PAA140STR. Dual Single-Pole, Normally Open OptoMOS Relays INTEGRATED CIRCUITS DIVISION

Transcription

1 Dual Single-Pole, Normally Open OptoMOS Relays Parameter Rating Units Load Voltage 4 V Load Current ma rms / ma DC On-Resistance (max 8 Features 37V rms Input/Output Isolation Low Drive Power Requirements High Reliability Arc-Free With No Snubbing Circuits No EMI/RFI Generation Small 8-Pin Package Flaability Rating UL 94 V- Tape & Reel Versions Available Applications Telecounications Telecom Switching Tip/Ring Circuits Modem Switching (Laptop, Notebook, Pocket Size Hook Switch Dial Pulsing Ground Start Ringing Injection Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas Medical Equipment-Patient/Equipment Isolation Security Aerospace Industrial Controls Description The is a 4V, ma, 8, dual normally open (1-Form-A relay. This high performance leader provides a high peak load voltage handling capability combined with a very low on-resistance for specialized applications. Approvals UL Recognized Component: File E7627 CSA Certified Component: Certificate EN/IEC 69-1 Certified Component: Certificate available on our website Ordering Information Part # P PTR S STR Pin Configuration 1 + Control - Switch #1 2 Control - Switch #1 3 + Control - Switch #2 4 Control - Switch #2 Description 8-Lead DIP (/tube 8-Lead Flatpack (/tube 8-PLead Flatpack (/Reel 8-Lead Surface Mount (/tube 8-Lead Surface Mount (/Reel 8 Load - Switch #1 7 Load - Switch #1 6 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Open Devices Form-A 9% % I LOAD t on t off DS-- 1

2 Absolute Maximum 2ºC Parameter Ratings Units Blocking Voltage 4 V P Reverse Input Voltage V Input Control Current ma Peak (ms 1 A Input Power Dissipation 1 mw Total Power Dissipation 2 8 mw Isolation Voltage, Input to Output 37 V rms Operational Temperature -4 to +8 C Storage Temperature -4 to +12 C 1 Derate linearly 1.33 mw / ºC 2 Derate linearly 6.67 mw / ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +2 C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical 2ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous * - I L - - ma rms / ma DC Peak t=ms I LPK - - ± ma P On-Resistance I L =ma R ON Off-State Leakage Current V L =4V P I LEAK µa Switching Speeds Turn-On t =ma, V L =V on Turn-Off t off ms Input Characteristics Input Control Current to Activate I L =ma - - ma Input Control Current to Deactivate ma Input Voltage Drop =ma V F V Reverse Input Current V R =V I R - - µa Coon Characteristics Capacitance Input to Output V IO =V, f=1mhz C IO pf *NOTE: If both poles operate simultaneously, then load current must be derated so that the package power dissipation value is not exceeded. 2

3 PERFORMANCE DATA* 3 Typical LED Forward Voltage Drop (N=, =ma 2 Typical Turn-On Time (N=, =ma, I L =ma DC 2 Typical Turn-Off Time (N=, =ma, I L =ma DC Device Count (N Device Count (N 1 Device Count (N LED Forward Voltage Drop (V Turn-On Time (ms Turn-Off Time (ms 2 Typical for Switch Operation (N=, I L =ma DC 2 Typical for Switch Dropout (N=, I L =ma DC 3 Typical On-Resistance Distribution (N=, =ma, I L =ma DC Device Count (N 1 Device Count (N 1 Device Count (N LED Current (ma LED Current (ma On-Resistance ( Device Count (N Typical Blocking Voltage Distribution (N= Blocking Voltage (V P LED Forward Voltage Drop (V Typical LED Forward Voltage Drop 1.4 I 1.2 F =ma =3mA =ma 1. =ma =ma Temperature (ºC Turn-On Time (ms Typical Turn-On Time vs. LED Forward Current =ma DC LED Forward Current (ma Turn-Off Time (ms Typical Turn-Off Time vs. LED Forward Current =ma DC LED Forward Current (ma *Unless otherwise noted, data presented in these graphs is typical of device operation at 2ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. 3

