Transient Voltage Suppressor. Operating Temperature : -55 to Storage Temperature : -55 to + 150
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- Egbert Lamb
- 5 years ago
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1 Operating Temperature : -55 to Storage Temperature : -55 to Packaging Method : Tape & Reel(per Specifications) Features: Full compliance on : IEC (ESD) ±15kV (air) ± 8kV (contact) IEC (EFT) 40A 5/50ns IEC (Lightning) 8/20μs Low voltage operation : first in the industry with the V operating level ESD Protection. Off-State as low as 1.0 Pf Broad micro-packaging platform options (leaded or leadless) offering flexibility to customer with general and custom needs High level of integration and functionality All products are RoHS directive compliant Part Number N 05 1 AD 52 (1) (2) (3) (4) (5) (1)N: Normal (2)05: 5V (3)1: 1-Line (4)AD: SOD (5)52: SOD-523 ELECTRIACL CHARACTERISTICS Raiongs at 25 ambient temperature unless otherwise specified. Characteristics Symbol Minimum Typical Maximum Unit Reverse Stand-off Voltage VRWM 5 V Reverse Breakdown Voltage (It=mA) VBR 6 V Reverse Leakage Current (VRWM=5V,T=25 ) IR 5 μa Forward Voltage (IF=10mA) VF 0.8 V Clamping Voltage (Ipp=5A, tp=8/20μs) VC 9.5 V Clamping Voltage (Ipp=16A,tP=8/20μs) VC 12.5 V Junction (VR=0V,f=1MHz) Ci 150 pf
2 Storage Temperature : -55 to Packaging Method : Tape & Reel(per Specifications) Features: Full compliance on : IEC (ESD) ±15kV (air) ± 8kV (contact) IEC (EFT) 40A 5/50ns IEC (Lightning) 8/20μs Low voltage operation : first in the industry with the V operating level ESD Protection. Off-State as low as 1.0 pf Broad micro-packaging platform options (leaded or leadless) offering flexibility to customer with general and custom needs High level of integration and functionality All products are RoHS directive compliant APPLICATION General-purpose downstream ESD protection high frequency analog signals and high-speed serial date transmission for ports inside : PC-/Notebook USB2.0/IEEE1394 Ports Cellular phone and PCS mobile handsets DVI interfaces Cordless telephones Wireless date (WAN/LAN) systems PDAs Part Number L 05 4 B T 2 6 (1) (2) (3) (4) (5) (6) (1)L: Low pf (2)05: 5V (3)4: 4-Line (4)BT: (5)2: USB (6)6: 6 pin ELECTRICAL CHARACTERISTICS T C =25 unless otherwise specified PARAMETER TEST CONDITIONS SUMBO MIN TYP MAX UNIT Pin capacitance to ground, Pins 1,3,4,6 Diode reverse leakage current, Pins 1,3,4,6 to ground Zener diode capacitance to ground, Pin 5 to 2 Zener diode breakdown voltage, Pin 5 to 2 Vdc = 0V ; f = 1MHz Pin 5 = + 3.0V CVO pf V = +3.0V Ilkg na Vdc = 0V ; f = 1MHz Pin 5 = + 3.0V Czener pf I=1mA VBRVO 6-9 V Forward voltage VF V
3 Operating Temperature : -55 to Storage Temperature : -55 to Packaging Method : Tape & Reel(per Specifications) Features: Full compliance on : IEC (ESD) ±15kV (air) ± 8kV (contact) IEC (EFT) 40A 5/50ns IEC (Lightning) 8/20μs Low voltage operation : first in the industry with the V operating level ESD Protection. Off-State as low as 1.0 Pf Broad micro-packaging platform options (leaded or leadless) offering flexibility to customer with general and custom needs High level of integration and functionality All products are RoHS directive compliant APPLICATION Cordless phones Cellular phones & accessories Audio/Video inputs Portable electronics (Digital Cameras, MP3 Players, ect.) Networks Part Number N 05 5 AT 56 (1) (2) (3) (4) (5) (1)N: Normal (2)05: 5V (3)5: 5-Line (4)AT: SOT (5)56: ELECTRICAL CHARACTERISTICS PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNIT Reverse Breakdown Voltage VBR It=1mA V Clamping Voltage VC IPP=1A V Maximum Peak Pulse Current IPP tp= 8/20μs A Reverse Leakage Current IR VRWM = 5V μa Diode Capactiance CD VR = 0V,f = 1MHz pf Differential Resistance rdiff Ir=1mA Ohms
