to be used. C defines that window C in the 3 wafer cassette or the piece cassette is to be used. 4. JDF 'hsq',1 hsq specifies that the job deck file hsq.jdf is to be used. 1 specifies that all subsequent statements refer to Layer 1 of the.jdf file. 5. ACC 100 This specifies that the accelerating voltage is 100kV. 6. CALPRM '100kv_100pa_jeol' This specifies that the calibration parameters associated with the calibration file 100kv_100pa_jeol. Furthermore, the naming convention of the calibration file lets the user know it is for use with 100kV accelerating voltage and 100pA beam current. 10/6/2014, Revision 2 page 6/7

7 7. DEFMODE 2 This specifies the e-beam deflection stage(s) using a number (1 for single-stage or 2 for double-stage) for pattern writing. The single-stage e-beam deflection can perform more-accurate pattern writing, while the double-stage e-beam deflection can perform pattern writing in a shorter time. 8. RESIST 800 Defines the base dose applied to the resist, in this case 800uC/cm SHOT A,2 A specifies that the shot time is to be automatically determined from the sensitivity of the resist and the amount of beam current for writing. 2 specifies that the shot pitch is 2nm. 10. OFFSET (0,2000) This command specifies that all patterns as defined in the Job Deck File will be offset in the X direction by 0 microns and offset in the Y direction by 2000 microns (towards the top of the wafer.) 11. END 1 This command signifies the end of the schedule file. 10/6/2014, Revision 2 page 7/7

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