MultiPrep System. Fixture Catalog E. Pacifica Place Rancho Dominguez, CA /09, Version 6

Transcription

1 MultiPrep System Fixture Catalog 2376 E. Pacifica Place Rancho Dominguez, CA /09, Version 6 Allied s designs occasionally change and may differ from the rendering and specifications in this catalog. Please contact your Product Application Specialist or Allied Customer Service for the latest updates and information.

2 MultiPrep Systems The MultiPrep System enables precise semiautomatic sample preparation of a wide range of materials for microscopic (optical, SEM, TEM, AFM, etc.) evaluation. Capabilities include parallel polishing, precise angle polishing, site-specific polishing or any combination thereof. It provides reproducible sample results by eliminating inconsistencies between users, regardless of their skill. The MultiPrep eliminates the need for hand-held polishing jigs, and ensures that only the sample makes contact with the abrasive. It maintains geometric orientation of the sample relative to the abrasive plane during polishing, allowing quantification of material removal; rate of polish can be monitored, and total amount removed can be pre-set. The TechPrep polishing machine provides the power supply necessary to operate the MultiPrep positioning device, and features a control panel used to activate the MultiPrep s functions. Platen rotation speeds range from 5 to 350 RPM, in either clockwise or counterclockwise direction. Touch-pad switches control all functions, with a numerical keypad to program platen speed, timer, oscillation and rotation settings. The system uses water as the standard coolant; however, automatic drip or dosing systems are available to apply abrasive suspensions and/or lubricants. MultiPrep System, 8" MultiPrep System, 12" Item Description Item Description MultiPrep System, 8", 115 V MultiPrep System, 8", 230 V GI MultiPrep System, 8" with Gear- Driven Spindle, 115 V GI-230 MultiPrep System, 8" with Gear- Driven Spindle, 230 V Includes: # (-230) TechPrep Polishing Machine, # " Aluminum Platen, Splash Ring and Platen Cover; # MultiPrep, # 15-INDICATOR Rear Digital Indicator, # Parallel Polishing Fixture, # Dial Indicator Calibration Kit, and Accessory Case; # Diamond Lapping Film Assortment Pack, # Red Final C Polishing Cloth, 8", # Micron Colloidal Silica Suspension, 16 oz. and MultiPrep Procedures CD MultiPrep System, 8" Specifications: Dimensions: 15" W x 26" D x 20" H (381 x 660 x 508 mm) Weight: 125 lb. (57 kg) MultiPrep System, 12", with Gear-Driven Spindle, 115 V MultiPrep System, 12", with Gear-Driven Spindle, 230 V Includes: # (-230) TechPrep Polishing Machine, # " Aluminum Platen, Splash Ring and Platen Cover; # MultiPrep Positioning Device with Gear Driven Spindle, # Parallel Polishing Fixture, # Dial Indicator Calibration Kit, # 15-INDICATOR Rear Digital Indicator, Accessory Case and MultiPrep Procedures CD MultiPrep System, 12" Specifications: Dimensions: 22" W x 26" D x 21" H (560 x 660 x 535 mm) Weight: 165 lb. (75 kg) Accessories: " (203 mm) Aluminum Platen " (305 mm) Aluminum Platen

3 Cam-lock adapter body. Essential for use with # and # Cross- Section Paddles. Extends the paddles into proper position on the platen for optimum results Cross-Sectioning Paddle with removable 3.1mm SEM Adapter Pin. For use with # adapter. Features a 0.4 thread for interface with Hitachi SEM RE Reference Edge Cross-Section Paddle. Features a vertical reference edge for mounting IC Die should the cleaved or cut edge be parallel/perpendicular to circuit geometry. Provides improved alignment to the cross-section plane. 3

4 TEM Wedge/FIB Thinning Paddle with Pyrex Insert. Pyrex allows the use of transmitted light so it may pass through when the sample becomes electron transparent (silicon). Planarization makes mounting surface parallel with the platen. Pyrex measures 3 x 5 mm on bottom surface. 1/ SIMS/Backside Pyrex Holder for Sample Thinning. Recommended for SIMS or other parallel polishing applications to thin small regions/samples. Pyrex allows the use of transmitted light so it may pass through when the sample becomes electron transparent (silicon). Planarization makes mounting surface parallel with the platen. 4

5 Parallel Polishing Fixture, 2.25" (57 mm) Diameter x.500", Thick Stainless Steel. Stainless steel resists corrosion and is heat-treated to resist warpage from multiple heat cycles used in heating/ melting wax to secure samples. For delayering IC s, double sided tape can also be used (#69-TAPE) Parallel Polishing Fixture, 3" (80 mm) Diameter, Stainless Steel Parallel Polishing Fixture, 4" (100 mm) Diameter, Stainless Steel. 5

6 Mount Holder, 1-1½" Diameter Capacity, stainless steel Weight kit. Includes (3) U-shaped weights for positioning above the spindle between the dial indicator and pulley. Remove dial indicator for using rod & weights Multi-Purpose Sample Fixture, 2.00" W x 1.00" H x.75" D pocket. Also used with TechCut 5 Precision Sectioning Machine, for sectioning, then polishing without removing sample from fixture. 6

7 Multi-Purpose Sample Fixture, 2.00" W x 1.00" H x.75" D pocket, with diagonal orientation Multi-Purpose Sample Fixture, 1" W x.400" H x.450" D pocket Multi-Purpose Sample Fixture, 1" W x.400" H x.450" D pocket, with diagonal orientation. 7

8 Cross-Sectioning Paddle, Clamp Style,.630" W x.100" H x.250" D pocket. Used to secure samples that cannot withstand heat (wax technique), or for faster sample processing. Topside microscopic observation requires 12 mm working distance Cross-Sectioning Paddle, Clamp Style,.630" W x.100" H x.250" D pocket, diagonal orientation. Used to secure samples that cannot withstand heat (wax technique), or for faster sample processing. Topside microscopic observation requires 12 mm working distance. 8