4 Storage Temperature : -55 to Packaging Method : Tape & Reel(per Specifications) Features: Full compliance on : IEC (ESD) ±15kV (air) ± 8kV (contact) IEC (EFT) 40A 5/50ns IEC (Lightning) 8/20μs Low voltage operation : first in the industry with the V operating level ESD Protection. Off-State as low as 1.0 Pf Broad micro-packaging platform options (leaded or leadless) offering flexibility to customer with general and custom needs High level of integration and functionality All products are RoHS directive compliant Part Number UL 05 2 AT 52 (1) (2) (3) (4) (5) (1)UL: Ulira low (2)05: 5V (3)2: 2-Line (4)AT: SOT (5)52: SOT-523 ELECTRICAL CHARACTERISTICS PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNIT Zener Voltage VZ IZ =5mA V Reverse Current IR VR = 2.5V μa Operating Resistance ZZ IZ =5mA Ω Rising Operating Resistance ZZK IZ =0.5mA Ω Capactiance Between Terminals CT f =1MHz, VR =5V pf
5 Storage Temperature : -55 to Packaging Method : Tape & Reel(per Specifications) Features: Full compliance on : IEC (ESD) ±15kV (air) ± 8kV (contact) IEC (EFT) 40A 5/50ns IEC (Lightning) 8/20μs Low voltage operation : first in the industry with the V operating level ESD Protection. Off-State as low as 1.0 Pf Broad micro-packaging platform options (leaded or leadless) offering flexibility to customer with general and custom needs High level of integration and functionality APPLICATION RS-232,RS-423 data lines Cellular phone terminals Audio/Video inputs Portable electronics Networks Part Number N 05 2 AT 23 (1) (2) (3) (4) (5) (1) N: Normal (2) 05: 5V (3) 2: 2-Line (4) AT: SOT (5) 23: SOT-23 ELECTRICAL CHARACTERISTICS PART NUMBER MARKING CODE REVERSE STAND-OFF VOLTAGE Min 1mA Max. IPP = 1A Max Peak Pulse Current2 Leakage 0V,1MHz Pin 1MHz Pin 1-3 & 2-3 VRWM BV(min) VC(typ.) IPP IR Cj (max.) Cj Volts Volts Volts Amps μa pf pf ND02AT23 T
6 DM Series DEVICE RATINGS AND SPECIFICATIONS Part Number Continuous Working Voltage Breakdown 1 ma (DC) Test Current Max. Clamping Voltage At Specified Current (8/20μs) 1 MHz Typical Inductance VM(DC) VN(DC) VC C L (V) (V) (V) (pf) (nh) EPD02S3R3DM271PT 3.3V 4.5~6.0V 9.5V@1A 250~ EPD02S5R5DM301PT 5.5V 7.8~9.8V 15.0V@1A 280~ EPD02S120DM191PT 12.0V 15.0~18.0V 24.0V@1A 170~ EPD03S5R5DM651PT 5.5V 7.8~9.8V 15.0V@1A 570~ EPD03S120DM311PT 12.0V 15.0~18.0V 24.0V@1A 270~ N Series DEVICE RATINGS AND SPECIFICATIONS Part Number Continuous Working Voltage Breakdown 1 ma (DC) Test Current Max. Clamping Voltage At Specified Current (8/20μs) 1 MHz Typical Inductance VM(DC) VN(DC) VC C L (V) (V) (V) (pf) (nh) EPD02S030N271PT 3.3V 4.5~6.0V 10.5V@1A 250~ EPD02S050N161PT 5.5V 8.0~11.0V 19.0V@1A 140~ EPD02S120N121PT 12.0V 16.0~19.0V 27.5V@1A 100~ EPD02S180N850PT 18.0V 23.0~28.0V 40.5V@1A 80~ EPD03S030N701PT 3.3V 4.5~6.0V 10.5V@1A 630~ EPD03S050N651PT 5.5V 8.0~11.0V 17.0V@1A 570~ EPD03S120N311PT 12.0V 16.0~19.0V 27.5V@1A 270~ EPD03S180N231PT 18.0V 23.0~28.0V 40.5V@1A 200~ H Series DEVICE RATINGS AND SPECIFICATIONS Part Number Continuous Working Voltage Breakdown 1 ma (DC) Test Current Max. Clamping Voltage At Specified Current (8/20μs) 1 MHz Typical Inductance VM(DC) VN(DC) VC C L (V) (V) (V) (pf) (nh) EPD02S180H300PT 2~18 22~32 50V@1A EPD02S180H200PT 2~18 22~32 50V@1A EPD02S180H100PT 2~18 22~32 55V@1A EPD02S180H050PT 2~18 45~60 100V@1A EPD02S180H020PT 2~18 320~ V@1A EPD03S180H300PT 2~18 22~32 50V@1A EPD03S180H200PT 2~18 22~32 50V@1A EPD03S180H100PT 2~18 22~32 55V@1A EPD03S180H050PT 2~18 45~60 100V@1A EPD03S180H020PT 2~18 360~ V@1A 2 1.0