4 PERFORMANCE DATA* 2. Typical Turn-On Time =ma DC.7 Typical Turn-Off Time ( =ma, I L =ma DC Typical On-Resistance ( =ma, I L =ma DC Turn-On Time (ms = ma = ma = ma Turn-Off Time (ms On-Resistance ( Temperature (ºC Temperature (ºC Temperature (ºC LED Current (ma Typical for Switch Operation =ma DC Temperature (ºC LED Current (ma Typical for Switch Dropout =ma DC Temperature (ºC Typical Load Current vs. Load Voltage ( =ma Load Voltage (V Load Current (ma 3 Maximum Load Current 48 Typical Blocking Voltage.12 Typical Leakage Measured Across Pins &6 or 7&8 Load Current (ma 3 = ma = ma = ma Blocking Voltage (V P Leakage ( A Temperature (ºC Temperature (ºC Temperature (ºC 1.2 Energy Rating Curve 1. Load Current (A s s 1ms ms ms 1s s s Time *Unless otherwise noted, data presented in these graphs is typical of device operation at 2ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4

5 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-33. Device Moisture Sensitivity Level (MSL Classification / S / P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-62. Soldering Profile Provided in the table below is the Classification Temperature (T C of this product and the maximum dwell time the body temperature of this device may be (T C - ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD- must be observed. Board Wash Device Classification Temperature (T c Dwell Time (t p Max Reflow Cycles ºC 3 seconds 1 S ºC 3 seconds 3 P 26ºC 3 seconds 3 IXYS Integrated Circuits recoends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler. Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.

6 Mechanical 2.4 ±.127 (. ±. 6.3 ±.127 (. ± ±.381 (.38 ± ±.24 (.3 ± ±.8 (.36 ± DIA. (8-.31 DIA. PCB Hole Pattern 2.4 ±.127 (. ±. Pin 1.47 ±.76 (.18 ± TYP ( ±.1 (.13 ± TYP. ( ±.127 (. ±. 7.6 ±.127 (.3 ±. 7.6 ±.127 (.3 ±..813 ±.2 (.32 ±.4 (inches S 2.4 ±.127 (. ± ±.381 (.38 ± ±.1 (.13 ±.2.63 ±.127 (.2 ±. PCB Land Pattern 2.4 (. 6.3 ±.127 (. ±. Pin ±.127 (.17 ±. 9.2 ±.24 (.37 ±. 7.6 ±.24 (.3 ±..47 ±.76 (.18 ±.3.24 ±.127 (. ±. 1.6 ( ( ( ±.2 (.32 ±.4 (inches P 2.4 ±.127 (. ±. 6.3 ±.127 (. ±. Pin ±.127 (.37 ± ±.381 (.38 ± ±.2 (.8 ±.1 MIN /.2 MAX ( MIN /.4 MAX 7.6 ±.24 (.3 ±..3 ±.13 (.8 ± MAX. (.9 MAX..63 ±.127 (.2 ±. 1. (.6 PCB Land Pattern.6 ( (. 8.7 ( ±.76 (.18 ± ±.1 (.34 ±.4 (inches 6

7 STR Tape & Reel 33.2 DIA. (13. DIA. Top Cover Tape Thickness.2 MAX. (.4 MAX. Bo=.3 (.46 W=16. (.63 Embossed Carrier Embossment K =4.9 (.193 K 1 =4. (.16 Ao=.3 (.46 P1=12. (.472 User Direction of Feed (inches NOTES: 1. carry tolerances of EIA Standard Tape complies with all Notes for constant dimensions listed on page of EIA PTR Tape & Reel 33.2 DIA. (13. DIA. 2. ( (.17 Top Cover Tape Thickness.2 MAX. (.4 MAX. 7. (.29 W = 16. (.63 Bo =.3 (.46 Embossed Carrier K = 2.7 (.6 K 1 = 2. (.79 P1 = 12. (.472 User Direction of Feed Ao =.3 (.46 (inches Embossment NOTES: 1. All dimensions carry tolerances of EIA Standard The tape complies with all Notes for constant dimensions listed on page of EIA For additional information please visit our website at: IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-- Copyright 18, IXYS Integrated Circuits OptoMOS is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 6/27/18