9 FIBER OPTIC FIXTURES Fixture, Four (4) Position V-Groove, reversible, 6 mm thick. Used to hold capillaries and other rods up to 5 mm in diameter. Fixture can be flipped 180 to polish both sample ends without having to re-position the sample Waveguide fixture, 2- position, reversible, for up to 1" wide devices. Fixture can be flipped 180 to polish both sample ends without having to re-position the sample Pigtail connector fixture. Support bar holds pigtail cables attached to connectors. Six (6).062" diameter positions,.375" thick. Secured by nylon tipped set screws. 9

10 Waveguide Fixture, 2-Position 2-Deep, reversing, for 8 mm wide devices at 90. Fixture can be flipped 180 to polish both sample ends without having to re-position the sample Waveguide polishing fixture. Two (2) 19 mm wide pockets x.375" thick. Fixture can be flipped 180 to polish both sample ends without having to re-position the sample Waveguide polishing fixture. Two (2) 19 mm wide pockets x.375" thick. Fixtures can be flipped 180 to polish both sides of sample without having to re-position the samples. 10

11 Paddle, Aluminum with 3.1 mm pin and reference edge, 14 mm tall x 0.625" wide. Stage is supplied to stabilize the fixture when placed onto the hot plate to heat/melt wax for mounting Fiber Array Fixture. Two (2) 20 mm wide pockets x 7.62 mm deep, 0. Features reference edge to stabilize fiber array during polishing Fiber Array Fixture. Two (2) 20 mm wide pockets x 7.62 mm deep, 8. Features reference edge to stabilize fiber array during polishing. 11

12 Additional MultiPrep Options #15-INDICATOR The Rear Digital Indicator displays vertical movement (+/-) of the arm in 1-micron increments. As material is being removed from a sample during the polishing process, the display remains static (unchanged). It enables the user to make accurate measurements when removing material. The Front Digital Indicator displays real-time material removal/sample advancement, 1-micron resolution. Instead of relying on the scale wrapped around the vertical adjustment knob, the digital dial indicator will enable the user to more precisely position the arm when polishing samples. It is highly recommended for backside thinning applications, TEM and Pre-FIB preparation. It is also excellent for cross-sectioning. Gear Drive The optional gear drive mechanism can be ordered with a new machine (# GI) or at a later time as a retrofit option (#15-GEARDRIVE). Instead of the O-ring drive system, the gear drive provides improved torque for grinding and polishing larger samples where additional weight/pressure is needed. 12

13 The MultiPrep Accessories Fixture Case #15-ACMPF consists of: _(1) # Cam-Lock Adapter _(6) # Cross-Sectioning Paddle _(2) # TEM Wedge/FIB Thinning Paddle _(1) # TEM/FIB Thinning Fixture _(4) # Parallel Polishing Fixture, 2¼ diameter _(1) # Mount Holder, 1½ diameter capacity _(1) # Weight Kit _(1) # Multi-Purpose Sample Fixture _(1) # Calibration Mirror 13

14 Diamond Lapping Film Diamond Lapping Film consists of precision graded diamond particles resin bonded to a flat, uniform polyester film backing. It provides excellent edge retention and maintains coplanarity regardless of varying materials or hardness within the sample.typically it is used for unencapsulated cross-sectioning, TEM wedge/plan-view polishing, backside polishing and FIB sample thinning. Allied s unique packaging allows for quick and easy identification of color-coded micron grades. SEM photo, 6 µm Diamond Lapping Film (150X) SEM photo, 6 µm Diamond Lapping Film Type B (150X) Type B Discs (Pk/5) Diamond Lapping Film Type B has diamond particles contained in ceramic beads which are then resin bonded to the film. As the beads wear away, new diamond particles are exposed to allow continuous, aggressive material removal. Type B film is longer lasting and provides a coarser finish grade-for-grade compared with regular diamond lapping film. Micron 8 " 8 " 12 " (µm) Plain Back Adhesive Back Adhesive Back B B B B B B B B B B B B B B B 8 " (203 mm) Discs (Pk/5) Plain Back Micron (µm) Adhesive Back Assortment (1 each µm, Pk/8) Diamond Lapping Film Storage Book Chemically pure lintless blotting paper. Dries lapping film without staining or scratching. Wax paper separates each blotter. Item Description Diamond Lapping Film Storage Book

15 30 100X (20 seconds) X (20 seconds) 9 100X (20 seconds) 6 100X (20 seconds) 30 µm 15 µm 9 µm Diamond Lapping Film surface 6 µm finishes 3 µm on an IC die cross-section 1 µm 0.5 µm 0.1 µm 3 100X (20 seconds) 1 500X (20 seconds) 0.5 1,000X (20 seconds) 0.1 1,000X (20 seconds) Al 2 O 3 & SiC Lapping Film Lapping film consists of a mylar film coated with resin containing either aluminum oxide or silicon carbide abrasive. It is recommended for fine grinding and lapping applications where edge retention is important. Use aluminum oxide for ferrous metals and silicon carbide for non-ferrous metals and polymers. Features: Micron graded premium abrasives to produce precise finishes in grades 30 to 0.05 micron Precision backing for uniformity and planarity of sample Resists water, oil and most solvents Color-coded for quick identification 8 " (203 mm) Plain Back Discs (Pk/50) Micron (µm) Al 2 O 3 SiC Assortment (10 each micron size offered)

16 2376 East Pacifica Place, Rancho Dominguez, CA (800) (US & Canada) * (310) (Worldwide) * (310) FAX