7 ESD, EFT, Surge Suppressor & EMI / RFI Filter 0402 DM Series Specifications Packaging Tape and Reel T 7 inch reel (10,000 pcs.) Material Body:Semiconducting Ceramic Terminals: Ni/Sn plated (code P ) Operating Temperature -40 to +85 (without derating) Solderability sec ( IEC ) Soldering Heat Resistance sec (IEC ) Response Time <0.5ns Temperature coefficient(αv ) of clamping voltage specified test current <0.01%/ Power dissipation 0.05W max Withstand ESD durability test severity of IEC Level 4: Contact discharge mode ; typical 8KV,max 20KV Air discharge mode ; typical 15KV,max 30KV Standards IEC IEC IEC IEC continuous Breakdown voltage at Max. clamping voltage Typ. Type working voltage 1mA(DC) test current at spec. current (8/20μs) 1MHz VM(DC) (V) VN(DC) (V) VC (V@A) Ctyp. (pf) EPD02S3R3DM271PT ~ @ ~ EPD02S5R5DM301PT ~ @ ~ EPD02S120DM191PT ~ @ ~ How to order Typical Inductance Ltyp. (nh) PD 02 S 3R3 DM 271 P T Type code PolyDiode Chip Size 02 = EIA0402 Single Chip Working voltage 3R3 = 3.3VDC Diode-mode application 271= 27 10¹ 201= 20 10¹ Termination P: Electroplating by Ni/Sn Packing T: Tape&Reel B: Bulk
8 ESD Protection of High Speed Signal Lines 0402 H Series Specifications Packaging Tape and Reel T 7 inch reel (10,000 pcs.) Material Body:Semiconducting Ceramic Terminals: Ni/Sn plated (code P ) Operating Temperature -40 to +85 (without derating) Solderability sec ( IEC ) Soldering Heat Resistance sec (IEC ) Response Time <0.5ns Temperature coefficient(αv ) of clamping voltage specified test current <0.01%/ Power dissipation 0.05W max Withstand ESD durability test severity of IEC Level 4: Contact discharge mode ; typical 8KV,max 20KV Air discharge mode ; typical 15KV,max 30KV Standards IEC IEC IEC Type continuous working voltage VM(DC) (V) Breakdown voltage at Max. clamping voltage 1mA(DC) test current at spec. current (8/20μs) VN(DC) (V) VC (V@A) Typ. 1MHz Typical Inductance Ltyp. Ctyp. (pf) EPD02S180H300PT 2~18 22 ~ 32 50@ EPD02S180H200PT 2~18 22 ~ 32 50@ EPD02S180H100PT 2~18 22 ~ 32 55@ EPD02S180H050PT 2~18 45 ~ @ EPD02S180H020CT 2~ ~ @ (nh) How to order PD 02 S 180 H 300 P T Type code PolyDiode Chip Size 02 = EIA0402 Single Chip Working voltage 180 = 2~18VDC High-speed signal line application 300= = Termination P: Electroplating by Ni/Sn Packing T: Tape&Reel B: Bulk
9 ESD EFT Surge Suppressor & EMI/RFI Filter 0402 N Series Specifications Packaging Tape and Reel T 7 inch reel (10,000 pcs.) Material Body:Semiconducting Ceramic Terminals: Ni/Sn plated (code P ) Operating Temperature -40 to +85 (without derating) Solderability sec ( IEC ) Soldering Heat Resistance sec (IEC ) Response Time <0.5ns Temperature coefficient(αv ) of clamping voltage specified test current <0.01%/ Power dissipation 0.05W max Withstand ESD durability test severity of IEC Level 4: Contact discharge mode ; typical 8KV,max 20KV Air discharge mode ; typical 15KV,max 30KV Standards IEC IEC IEC IEC continuous Breakdown voltage at Max. clamping voltage Typ. Typical Inductance Type working voltage VM(DC) 1mA(DC) test current at spec. current (8/20μs) Ltyp (V) VN(DC) (V) VC (V@A) 1MHzCtyp. (pf). (nh) EPD02S030N271PT ~ @ ~ EPD02S050N161PT ~ @ ~ EPD02S120N121PT ~ @ ~ EPD02S180N850PT ~ @ 1 80 ~ How to order PD 02 S 030 N 271 P T Type code PolyDiode Chip Size 02 = EIA0402 Single Chip Working voltage 030 = 3.3VDC Normal application 271= 27 10¹ 161=16 10¹ Termination P: Electroplating by Ni/Sn Packing T: Tape&Reel B: Bulk
10 ESD EFT Surge Suppressor & EMI/RFI Filter 0603 DM Series Specifications Packaging Tape and Reel T 7 inch reel (4,000 pcs.) Material Body: Semiconducting Ceramic Terminals: Ni/Sn plated (code P ) Operating Temperature -40 to +85 (without derating) Solderability sec ( IEC ) Soldering Heat Resistance sec. (IEC ) Response Time <0.5ns Temperature coefficient(αv ) of clamping voltage specified test current <0.01%/ Power dissipation 0.05W max. Power dissipation 0.05W max Withstand ESD durability test severity of IEC Level 4: Contact discharge mode ; typical 8KV,max 20KV Air discharge mode ; typical 15KV,max 30KV Standards IEC IEC IEC IEC Type continuous working voltage VM(DC) (V) Breakdown voltage at 1mA(DC) test current VN(DC) (V) Max. clamping voltage at spec. current (8/20μs) VC (V@A) Typ. 1MHz Ctyp. (pf) Typical Inductance Ltyp. (nh) EPD03S5R5DM651PT ~ @ ~ EPD03S120DM311PT ~ ~ How to order PD 03 S 5R5 DM 651 P T Type code Chip Size Termination Packing PolyDiode Single Chip Working voltage Diode-mode T: Tape&Reel B: 03 = EIA0603 5R5 = 5.5VDC application 651= 65 10¹ P: Electroplating Bulk by Ni/Sn
11 ESD Protection of High Speed Signal Lines 0603 H Series Specifications Packaging Tape and Reel T 7 inch reel (4,000 pcs.) Material Body: Semiconducting Ceramic Terminals: Ni/Sn plated (code P ) Operating Temperature -40 to +85 (without derating) Solderability sec ( IEC ) Soldering Heat Resistance sec. (IEC ) Response Time <0.5ns Temperature coefficient(αv ) of clamping voltage specified test current <0.01%/ Power dissipation 0. 05W max. Power dissipation 0.05W max Withstand ESD durability test severity of IEC Level 4: Contact discharge mode ; typical 8KV,max 20KV Air discharge mode ; typical 15KV,max 30KV Standards IEC IEC IEC Type continuous working voltage VM(DC) (V) Breakdown voltage at 1mA(DC) test current VN(DC) (V) Max. clamping voltage at spec. current (8/20μs) VC (V@A) Typ. 1MHz Ctyp. (pf) Typical Inductance Ltyp. (nh) EPD03S180H300PT 2~18 22 ~ 32 50@ EPD03S180H200PT 2~18 22 ~ 32 50@ EPD03S180H100PT 2~18 22 ~ 32 55@ EPD03S180H050PT 2~18 45 ~ @ EPD03S180H020PT 2~ ~ @ How to order PD 03 S 180 H 300 P T Type code PolyDiode Chip Size 03 = EIA0603 Single Chip Working voltage 180 = 2~18VDC High-speed Signal line application 300= = Termination P: Electroplating by Ni/Sn Packing T: Tape&Reel B: Bulk
12 ESD Protection of High Speed Signal Lines 0603 N Series Specifications Packaging Tape and Reel T 7 inch reel (4,000 pcs.) Material Body: Semiconducting Ceramic Terminals: Ni/Sn plated (code P ) Operating Temperature -40 to +85 (without derating) Solderability sec ( IEC ) Soldering Heat Resistance sec. (IEC ) Response Time <0.5ns Temperature coefficient(αv ) of clamping voltage specified test current <0.01%/ Power dissipation 0.05W max. Power dissipation 0.05W max Withstand ESD durability test severity of IEC Level 4: Contact discharge mode ; typical 8KV,max 20KV Air discharge mode ; typical 15KV,max 30KV Standards IEC IEC IEC IEC Type continuous working voltage VM(DC) (V) Breakdown voltage at 1mA(DC) test current VN(DC) (V) Max. clamping voltage at spec. current (8/20μs) VC (V@A) Typ. 1MHz Ctyp. (pf) Typical Inductance Ltyp. (nh) EPD03S030N701PT ~ @ ~ EPD03S050N651PT ~ @ ~ EPD03S120N311PT ~ @ ~ EPD03S180N231PT ~ @ ~ How to order PD 03 S 030 N 701 P T Type code PolyDiode Chip Size 03 = EIA0603 Single Chip Working voltage 030 = 3.3VDC Normal application 701= 70 10¹ 231= 23 10¹ Termination P: Electroplating by Ni/Sn Packing T: Tape&Reel B: Bulk
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